??, so as of now, isn't Nikon mainly shipping immersion to China?Nikon has lost its largest customer Intel which accounted for 90% of its sales.
Its share of the DUVL Market is now 7%.
Future competiton from SMEE and CETC in its largest market China also does not bode well.
There is also restrictions in the type of DUVL it can ship to China.
Nikon is at a dead end as it will not be developing EUVL in the future.
According to the graph there is a large drop in shipments of Arf Immersion DUVL for Chipmaking.
The jump in shipments are for FPD Lithographs for TV Flat Panel Display manufacre
There is a restriction on the newer models of Nikon DUVL shipping to China. Also restrictions on sale to Companies on the Sanctions List.??, so as of now, isn't Nikon mainly shipping immersion to China?
As for restrictions, isn't it where the MRF is <45nm where MRF is 0.67*NA/193?
Also, ArFi should be ~20% given that in Q1 2021, ASML shipped 24 and thus 6/(24+6) = 20%
Japanese corporates tend to ignore the Entity List and the Japanese version of the Entity List is far weaker (?). At least under Japanese law, both the NSR-S635E and the NSR-S622D.There is a restriction on the newer models of Nikon DUVL shipping to China. Also restrictions on sale to Companies on the Sanctions List.
Chinese companies may buy Nikon now but when local alternatives which are sanction-free becomes available, they will switch to the local product.
According to the Chart there is certainly a drop in shipments of Arf Immersion DUVL in 2021 compared to 2020. Even the forecast shipments in 2022 is stagnant and is the same as 2021.
The focus should really be on Arf Immersion DUVL as this is the machine used for Chip making that is sought after by many FABS and will determine the future of Nikon as a viable Business in Lithography.
Machines like FPD DUVL or iLine or KLine DUVL is really not cutting edge and might face greater competition from Chinese competitors in the future.
@AETHER thanks bro for the info, me and @krautmeister knows that China is sandbagging, My gut feeling what will happen next year is SMIC will mass produced its N+2 7nm using its ASML DUVL simultaneously with a indigenous 14nm line. As @weig2000 had posted a two solution approached.
Domestic 28nm wet process equipment is put into use: 14/7nm equipment will be delivered next year and supplied to Huawei and SMIC
2021/7/9 15:22:09 Source: IT House Author: Yuanyang Editor: Yuanyang Comment: 106
IT Home, July 9 news. Recently, the domestic semiconductor equipment manufacturer Zhichun Technology stated on the interactive platform that at present, all the wet process equipment of Zhichun Technology 28nm node has been certified.
IT Home has learned that chip manufacturing is divided into three major links: logic chip design, chip foundry, and packaging and testing. Among them, chip foundry includes wafer manufacturing, exposure, etching, cleaning and other processes. Wet cleaning equipment belongs to the cleaning link in the semiconductor supply chain. The cleaning is based on the needs of different chip manufacturing processes to clean the surface of the silicon wafer without damage, and the remaining particles in the chip manufacturing process, exposure, and etching processes are formed. Natural oxide layer, metal pollution, organic matter, sacrificial layer, polishing residue and other impurities are cleaned up. The cleaning process accounts for more than 30% of the chip manufacturing process steps. Among the chip manufacturing process steps, the cleaning process accounts for the largest proportion.
Zhichun Technology said that there are currently three domestic companies that provide medium and high-end wet process equipment at the end of the wet process equipment, namely Zhichun Technology, Northern Huachuang and Shengmei. The market share of domestic manufacturers is increasing year by year.
According to the data, Zhichun Technology was established in 2000, and its main business is the research and development, production and sales of high-purity process systems; the research and development, production and sales of semiconductor wet cleaning equipment; the research and development and production of optical sensor applications and related optical components And sales. The financial report shows that Zhichun Technology will ship more than 30 wet-process equipment in 2020, and new orders will be 530 million yuan, an increase of 211.8%.
In addition to the 28nm process node, the Shanghai Securities News report also pointed out that Zhichun Technology’s 14nm and 7nm processes are expected to be available for customer verification in 2022. Customers include SMIC, Hua Hong Group, Changxin Storage, Huawei, Taiwan Powerchip And other industry leaders.
It is worth mentioning that Wen Xiaojun, director of the Institute of Electronic Information of the China Electronics Information Industry Development Research Institute, said in an interview last month: “my country will complete a breakthrough in 14-nanometer process equipment by the end of 2022.” Zhichun Technology will The 14-nanometer and 7-nanometer cleaning equipment certified by Huawei and SMIC in 2022 will also improve the reliability of this news to a certain extent.
The Japanese very servile towards the United States. Is nothing new, but still amazing nevertheless.The Japanese actually used to be pioneers in early EUVL Research but eventually gave up.
ASML which was supported by the US and almost all major FABS became the No 1 and monopoly supplier of EUVL.
Japan was basically locked out of EUVL development.
Japan now basically only supplies materials and some machinery for the EUV production process.
Gigaphoton still does R&D on EUV Light Sources but cannot sell any of its products which makes it very bleak for them.
Even if Japan did manage to get Govt support and $billions to develop a EUVL, it would still need to sell mainly to China, which the US Govt will not allow it to do.
Worse of all China is now developing its own EUVL (SMEE & CETC) which will eventually break the ASML monopoly in EUVL.
Canon has also excited the DUVL Industry and Nikons DUVL business is facing bankruptcy.
Not much chance of these companies trying to develop a EUVL.
So basically Japan has been sidelined by the US and its hopes of developing its own EUVL is now almost over.
Looks like Huawei is telling Western Media that it is not building its own FAB and has no interest whatsoever in building one.
Domestic 28nm wet process equipment is put into use: 14/7nm equipment will be delivered next year and supplied to Huawei and SMIC
2021/7/9 15:22:09 Source: IT House Author: Yuanyang Editor: Yuanyang Comment: 106
IT Home, July 9 news. Recently, the domestic semiconductor equipment manufacturer Zhichun Technology stated on the interactive platform that at present, all the wet process equipment of Zhichun Technology 28nm node has been certified.
IT Home has learned that chip manufacturing is divided into three major links: logic chip design, chip foundry, and packaging and testing. Among them, chip foundry includes wafer manufacturing, exposure, etching, cleaning and other processes. Wet cleaning equipment belongs to the cleaning link in the semiconductor supply chain. The cleaning is based on the needs of different chip manufacturing processes to clean the surface of the silicon wafer without damage, and the remaining particles in the chip manufacturing process, exposure, and etching processes are formed. Natural oxide layer, metal pollution, organic matter, sacrificial layer, polishing residue and other impurities are cleaned up. The cleaning process accounts for more than 30% of the chip manufacturing process steps. Among the chip manufacturing process steps, the cleaning process accounts for the largest proportion.
Zhichun Technology said that there are currently three domestic companies that provide medium and high-end wet process equipment at the end of the wet process equipment, namely Zhichun Technology, Northern Huachuang and Shengmei. The market share of domestic manufacturers is increasing year by year.
According to the data, Zhichun Technology was established in 2000, and its main business is the research and development, production and sales of high-purity process systems; the research and development, production and sales of semiconductor wet cleaning equipment; the research and development and production of optical sensor applications and related optical components And sales. The financial report shows that Zhichun Technology will ship more than 30 wet-process equipment in 2020, and new orders will be 530 million yuan, an increase of 211.8%.
In addition to the 28nm process node, the Shanghai Securities News report also pointed out that Zhichun Technology’s 14nm and 7nm processes are expected to be available for customer verification in 2022. Customers include SMIC, Hua Hong Group, Changxin Storage, Huawei, Taiwan Powerchip And other industry leaders.
It is worth mentioning that Wen Xiaojun, director of the Institute of Electronic Information of the China Electronics Information Industry Development Research Institute, said in an interview last month: “my country will complete a breakthrough in 14-nanometer process equipment by the end of 2022.” Zhichun Technology will The 14-nanometer and 7-nanometer cleaning equipment certified by Huawei and SMIC in 2022 will also improve the reliability of this news to a certain extent.
@WTAN Sir a stupid and novice question, if Huawei is able in 2022 start producing its own 14nm 3D chiplet, will it stop there and wait for SMIC localized 7nm chips and focus on EUVL development? second question is a 7nm 3D chiplet viable? TSMC didn't go that route cause they can able to procure an EUVL early on, will SMIC /Huawei do that while waiting for a mature domestic EUVL?Looks like Huawei is telling Western Media that it is not building its own FAB and has no interest whatsoever in building one.
But at the same time they are quietly buying Semiconductor Manufacturing Equipment for its new FAB.
LOL!
I have heard that Huawei is developing Chiplet technology.@WTAN Sir a stupid and novice question, if Huawei is able in 2022 start producing its own 14nm 3D chiplet, will it stop there and wait for SMIC localized 7nm chips and focus on EUVL development? second question is a 7nm 3D chiplet viable? TSMC didn't go that route cause they can able to procure an EUVL early on, will SMIC /Huawei do that while waiting for a mature domestic EUVL?
@WTAN Sir thanks for your patience and wisdom, if Huawei did produce a 7NM 3D chiplet, will that be enough to revitalized its high end smart phone? Will a 7NM 3D chiplet comparable to TSMC 5NM in performance?I have heard that Huawei is developing Chiplet technology.
So it is certain Huawei will produce 12nm and 14nm 3D Chiplets in 2022. This will be Huawei's first 5g SOCs. Qualcomm is currently only allowed to provide 4g SOCs to Huawei.
Eventually Huawei will move on to produce a DUVL 7nm 3D Chiplet.
It is uncertain when the EUVL will become available and Huawei will take the conservative route and produce using DUVL.
A 7nm Chiplet produced using DUVL would be viable in China as it is a large market and there are a number of large local customers (which are under sanction) and would be unable to procure these Chips anywhere else.
I believe ICRD will begin trial production of EUVL 5nm ICs probably late this year or early next year.
Will use Synchrotron Light Source.
This is R&D to prepare for the coming EUVL.