I want to make sure I have the story straight, so I'll summarize the current state of Chinese DUVL. Critiques and elaborations from more knowledgeable members welcome.
The SSA800 is in customers' (SMIC and CETC, perhaps others) hands and they will start using it for fabrication next year. The machine was initially intended to fabricate 28nm/14nm/7nm nodes, however it is currently only capable of fabricating 28nm/14nm nodes. With further improvements to certain components, it will be able to fabricate 7nm nodes. If reports are true that the SSA800 "failed" to meet the 02 Project criteria, it is this shortcoming at 7nm that is the cause of the failure.
There is another DUVL (tentatively called SSA1000) that is a 22nm single exposure machine, which following the typical halving pattern should be able to fabricate 22nm/11nm/5nm nodes (marketing says we should round down
). The production status of this machine is unknown and we don't expect it to appear in the immediate future (i.e., within the next year).
Mistakes? Something I missed?
The SSA800 is in customers' (SMIC and CETC, perhaps others) hands and they will start using it for fabrication next year. The machine was initially intended to fabricate 28nm/14nm/7nm nodes, however it is currently only capable of fabricating 28nm/14nm nodes. With further improvements to certain components, it will be able to fabricate 7nm nodes. If reports are true that the SSA800 "failed" to meet the 02 Project criteria, it is this shortcoming at 7nm that is the cause of the failure.
There is another DUVL (tentatively called SSA1000) that is a 22nm single exposure machine, which following the typical halving pattern should be able to fabricate 22nm/11nm/5nm nodes (marketing says we should round down
). The production status of this machine is unknown and we don't expect it to appear in the immediate future (i.e., within the next year).Mistakes? Something I missed?
