I agree and the Chinese are not resting on their laurels in EUV and eventually it will reach, how soon they do it will depend on the pressure they receive from the United States. The first prototype in 2024-2025? who knows.
YMTC uses a proprietary stacking technology with direct wafer bonding but stacking using through silicon vias in 3D packages is perfectly fine and can be designed for.
Beijing has an old working synchrotron, Beijing Synchrotron Radiation Facility (BSRF). It too can generate soft X-ray . And it can be use for research and development in X-ray lithography. But it has only 14 beam line and 14 experimental station
Do you know if HEPS will be used to research steady-state microbunching or even use it industrially?
@antiterror13 sir the 5G chips is banned the 4G isn't, while HONOR is allowed to used it. My view Qualcomm & Huawei had talk about this and strategized that made HONOR a separate brand from Huawei.
Theoretically, the Steady State Micro Bunching technology can also be implemented on the old Beijing synchrotron.
@antonius123 bro TW, SK and the US all had EUVL, why would they choose another processes when they had the tool available? Stifling China will only spur it to innovate more and 3D stacking is one of them.
There are major issues with 3D stacking that need to be resolved mostly about thermal issues, but there is no incentive for unsanctioned companies to solve it because they could just keep adding transistors to a single die until they hit the limit, while Huawei is under great pressure to innovate to survive sanctions. So Huawei investing in 3D stacking makes sense, but not so much for other companies.