Enough distraction from the trouble maker, let's back to normal business.
近日，北京经开区企业北京中电科电子装备有限公司（以下简称：电科装备）自主研发的8英寸全自动晶圆减薄机产业化机型，成功进入国内某8英寸集成电路生产线，意味着国产集成电路封装设备在自主可控道路上又迈出关键一步。
从集成电路断面结构来看，大部分集成电路是在硅基体材料的浅表面层上制造。由于制造工艺的要求，对晶片的尺寸精度、几何精度、表面洁净度以及表面微晶格结构提出很高要求。因此在几百道工艺流程中，不可采用较薄的晶片，只能采用一定厚度的晶片在工艺过程中传递、流片。通常在集成电路封装前，需要对晶片背面多余的基体材料去除一定的厚度，以满足芯片封装厚度尺寸和表面粗糙度的要求。这一工艺过程称之为晶片背面减薄工艺，对应装备就是晶片减薄机。而该设备此前长期被国外垄断。
电科装备依托国家科技重大专项技术成果，完成了8英寸全自动晶圆减薄机产业化机型的技术研发和改进，使产品的运行精度、可靠性有了质的提升，气浮主轴、气浮承片台、大直径回转工作台等核心零部件100%拥有自主知识产权，并成功进入国内某8英寸集成电路生产线。预计在今年三季度，电科装备还将推出首台12英寸全自动晶圆减薄机产业化机型，实现8-12英寸全自动系列减薄设备国产化替代。今年底，电科装备12英寸全自动减薄抛光机也将交付客户，解决超薄晶圆加工领域“卡脖子”问题。
作为北京经开区集成电路产业领域的重点企业，电科装备是国家重大专项连续支持的、国内集成电路领域减薄设备供应商，在集成电路晶圆、化合物、第三代半导体等应用领域国产装备占有率超过90%，具备高效的整机开发和产业化能力。
Recently, the 8-inch full-automatic wafer thinning machine industrialized model independently developed by Beijing Zhongdian Electronic Equipment Co., Ltd. (hereinafter referred to as Electric Equipment), a company in Beijing Economic Development Zone, successfully entered a domestic 8-inch integrated circuit production line. It means that domestic integrated circuit packaging equipment has taken another crucial step on the road of autonomous control. From the cross-sectional structure of integrated circuits, most integrated circuits are manufactured on the shallow surface layer of silicon base material. Due to the requirements of the manufacturing process, high requirements are placed on the dimensional accuracy, geometric accuracy, surface cleanliness and surface micro-lattice structure of the wafer. Therefore, in hundreds of technological processes, thinner wafers cannot be used, and only wafers of a certain thickness can be used for transfer and tape-out during the process. Usually, the excess base material on the back of the chip needs to be removed to a certain thickness before the integrated circuit packaging to meet the requirements of the chip packaging thickness and surface roughness. This process is called wafer back thinning process, and the corresponding equipment is a wafer thinning machine. The equipment has been monopolized by foreign countries for a long time.
Relying on the major technical achievements of national science and technology, the electrical equipment has completed the technical research and development and improvement of the industrialized model of the 8-inch fully automatic wafer thinning machine, which has qualitatively improved the operating accuracy and reliability of the product. The air flotation spindle, The core components such as air bearing table and large-diameter rotary table have 100% independent intellectual property rights, and have successfully entered a domestic 8-inch integrated circuit production line. It is expected that in the third quarter of this year, the electrical equipment will also launch the first 12-inch fully automatic wafer thinning machine industrialized model, realizing the localized replacement of 8-12 inch fully automatic series thinning equipment. At the end of this year, the 12-inch fully automatic thinning and polishing machine of Dianke will also be delivered to customers to solve the "stuck neck" problem in the field of ultra-thin wafer processing. As a key enterprise in the integrated circuit industry in Beijing Economic and Technological Development Zone, electrical equipment is continuously supported by major national projects and is a domestic supplier of thinning equipment in the integrated circuit field. It is domestically produced in the application fields of integrated circuit wafers, compounds, and third-generation semiconductors. The equipment occupancy rate exceeds 90%, and it has efficient overall machine development and industrialization capabilities
