Chinese semiconductor industry

Maikeru said:

Not sure if this qualifies as a bad take but it seems not:

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If you have to ask that question, then the answer is no. I have yet to see one think tank article that is so informative that we have to have it posted here.

KYli said:

It could be a ban on A800 and H800 or even more restrictions to procure A100 and H100 from intermediaries. Not sure if Alibaba, Tencent and Bytedande have stocked up enough chips and domestic alternatives are widely available yet.

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Good, they get what they deserve for not de risking. Frankly, everyone of Huawei's competitors should be buying their AI chips and using that as a fallback option

Maikeru said:

Not sure if this qualifies as a bad take but it seems not:

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Do not want to cause any controversy, but I do not believe the moderator will consider this to be anything different from what was deleted the last couple of days, and I missed all that, lol.

Although I cannot prove, it seems like they know nothing.

In terms of chip design, Huawei could soon be on par with global leaders, such as the American technology company Qualcomm.

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This is totally false. A few years ago, 3 or 4 years ago, the venture capitalist inside China, were telling us that Chinese chip design was already at the most advanced areas in the entire world. There was no catching up to do, 3 or 4 years ago.

They were telling us Chinese chip design was at the very highest levels, not Huawei chip design. In other words, everyone was doing it.

Of course, what is being used to design the chip today, that situation could be a little different that 3 or 4 years ago, but still, they know what they are doing if the Chinese already at the cutting edge of chip design.

Then the other totally weak part of the article, is they never mention the rumoured SMEE 28nm machine to appear this year, delivered. It will be fully domestically made. What exactly are they going to sanction?

Do the article writers realize once the Chinese do not need foreign inputs for legacy chips, there are no possible sanctions that can be effective.

In fact, sanctions targeting legacy chips inside China will be ineffective today, as production won't stop, and replacement of all foreign inputs is possible very soon.

Considering where the Chinese were with chip design a few years ago, and that SMEE 28nm machine to be delivered, we have no choice but to conclude that those two reporters were just engaged in fantasy talk.

tokenanalyst said:

Could be that organometallic resist more susceptible to secondary electrons affecting the resolution?

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I think it's the metal oxide resist has better resolution than traditional polymer resists because the photoacid generation in traditional resists is limited by the relatively high diffusion coefficient of organic acid groups in polymers.

This current resist doesn't use a photoacid generation mechanism for patterning after exposure. Instead it directly has a photochemical reaction with EUV exposure losing the triphenylsulfonium group.

See their mass spec data in the free supporting information showing benzene, fluorocarbon and SO, SO2 groups outgassing after EUV exposure), and their XPS data showing loss of S and F.

So this new resist combines the advantages of polymer resists - the chemical tunability, cleanability and flow characteristics of organics - with that of metal oxides - direct reaction of UV exposed regions rather than a mechanism vulnerable to line broadening due to diffusion of photoacid.

The above is 100% speculative rambling.

FairAndUnbiased said:

I think it's the metal oxide resist has better resolution than traditional polymer resists because the photoacid generation in traditional resists is limited by the relatively high diffusion coefficient of organic acid groups in polymers.

This current resist doesn't use a photoacid generation mechanism for patterning after exposure. Instead it directly has a photochemical reaction with EUV exposure losing the triphenylsulfonium group.

See their mass spec data in the free supporting information showing benzene, fluorocarbon and SO, SO2 groups outgassing after EUV exposure), and their XPS data showing loss of S and F.

So this new resist combines the advantages of polymer resists - the chemical tunability, cleanability and flow characteristics of organics - with that of metal oxides - direct reaction of UV exposed regions rather than a mechanism vulnerable to line broadening due to diffusion of photoacid.

The above is 100% speculative rambling.

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We need a proper chemist in here to clarify our undergrad chemistry BS speculations!

8-inch "Beyond Moore" R&D pilot line to solve the bottleneck of MEMS and silicon photonics technology​

Interview background: Shanghai Microtechnology Industrial Research Institute (Chinese abbreviation: Shanghai Industrial Research Institute; English abbreviation: SITRI) was established in 2013 and was initiated by the Shanghai Science and Technology Commission, Jiading District Government and Shanghai Institute of Microsystems and Information Technology, Chinese Academy of Sciences Established as a functional R&D and transformation platform integrating R&D, engineering, industrialization and cultivation, it provides in-depth process technology support and services to innovative enterprises and partners. Under the guidance of the strategic mission of Shanghai Lianhe Investment Co., Ltd. to serve the national strategy and be a pioneer in scientific and technological innovation and development, Shanghai Industrial Research Institute is established based on the "Trinity" innovation architecture model of the Shanghai Institute of Microsystems, Chinese Academy of Sciences, and through the technical strength of the Shanghai Institute of Microsystems. With the support of Shanghai Xinwei Technology Group's investment and operation model, it has established close cooperative relationships with many domestic and foreign industry, academia, and research organizations to achieve high-efficiency industrialization of innovative results and accelerate the establishment of a "Beyond Moore" industrial ecosystem. In order to gain an in-depth understanding of the platform construction and service progress of Shanghai Industrial Research Institute, Memes Consulting recently interviewed the 8-inch R&D pilot line management team.



What key process developments have been completed in the R&D pilot line so far? What other processes are planned?

In addition to the process accumulation related to integrated circuits, the current R&D pilot line has also developed some special MEMS processes such as SOI, deep silicon etching, glue spraying, wafer bonding, dry film, VOx, AlN, PZT, polyimide, multi-layer optical film growth and etching, etc. These processes have been widely used in pressure sensors, temperature and humidity sensors, infrared thermopiles, uncooled infrared detectors, inertial sensors, microfluidics, genetic testing, virus detection, MEMS speakers and other products.

Because automotive chips are an important direction in the future, we have launched IATF16949 training and enabled the APQP program in project research and development to ensure quality in every step from project evaluation to mass production. Controllable to ensure that the products developed can stably enter mass production.

Piezoelectric MEMS has been very active as a new material MEMS in recent years. In particular, aluminum nitride, as the piezoelectric film material of FBAR, has attracted many technicians to enter this field to start businesses. , which has also caused a large number of investment institutions to invest a large amount of funds in this field.

Silicon photonics is also one of the core technology directions for R&D pilot lines. How is the progress in complete/integrated processes and PDK? Which products have entered the stage of large-scale mass production?

Silicon photonics is a very core technical direction of our R&D pilot line, and it is earlier than MEMS and has a first-mover advantage, so we have invested a lot of equipment in this area, such as ArF lithography machine, Ge/GeSi epitaxy, etc. that can guarantee 90nm resolution. We released silicon photonics passive PDK 1.0 in 2021, and silicon photonics active PDK 2.0 in 2022. In the fourth quarter of this year, we will release 90nm PDK, and the device library performance indicators will fully reach the international advanced level.

KYli said:

It could be a ban on A800 and H800 or even more restrictions to procure A100 and H100 from intermediaries. Not sure if Alibaba, Tencent and Bytedance have stocked up enough chips

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Once again, Uncle Sam solves China's co-ordination problems. Very gracious of them. Maybe the "Beijing Biden" memes were true all along...

Hejian Industrial Soft released a variety of EDA products and solutions​

Shanghai Hejian Industrial Software Group Co., Ltd. (“Hejian Industrial Software”) has recently launched a number of EDA products and solutions to better address functional verification, debugging and large-scale test management in chip development, as well as advanced packaging systems Challenges of different tasks such as level design collaboration.

• A new generation of timing-driven (Timing-Driven) high-performance prototype verification system UniVista Advanced Prototyping System (" UV APS ") - rapid and automated realization of 4-100 VU19P FPGA cascade chip high-performance prototype verification;
• Sign-off full-featured version of the advanced package co-design inspection tool UniVista Integrator (" UVI ");
• Efficient and easy-to-use digital function simulation debugging tool UniVista Debugger (referred to as " UVD ");
• A powerful and flexible large-scale functional verification regression test management platform UniVista Verification Productivity System (referred to as " VPS ");
• UniVista Hybrid IPK (" HIPK "), a plug-and-play hybrid prototype system-level IP verification solution.