when do you think this bifurcation would happen (Chinese auto maker relying on J6 while western automakers still rely on the western stuff)?
Chinese semiconductor industry
- Thread starter Hendrik_2000
- Start date
- Status
3D Stacking supply chain
Due to the unique 3D stacking structure, HBM chips bring incremental markets to areas such as upstream equipment and manufacturing materials. Compared with traditional packaging, advanced packaging has higher precision requirements for die bonding machines and grinding equipment, and the demand for testing machines has increased. At the same time, due to the addition of bump manufacturing, RDL, TSV and other processes, production includes photolithography equipment and etching equipment. , deep hole metallization plating equipment, thin film deposition equipment, reflow soldering equipment, etc.
In the front-end link, HBM needs to be connected vertically through TSV. The TSV processing process includes hole forming, depositing insulating layers, thinning, electroplating, CMP, etc., which is the highest cost component in 3D packaging. TSV etching equipment has been added. According to the demand, domestic manufacturers Northern Huachuang and China Microelectronics Co., Ltd. have layouts in this equipment field; in the back-end packaging process, die bond packaging equipment and memory chip testing equipment are needed. The main domestic participating manufacturers include Xinyichang and Changchuan Technology. , Huafeng Measurement and Control, etc.
In addition, computing power upgrades will further stimulate demand in the PCB market. The key to achieving PCB performance under high computing power requirements lies in its core material, high-frequency and high-speed copper-clad laminates. The core indicators that determine the quality of high-frequency and high-speed copper clad laminates are the selection of raw materials. Resin, silica powder, etc. are key factors. Upgrading of computing power will bring The growth elasticity of demand for upstream raw materials.
Huahai Chengke is the only domestic listed company of HBM's upstream packaging raw material GMC. It has passed customer verification and entered the sample delivery stage. It is currently in the sample delivery stage. Some customers of Lianrui New Materials are world-renowned GMC suppliers. Due to HBM's increasing packaging height and heat dissipation requirements, the particle packaging materials need to add spherical silicon and spherical aluminum. Hynix has publicly disclosed that "spherical silicon and spherical aluminum" Aluminum is the key material for upgrading HBM1 to HBM3 and HBM3E." It is worth mentioning that Lianrui New Materials disclosed in its investor activity record on September 7 that the company supports the production of spherical silicon and spherical aluminum used in HBM.
Although, in the short term, the participation of the domestic industrial chain in the production process of HBM chips is not that high, based on the environment of domestic substitution, the application prospects and application trends of HBM have gradually become clear. With its rapid development , a number of excellent industrial chains are bound to emerge to make up for the shortcomings of the domestic HBM industry chain.
Not sure, in terms of adas/central computational, I think j6 will take a pretty large market share by 2025. But in terms of generic mcu and analog chip, that's a harder question.
Getting chips certified for highest auto grade is a long and costly process. The Chinese companies are just behind western heavyweights here. One thing they do have going is this segment is not progressing forward as quickly as advanced logic process.
Calling node names marketing is an oversimplification too. Transistors are still getting smaller and FLOPS/Watt is continuing to increase by other means.
28 nm is what the machine is rated for. It is not going to do 28 nm with a single pass. In fact, no single node since 65 nm uses single pass.
Xiantao adds new impetus! Dinglong Semiconductor Materials Industrial Park is put into operation
Dinglong Holding Group announced today through its official Weibo that on November 16, Dinglong (Xiantao) Semiconductor Materials Industrial Park held a grand commissioning ceremony. The industrial park covers an area of 218 acres, with a construction area of 115,000 square meters and a total investment of approximately 1 billion yuan. After 15 months of intense construction, the park has simultaneously launched the production of several key projects such as kiloton-level semiconductor OLED panel photoresist (PSPI), 10,000-ton CMP polishing slurry (Slurry) and nano-abrasive particles.
This commissioning ceremony marks that Dinglong (Xiantao) Semiconductor Materials Industrial Park has officially entered the operation stage. The newly built production line will provide high-quality key materials for the semiconductor industry and help promote the further development of the semiconductor industry in Xiantao region. This is not only an important milestone for Dinglong Holding Group, but also a positive contribution to local economic development.
My Redmi K60 uses all Omnivision cameras.
- Status