Chinese semiconductor industry

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tphuang

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Production number for Mate 60 Pro and Pro plus anticipated to increase to 20 million units, up from 6 million devices already created. You think they’ll reveal info like this only to get hobbled by more sanctions?
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Another data point to think about. Huawei expecting its new high end P series & Mate series to sell 30 to 40m units next year. They sold maybe 10 million Mate 50 & P60 for the year before mate 60 release.

If they are selling 25m more high end phone next year, that is all going to be coming from Apple.

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Another interesting thing is that Honor is putting more money into the fabless it setup. looks like Honor is getting more serious about designing its own chips

Of course, whether it goes all the way into designing its own soc vs just some camera or sensors chips like Oppo did is a different story.

We know Xiaomi is actually going fully into SoC
 

sunnymaxi

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The CEO of ASML, Peter Vinick, has admitted that although EUV is extremely difficult to make, it is not impossible for China to independently create EUV because China has world-class independent research and development capabilities, it has many research institutes/scientists working hard in this area, and that it will only be a matter of time.

Interview with CEO of ASML, Peter Vinick:

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why are you even reply to these newly join members ..

@rui009 its better if you read last 100-150 pages of this thread. everything will be clear..

we(China) are going to assemble first ever prototype of EUV by this year end or early next year.. stop us if you can.
 

tokenanalyst

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Lithography machine workpiece stage feedforward compensator parameter setting method


The feedforward controller is a key link in achieving nanometer-level motion accuracy of the photolithography machine workpiece stage under high acceleration and deceleration conditions. In order to solve the problem that the fourth-order feedforward has poor ability to fit the inverse model under traditional circumstances and is difficult to completely eliminate the repeatability error caused by the reference trajectory, this paper proposes a feedforward method based on the fourth-order feedforward and a rational fraction compensator. Based on the feedback control architecture, a data-driven parameter tuning method is proposed to solve the problem of control parameter tuning of the rational fraction compensator. This method uses the relevant rules of system identification to transform the non-convex optimization problem in the feedforward compensator parameter tuning process into a convex optimization problem, and then provides the global optimal parameter tuning method and the unbiased gradient and Hessian matrix in the parameter iteration process. Estimation method; the convergence of the proposed parameter tuning method is verified through experiments on the workpiece stage of the photolithography machine. Experimental results show that the proposed compensation feedforward can effectively eliminate the residual error that is not eliminated by the fourth-order feedforward.

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olalavn

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100% automatic instruction set! Loongson's Dragon CPU architecture adaptability exceeds 100,000

Dragon architecture has been adapted for a total of 999 products. From January to August, there are 122 models, 115 models, 172 models, 147 models, 130 models, 106 models, respectively there are 72 models, 132 styles.

The total number of software and hardware suitable for the Dragon architecture has exceeded 100,000! Among them, there are 54,626 software models, 30,760 peripheral device models, 12,670 machine accessory models, 1,833 security protection models, 485 complete machine models and 290 storage and backup models.

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tokenanalyst

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China advanced packaging landscape:

Players:JCET, Tongfu, etc.
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EDA: empyrean, xpeedic.
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Lithography: SMEE, CFMEE, Yuanzhuo Micro-Nano, jianhuagk.
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Coating and developing: KingSemi, ACM shanghai
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Photoresist: Aisen semiconductor, Rongda Photosensitive, Hengkun, Shanghai Xinyang
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Electrodeposition: ACM Shanghai.
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Chemical Electroless Plating: Xinmeng Semiconductor.
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PVD: Naura
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ALD: LEADMICRO
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TSV: Naura, AMEC,
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CMP and Thinning: Hwatsing, Semicores
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Cleaning: ACM Shanghai, PNCS
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Wet Etching: KingSemi, PNCS, ACM Shanghai
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Bonding: CapCon, precisionNext
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Hybrid Bonding: U-Precision
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Bumping equipment: CapCon
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Metrology: yuweitk, tztek, hwatsing, rsicsh, angstrom-e
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Testing: Accotest, Semitronix
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Blitzo

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Guys, I am Chinese...just telling the truth...it's truly unimaginably difficult to make EUV, if China can deliver a 28nm DUV by the end of 2023 or even 2024, it would be a great achievement for China. until then, it's all NEWS. remember C919 airplanes? when the WEST blocked the imports, the project was stalled for 4 years! only until the WEST unblocked the project can it move on. DUV or EUV is much harder than C919. use your brains.

I strongly recommend stepping back and reading, and waiting for a few years before participating here and posting, because right now you are entering a very niche topic with an information deficit relative to everyone else that has been watching this space for years quite carefully.

The sheer lack of up to date knowledge and tracking of information on your end, means that the nature of your posts seem like they're flamebait or trolling even if that is not your intent.
 
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