Chinese semiconductor industry

Status
Not open for further replies.

tphuang

Lieutenant General
Staff member
Super Moderator
VIP Professional
Registered Member
big moment for China' AI inference chips

Horizon has now come out with Journey 6 SoC
Please, Log in or Register to view URLs content!
Each chip supports 24 camera/Lidar/other sensors. Can handle full aspect NOA including all city driving scenarios

Customers include BYD, GAC, Bosch, Li Auto & VW/Cariad

560 TOPS & 350K DMIPS computation using BPU 3.0 (new generation AI processing)

Got more details on this chip.

It's a SoC that also integrates GPU and MCU functionality.

While journey 5 also had CPU and support for ISP/DSP, CPU was relatively weak just 26k DMIPS.

A J5 chip had to be integrated with TI TDA4 or SemiDrive X9 to have the ability to process all the camera data and integrate those data. It had to then rely on 3rd party MCU like by NXP, TI or Infineon to control various motors and other part.

J6 integrates everything together. It's unclear to me if they designed their on MCU or integrated another domestic MCU (like by SemiDrive or Autochips) in there, but everything is packaged into this 1 chip now. It maybe even more integrated than Huawei's MDC-610/810 platform.

In terms of CPU functionality, its 14-core A78 setup has 50% more computation cycle than the lead QCOM SD8295 (which is auto version of SD888 using 4nm process)

This allows domestic users to not need any foreign chips for core components of ADAS computation platform

Longer term, this AI inference chip can be used for other purposes.

At 560 TOPS, it's already almost the 2nd most powerful AI chip out there behind Ascend-910B. While it can be used for training purpose, due to lack of interconnect with other J6 chips, it can basically be used on any larger future platforms for the purpose inference at edge. So think about all the humanoid robots and other robotics devices.

While it concentrates on the vast territory of auto chips, Horizon robotics is now possibly the second best AI chip design firm in China after Hisilicon. Quite impressive. Major achievement in everyway.
 

sunnymaxi

Major
Registered Member

China's Premiere Chipmaker Accelerates to 7nm CPU Design Despite US Sanctions​


Please, Log in or Register to view URLs content!

Chinese CPU and GPU maker Loongson is beginning its transition to 7nm in 2024, which will apparently provide a 20% to 30% uplift in performance. Due to U.S. sanctions, the company's upcoming 7nm chips can only be fabbed in China — and although that might cost Loongson some performance and efficiency, it's still a win for China's native semiconductor industry...

@tokenanalyst you were right about SMIC advance process capacity. if this news is true
 

tphuang

Lieutenant General
Staff member
Super Moderator
VIP Professional
Registered Member

China's Premiere Chipmaker Accelerates to 7nm CPU Design Despite US Sanctions​


Please, Log in or Register to view URLs content!

Chinese CPU and GPU maker Loongson is beginning its transition to 7nm in 2024, which will apparently provide a 20% to 30% uplift in performance. Due to U.S. sanctions, the company's upcoming 7nm chips can only be fabbed in China — and although that might cost Loongson some performance and efficiency, it's still a win for China's native semiconductor industry...

@tokenanalyst you were right about SMIC advance process capacity. if this news is true
He is wrong there btw. 6000 series use 12nm process

it's only with 7000 series, that they will use 7nm. That's something for 2025. SMIC should have more capacity by then.
 

antiterror13

Brigadier

China's Premiere Chipmaker Accelerates to 7nm CPU Design Despite US Sanctions​


Please, Log in or Register to view URLs content!

Chinese CPU and GPU maker Loongson is beginning its transition to 7nm in 2024, which will apparently provide a 20% to 30% uplift in performance. Due to U.S. sanctions, the company's upcoming 7nm chips can only be fabbed in China — and although that might cost Loongson some performance and efficiency, it's still a win for China's native semiconductor industry...

@tokenanalyst you were right about SMIC advance process capacity. if this news is true

And apart from TSMC and Samsung and now SMIC, no other company produce 7nm chips

So basically only China (inc Taiwan) and South Korea are able to manufacture 7nm chips. No US nor Japan nor EU
 

tphuang

Lieutenant General
Staff member
Super Moderator
VIP Professional
Registered Member
By the way, the official launch of Journey 6 is in April for delivery in cars later in 2024, so probably another year

But a lot of good details today
1|征程 6 核心架构

-BPU 3.0
-多核 BPU 算力 560TOPS
-CPU 350K+DMIPS(ARM Cortex A78 核)
-3D 可视化渲染GPU
-全功能 ASIL-D
-数据驱动优化(BEV Transformer 感知优化、 端到端的感知预测能力、多传感器融合能力)
-规则驱动优化(规划控制算法、城区复杂场景优化、ASIL-D 安全计算)

2| 征程 6 更像一个平台

-基础 L2 :ACC/LCC 等
-L2+ :高速 NOA 、HPA (6-7V)
-L2++ :高速 NOA 城区专线 AVP(7-11v)
-L2+++:全场景 NOA (9-11V 1-3L)
-从一体机到全场景高阶辅助驾驶能力是共用一套硬件架构、工具链以及软件栈。
-底软交付即量产

3|征程 6 旗舰

高集成度:CPU GPU BPU MCU 四芯合一
降低硬件架构的复杂度,提高性价比
电子电气从分布到集成预控,在软件部署难度上会有优化

4|高效 :优化 Transformer

-BPU 纳什架构
-优化并行浮点算力(支持 SIMT 架构 更自定义的算子)
-优化超越函数(算子的硬件加速能力)
-全新的存储系统(提供更好数据带宽,算的快的同时数据能够供的上)
-FPS :相比 CNN Transformer 有十倍提升

5|总线架构:

-自研总线:TB 级总线带宽(相比业内 2 倍的提升)
-全链路 ASIL-D (车规)
-延迟率 130ns(相比主流竞品降低40%)

6|画质优化

-图像处理带宽优化
-24bit动态
-最大支持 18MP(1800万像素前摄像头)

7|兼容多传感器方案

-支持24路摄像头(最高 1800万)
-AD Map
-GNSS
-激光雷达
-4D毫米波/毫米波
-超声波
-DMS /OMS /CMS/ ToF

8|集成 MCU

-集成 ASIL-D 全功能 MCU
-算力提升 3.5倍(主要解决过去规划算力不足问题)
-Main 域与 MCU 域强隔离(满足功能安全)

so there are multiple versions supporting all the way basic L2 stuff like ACC & LCC to L2+ which includes highway NOA
to L2++ (some city driving)
to L2+++ (full NOA across the board)
so kind of like Orin, which ranges from 10/20 TOPS all the way to 254 TOPS on the high end
different price range obviously

supports 24 cameras, lidars, MMW radar, USS, GNSS, high accuracy map and mirror systems. Really a lot of input that it's able to handle

Highly integrated MCU that replaces need for additional chips, which I think will lower complexity of your computation center and really save on cost. Again, Only Huawei is able to do this right now.

Although main domain is still isolated from MCU domain, which I think is quite important

Automatically changes ADAS/electric control architecture to be centralized

TB-level wideband databus
ASIL-D grade, so very rugged
130ns latency

Image processing optimization, support 24-bit dynamic & 18MP cameras
 

antiterror13

Brigadier
Intel had what everyone commonly refer to as 7nm for a long time. Intel 10nm is basically what everyone else called 7nm.
in term transistor density, yes Intel 10nm is comparable with 7nm ... but I don't think it is the same, otherwise why would Intel still call it 10nm ... thats not helping Intel image
 

hvpc

Junior Member
Registered Member
in term transistor density, yes Intel 10nm is comparable with 7nm ... but I don't think it is the same, otherwise why would Intel still call it 10nm ... thats not helping Intel image
transistor density is probably the only PPAcT metric we can determine without having actual chip to test performance, power consumption, and even cost. It IS the lone Apple to Apple benchmark of anyone’s given process capability.

furthermore, nowadays people have high-density version and high-performance version for each process node, with the latter having much lower transistor density. Intel process is mostly tuned for high performance, if you want to get technical, we actually need to compare Intel process node with “high performance” version of a competing process node capability. To Intel’s disadvantage, most non-industry people only use the high density version’s transistor density to define a process node.

and by the way, Intel already has a larger wafer capacity output of their Intel4 with EUV than SMIC capacity for N+2. So claiming they don’t even have 7nm capability seemed silly.

It’s long over due for this forum to stop the ridiculous narrative that Intel is somehow behind SMIC in capability. This kind of nonsense strips anyone promoting this false narrative of any credibility.

some times when smart people don’t have all the pieces (of info), things don’t make sense to them. And any of logical inference deduced from insufficient data will not match the reality.
 
Last edited:

HighGround

Senior Member
Registered Member
and by the way, Intel already has a larger wafer capacity output of their Intel4 with EUV than SMIC capacity for N+2. So claiming they don’t even have 7nm capability seemed silly.

It’s long over due for this forum to stop the ridiculous narrative that Intel is somehow behind SMIC in capability. This kind of nonsense strips anyone promoting this false narrative of any credibility.

I didn't realize the Intel's Irish fab was that large... That's actually impressive.
 
Status
Not open for further replies.
Top