Make you wonder if CAS got industrial players support when they started their EUV research more than 15 yrs ago what would be the scenario. Maybe tech war would be unnecessary from US side.
Chinese semiconductor industry
- Thread starter Hendrik_2000
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That sounds very good for an early prototype, if that's the value at intermediate focus. Do they clarify that detail?
250W at intermediate focus was widely considered a prerequisite to start high volume manufacturing. ASML EUV systems hit 250W in 2017:
I think it's only the EUV power not the collector IF power. To achieve 250W at IF point they need to crank more EUV power.
For ASML euv light generation unit is several room sized. Its so gigantic .
For Harbin DPP EUV module is research unit and it is not very big.
It's just typical white man gaslighting strategy.
From personal experience, only way to counter is a punch in the face.
Perhaps if they actually invested in R&D instead of stock buybacks then they would come up with more patents.
To accuse China for decreased R&D is BS. Chinese semiconductor industry isn't even that large yet. South Korea has a larger industry.
Then there's US companies going on merger and acquisition sprees. That also typically leads to reduced R&D spending as products lines are reduced or eliminated. Had Qualcomm bought NXP, or if NVIDIA purchases ARM what do you think will happen to overlapping product lines?
To accuse China for decreased R&D is BS. Chinese semiconductor industry isn't even that large yet. South Korea has a larger industry.
Then there's US companies going on merger and acquisition sprees. That also typically leads to reduced R&D spending as products lines are reduced or eliminated. Had Qualcomm bought NXP, or if NVIDIA purchases ARM what do you think will happen to overlapping product lines?
As far as i know Harbin Institute currently has a Full Sized Model DPP EUV Light Source that produces at least 150W at Intermediate Focus.
This or any improved models will be used in a future production EUVL.
Generally speaking the DPP Light Source Unit is much smaller and compact compared to a LPP Light Source Unit.
It is also cheaper to build and operate which probably attracted the developers at the CAS.
@WTAN @Oldschool looks like a 28nm chips to me. The chip was released by the China Electronics Technology Group Corporation No.38 Institute.
rom CnTechPost
A Chinese research institute released a high-performance 77 GHz millimeter wave chip and module on February 17, with a detection distance of 38.5 meters, setting a new global record for the longest detection distance of a millimeter-wave packaged antenna.
The chip was released by the China Electronics Technology Group Corporation No.38 Institute in 2021 International Solid-State Circuits Virtual Conference ( ISSCC), and for the first time, two 3-transmitter, 4-receiver millimeter-wave chips, and 10-way millimeter-wave antennas were integrated in a single package, according to the .
It implements a multi-channel millimeter-wave radar transceiver front-end in a 24 mm × 24 mm space and creatively proposes a dynamically tunable fast broadband chirp signal generation method.
The chip also uses multi-feed antenna technology in the package to substantially increase the effective radiation distance of the package antenna, providing a small size and low-cost solution for proximity smart sensing, the report said.
It uses a CMOS process to integrate three transmit channels, four receive channels, and radar waveform generation in a single chip, which has special advantages in terms of fast broadband radar signal generation and supports multi-chip cascading and building larger radar arrays.
Fan-out-based wafer-level packaging is a mainstream implementation of packaged antennas, and major international companies have developed chip products with integrated packaged antennas based on this technology.
The institute will further optimize the millimeter-wave radar chip and change it according to the expansion of application requirements and technological advances to provide a one-stop solution for specific application scenarios.
ISSCC is considered the "Olympics" in the field of integrated circuits and was founded in 1953 by Bell Labs, which invented the transistor, and other organizations. In its 60-year history, many milestone inventions in the history of integrated circuits have debuted here
rom CnTechPost
China-made millimeter wave chip sets world record for detection distance
February 19, 2021
A Chinese research institute released a high-performance 77 GHz millimeter wave chip and module on February 17, with a detection distance of 38.5 meters, setting a new global record for the longest detection distance of a millimeter-wave packaged antenna.
The chip was released by the China Electronics Technology Group Corporation No.38 Institute in 2021 International Solid-State Circuits Virtual Conference ( ISSCC), and for the first time, two 3-transmitter, 4-receiver millimeter-wave chips, and 10-way millimeter-wave antennas were integrated in a single package, according to the .
It implements a multi-channel millimeter-wave radar transceiver front-end in a 24 mm × 24 mm space and creatively proposes a dynamically tunable fast broadband chirp signal generation method.
The chip also uses multi-feed antenna technology in the package to substantially increase the effective radiation distance of the package antenna, providing a small size and low-cost solution for proximity smart sensing, the report said.
It uses a CMOS process to integrate three transmit channels, four receive channels, and radar waveform generation in a single chip, which has special advantages in terms of fast broadband radar signal generation and supports multi-chip cascading and building larger radar arrays.
Fan-out-based wafer-level packaging is a mainstream implementation of packaged antennas, and major international companies have developed chip products with integrated packaged antennas based on this technology.
The institute will further optimize the millimeter-wave radar chip and change it according to the expansion of application requirements and technological advances to provide a one-stop solution for specific application scenarios.
ISSCC is considered the "Olympics" in the field of integrated circuits and was founded in 1953 by Bell Labs, which invented the transistor, and other organizations. In its 60-year history, many milestone inventions in the history of integrated circuits have debuted here
I have sample matrix for DPP EUV power and IF power. When I read their article, I was under the impression they are referring to EUV power but I could be wrong.
Anyway, after Huawei owner talked with CAS, the chairman of CAS promised promised to deliver a solution.
I guess, the ball has the getting rolling and bring everyone onboard to draw out a spec for EUV industrial grade product.
Institution like CAS, industrial players like smee, CETC, hauwei, .smic etc.
Have you heard anything on the enhancement spec of the next EUV equipment from CAS, Harbin institute, Chanchun institute of optics..
Are they targeting 7nm ?
Smee and cetc has to make preparations for this product development.
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Good. China car industry has one less dependent on foreign chips.@WTAN @Oldschool looks like a 28nm chips to me. The chip was released by the China Electronics Technology Group Corporation No.38 Institute.
rom CnTechPost
China-made millimeter wave chip sets world record for detection distance
February 19, 2021
A Chinese research institute released a high-performance 77 GHz millimeter wave chip and module on February 17, with a detection distance of 38.5 meters, setting a new global record for the longest detection distance of a millimeter-wave packaged antenna.
The chip was released by the China Electronics Technology Group Corporation No.38 Institute in 2021 International Solid-State Circuits Virtual Conference ( ISSCC), and for the first time, two 3-transmitter, 4-receiver millimeter-wave chips, and 10-way millimeter-wave antennas were integrated in a single package, according to the .
It implements a multi-channel millimeter-wave radar transceiver front-end in a 24 mm × 24 mm space and creatively proposes a dynamically tunable fast broadband chirp signal generation method.
The chip also uses multi-feed antenna technology in the package to substantially increase the effective radiation distance of the package antenna, providing a small size and low-cost solution for proximity smart sensing, the report said.
It uses a CMOS process to integrate three transmit channels, four receive channels, and radar waveform generation in a single chip, which has special advantages in terms of fast broadband radar signal generation and supports multi-chip cascading and building larger radar arrays.
Fan-out-based wafer-level packaging is a mainstream implementation of packaged antennas, and major international companies have developed chip products with integrated packaged antennas based on this technology.
The institute will further optimize the millimeter-wave radar chip and change it according to the expansion of application requirements and technological advances to provide a one-stop solution for specific application scenarios.
ISSCC is considered the "Olympics" in the field of integrated circuits and was founded in 1953 by Bell Labs, which invented the transistor, and other organizations. In its 60-year history, many milestone inventions in the history of integrated circuits have debuted here
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