I agree with this. I understand that at the moment DUV is not the most pressing constraint on capacity expansion in China, but still, from around the end of the 14th FYP onward it's going to be a very important capability to have.Either way is clear the SMEE needs some domestic competition, in every single segment of China semiconductor industry there is multiple domestic companies competing with each other offering close to same products, ion implantation, CMP, etching, ALD, CVD, PVD, metrology, materials and so on, this competition is forcing establish companies like Naura and AMEC to differentiate their products even more, except lithography, SMEE is the only company that doesn't have a domestic competitor.
Nata was slow with their ArF and ArFi photoresist when they were the only player but now that multiple companies are launching their ArF and ArFi photoresist, NOW they are in a hurry.
I don’t know exact reason why the government selected SMEE over CETC. But at the time of the decision SMEE is the more commercially successful of the two.I agree with this. I understand that at the moment DUV is not the most pressing constraint on capacity expansion in China, but still, from around the end of the 14th FYP onward it's going to be a very important capability to have.
I just cannot understand why SMEE of all firms was chosen to be the main integrator and project coordinator for such an essential piece of equipment. Surely the differences in civilian and military-end lithography machines cannot be so dramatic as to make it infeasible for the CETC, with all of its resources and talent, to make the switch?
@hvpc Do you personally know or have an idea as to why the CETC was not chosen to be the principal company responsible for DUV? This has been bugging me for years and I would be grateful for a professional opinion.
I don’t know exact reason why the government selected SMEE over CETC. But at the time of the decision SMEE is the more commercially successful of the two.