I thought Samsung had already took over that fab?
I thought Samsung had already took over that fab?
Bad article translation. "02专项" is better translated as 02 special project and has existed since 2006. It's basically a term to refer to the series of projects with the broad long term goal of developing semiconductor technology. The goal in this specific case was the acceptance of the 193nm ArF Immersion DUV by 2021 with the benchmark being the ASML Twinscan NXT:2000i.TSMC use ASML 2000i to produce 7nm. Based on the failed 02 exam test, SMEE SSA800 probably can't even pass 1980Di. In my opinion, SSA 800 probably same level as 1970Ci which can produce 20nm at best.
"Semiconductor talent" is a broad term. Where China lags is manufacturing equipment and manufacturing process. That is the chokepoint. China needs a lot more people trained in basic sciences, such as physics, chemistry, mathematics, electrical and mechanical engineering, optics, and materials science, *NOT* chip design. But even after that, it will take years of practice and know-how to get the same level of talent that the West has, and by that time the West will have moved on to bigger and better. This is not an easy task at all and it requires a lot of people working overtime and a lot of patience. It essentially has to be treated as a wartime industry where you are already at war -- with that level of urgency.
We don't know, if they took ASML 2000i as a second benchmark that means they passed the first test, what would it be? the closest one will be ASML 1980di machine, good enough to make up to sub10nm nodes. There are several criteria to consider to determine the accuracy for certain nodes such as the accuracy of the wafer stage or overlay. The Numerical Aperture of the optic system.TSMC use ASML 2000i to produce 7nm. Based on the failed 02 exam test, SMEE SSA800 probably can't even pass 1980Di. In my opinion, SSA 800 probably same level as 1970Ci which can produce 20nm at best.
The standard for self sufficiency from Russia = capable of doing it with foreign tools like how they imported Toshiba machine toolsSo is 90nm where China has complete sufficiency? I remember Russia could fabricate chips down to 65nm, but anything lower would require ASML and TSMC.
No you are wrong. Sorry."Semiconductor talent" is a broad term. Where China lags is manufacturing equipment and manufacturing process. That is the chokepoint. China needs a lot more people trained in basic sciences, such as physics, chemistry, mathematics, electrical and mechanical engineering, optics, and materials science, *NOT* chip design. But even after that, it will take years of practice and know-how to get the same level of talent that the West has, and by that time the West will have moved on to bigger and better. This is not an easy task at all and it requires a lot of people working overtime and a lot of patience. It essentially has to be treated as a wartime industry where you are already at war -- with that level of urgency.
That is why honestly China should invest more in researching leapfrog technologies, like photonic chips. These are still in their infancy and if China can start early there, it will be in an early mover position if not a first mover position.
can you elaborate on which parts the poster was wrong?No you are wrong. Sorry.
The standard for self sufficiency from Russia = capable of doing it with foreign tools like how they imported Toshiba machine tools
The standard for self sufficiency from China = not even a single speck of paint can be from a foreign country otherwise it is the deepest dependence in the world.