@foofy Sir a treasure trove of info thanks a lot, a google translation below, Sir this company is a major supplier of semiconductor equipment across the board from logic, DRAM and NAND up to 14nm/ 10nm node fantastic.
(1) PECVD equipment
PECVD equipment is the core equipment for integrated circuit manufacturing. The manufacturing process of a chip involves ten
More than thin films of different materials, various films with different electrical and mechanical properties constitute the chip 3D structure
Different functions in the. The issuer has researched and developed the PECVD equipment for different material thin films in the downstream
It also produces 16 different types of PECVD equipment, the specific industrial application is as follows:
Equipment type Application field Process field Industrial application
SiO2 process
PECVD
Logic chip manufacturing
Inter Layer
Dielectric, Inter Metal Dielectric) 130-28nm logic products
Industrial application; 14nm
And logic below 10nm
Industrialization verification
Passivation Layer (Passivation Layer)
Etch hardmask process (Etch hardmask)
SiN process
PECVD
Logic chip manufacturing,
DRAM manufacturing,
FLASH manufacturing
Etch Stop Layer process (Etch Stop Layer) 130-28nm logic, 64
Layer FLASH industrialization
Inter Metal Dielectric application; 14nm logic,
The details of the issuer's series of equipment and the industry's deep integration are as followsPlease check page 1-1-174.![]()
(1) PECVD equipment
PECVD equipment is the core equipment for integrated circuit manufacturing. The manufacturing process of a chip involves ten
More than thin films of different materials, various films with different electrical and mechanical properties constitute the chip 3D structure
Different functions in the. The issuer has researched and developed the PECVD equipment for different material thin films in the downstream
It also produces 16 different types of PECVD equipment, the specific industrial application is as follows:
Equipment type Application field Process field Industrial application
SiO2 process
PECVD
Logic chip manufacturing
Inter Layer
Dielectric, Inter Metal Dielectric) 130-28nm logic products
Industrial application; 14nm
And logic below 10nm
Industrialization verification
Passivation Layer (Passivation Layer)
Etch hardmask process (Etch hardmask)
SiN process
PECVD
Logic chip manufacturing,
DRAM manufacturing,
FLASH manufacturing
Etch Stop Layer process (Etch Stop Layer) 130-28nm logic, 64
Layer FLASH industrialization
Inter Metal Dielectric application; 14nm logic,
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