To be fair, the SSA800 has some leeway for verification due to the sheer amount of ASML lithography machines the Chinese fabs have stockpiled. There isn't a need to put it into service right away, as opposed to an EUV machine which is more urgently needed by SMIC to enter sub-5nm node manufacturing.
Chinese semiconductor industry
- Thread starter Hendrik_2000
- Start date
- Status
this is one of the main reason why we have seen much faster progress with EUV .. first prototype is on the way. as tphuang sir mentioned, if they satisfy with initial testing, they might start some production even with loss..
Why is your goal so low? They need to move beyond 7nm. If China is just producing 7nm in 3 years, Huawei will have real problems
the number of asml scanners they have now is sufficient for 70k wpm of 6-7nm production. Why would you want more than that?
I can’t remember what these phases are now but onmicro was among the first I
I have commented on this. Great way for China to counter tariff American chip products. The number of products with Chinese chips vs American chips is so lopsided.
Order progress! Keshitong, a subsidiary of Wanye Enterprise, received another batch order for integrated circuit equipment
Keshitong, a subsidiary of Wanye Enterprise, recently sold several 12-inch integrated circuit low-energy large-beam ion implanters to two customers. This marks that Keshitong Equipment has accelerated the acquisition of bulk purchase orders after completing equipment verification on its client side.
The ion implanter is one of the most important core equipment in chip manufacturing. Its implantation process is difficult to verify, and its development difficulty is second only to the photolithography machine. It is the core of current semiconductor development and must be replaced by domestically produced equipment. Among them, low-energy large-beam ion implanters have the largest market size, accounting for about 60%.
According to Jiwei.com, over the years, Keshitong has continued to deepen its efforts in the industry. Its product development now covers multiple application fields such as logic, storage, and power. Its low-energy large-beam ion implanters and high-energy ion implanters have achieved Breakthroughs in industrialization, process coverage, yield, and capacity replacement rates are among the best in the industry. Keshitong adheres to the forward design and independent innovation technology route and builds key technology modules such as large beam ion source, visual alignment system, high uniformity AMU, solid-state source evaporator, beam uniformity adjustment device, and deceleration device to solve the problem The contradiction between extremely low energy and large beam current in the optical system has overcome technical problems such as injection angle control and particle contamination control, and achieved uniform injection of low-energy large beam ion beam.
In addition, based on the idea of "improving accuracy, reducing pollution, and increasing production capacity", Keshitong has designed and built five-axis controlled robots, high-precision visual alignment systems, and innovatively implemented hardware AI technologies such as ultra-large vacuum process chambers. , and also developed a Beam Auto Tune (automatic beam adjustment) software system based on physical model algorithms and expert systems. Within an average beam adjustment time of 5 minutes, a very difficult and extremely important function can be implemented, which can realize ion implantation. Artificial intelligence control of machine working process. At the same time, Keshitong ion implanter has now implemented the automatic repair function of ion implanter Glitch to ensure safe and stable production of the machine under various conditions. Kaishitong combines both "software and hardware" to create a universal platform, constantly empowering in-depth understanding and efficient verification of technical challenges.
Relying on the advantage of self-developed technical barriers, Keshitong has successfully expanded a variety of ion implanter series products through "iteration on demand" to continuously meet the needs of domestic chip production. In recent years, it has continued to increase the continuous improvement of existing equipment products and the development of new products. At present, In the field of advanced logic chip foundry, the conventional low-energy large-beam ion implanter has a 28nm process technology coverage of 100%, and the production capacity has reached the international advanced level. It is currently a domestic supplier that truly achieves full coverage of the 28nm low-energy ion implantation process, and is the first to complete domestic production. High-energy ion implanter production line verification and acceptance. As of the first half of this year, Keshitong has been authorized 139 patents, including 83 invention patents. It has also won the honorary titles of "China's High-quality Leading Enterprise in the Semiconductor Field" and "Shanghai Enterprise Technology" Center" identification.
The ion implanter is one of the most important core equipment in chip manufacturing. Its implantation process is difficult to verify, and its development difficulty is second only to the photolithography machine. It is the core of current semiconductor development and must be replaced by domestically produced equipment. Among them, low-energy large-beam ion implanters have the largest market size, accounting for about 60%.
According to Jiwei.com, over the years, Keshitong has continued to deepen its efforts in the industry. Its product development now covers multiple application fields such as logic, storage, and power. Its low-energy large-beam ion implanters and high-energy ion implanters have achieved Breakthroughs in industrialization, process coverage, yield, and capacity replacement rates are among the best in the industry. Keshitong adheres to the forward design and independent innovation technology route and builds key technology modules such as large beam ion source, visual alignment system, high uniformity AMU, solid-state source evaporator, beam uniformity adjustment device, and deceleration device to solve the problem The contradiction between extremely low energy and large beam current in the optical system has overcome technical problems such as injection angle control and particle contamination control, and achieved uniform injection of low-energy large beam ion beam.
In addition, based on the idea of "improving accuracy, reducing pollution, and increasing production capacity", Keshitong has designed and built five-axis controlled robots, high-precision visual alignment systems, and innovatively implemented hardware AI technologies such as ultra-large vacuum process chambers. , and also developed a Beam Auto Tune (automatic beam adjustment) software system based on physical model algorithms and expert systems. Within an average beam adjustment time of 5 minutes, a very difficult and extremely important function can be implemented, which can realize ion implantation. Artificial intelligence control of machine working process. At the same time, Keshitong ion implanter has now implemented the automatic repair function of ion implanter Glitch to ensure safe and stable production of the machine under various conditions. Kaishitong combines both "software and hardware" to create a universal platform, constantly empowering in-depth understanding and efficient verification of technical challenges.
Relying on the advantage of self-developed technical barriers, Keshitong has successfully expanded a variety of ion implanter series products through "iteration on demand" to continuously meet the needs of domestic chip production. In recent years, it has continued to increase the continuous improvement of existing equipment products and the development of new products. At present, In the field of advanced logic chip foundry, the conventional low-energy large-beam ion implanter has a 28nm process technology coverage of 100%, and the production capacity has reached the international advanced level. It is currently a domestic supplier that truly achieves full coverage of the 28nm low-energy ion implantation process, and is the first to complete domestic production. High-energy ion implanter production line verification and acceptance. As of the first half of this year, Keshitong has been authorized 139 patents, including 83 invention patents. It has also won the honorary titles of "China's High-quality Leading Enterprise in the Semiconductor Field" and "Shanghai Enterprise Technology" Center" identification.
Western media recently seem more optimistic of China's race towards < 7nm then we are here
China trying to buy as much as possible, ASML trying to sell as much as possible
China trying to buy as much as possible, ASML trying to sell as much as possible
They are not getting to 4nm without euvs. Let’s be real here. They might get something close to original n5 in a couple of years. They need euv by 2026/2027 for SMIC to continue down the path of improving density. That’s what everyone is banking on probably
I read the Nikkei article before it was posted here. It didn't mention anything about a DUV-only process for 3nm, so I think the more likely possibility is that they are getting ready for an EUV machine in the near future.
Last edited:
Is pretty much possible to reach 3nm without EUV.
If the constraint is vertical rather than horizontal like in the case of CFET or GAAFET then ALD and ALE would be the constraint rather than the lithography tools.
Even horizontally. Using multiple exposures techniques, self-aligning and direct self assembly techniques is not impossible to extent immersion lithography beyond its current limits without massively increasing the cost in comparison with EUV, the supply chain for immersion is more mature than for EUV and cheaper. Of course as the supply chain for EUV mature with time, the cost of EUV tools, mask and materials will decrease and it could leave immersion far away. But in the meantime Immersion lithography could be still be relative competitive until China develops their own EUV supply chain.
If the constraint is vertical rather than horizontal like in the case of CFET or GAAFET then ALD and ALE would be the constraint rather than the lithography tools.
Even horizontally. Using multiple exposures techniques, self-aligning and direct self assembly techniques is not impossible to extent immersion lithography beyond its current limits without massively increasing the cost in comparison with EUV, the supply chain for immersion is more mature than for EUV and cheaper. Of course as the supply chain for EUV mature with time, the cost of EUV tools, mask and materials will decrease and it could leave immersion far away. But in the meantime Immersion lithography could be still be relative competitive until China develops their own EUV supply chain.
- Status