Chinese semiconductor industry

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Nutrient

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@WTAN Thanks for the info, @localizer I read that news as well, their savior is the SMIC N+2 , but is good only for the mid range phone, a big IF SMIC is able to mass produced it this year. So Its the end of the line for the P and Mate series of phone , its sad I'm really looking forward of replacing my P30 PRO with a P50 PRO, well I think I'll have to wait until 2024, with the current economic situation, It gave me a reason to wait. ;)

Huawei's phones are not necessarily dead. The main benefits of 7nm and 5 nm CPU chips are (1) higher speed and (2) lower power consumption.

In my opinion, phones are more than fast enough already; I don't need a faster unit. In addition, Huawei's Harmony OS should make a 14 nm CPU run faster than a 5 nm Android phone.

Power consumption is less important. In nearly all phones, the screen consumes 70% to 80% of the power; if you could somehow make the CPU consume zero energy, you would make the battery last only 20% to 30% longer. So the power consumption of the CPU is of secondary importance; a 14 nm device is more than good enough.
 

Oldschool

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A little more about China first generation 30nm EUV lithography equipment .

Chanchun institute of optics and Harbin institute had worked on this EUV research and project more than 15 years.

Without this early background work and if China just start the EUV research now because of recent sanctions it would be a very Longshot scenario. I would say mission Impossible if they started now from scratch.

Because of early research and actual first gen prototype, chance of success for industrial enhancement and adoption is quite high


So, the future EUV lithography for industrial usage will most likely retain this prototype shape , or vessel vaccum chamber and layout of the cooling system around the chamber, and layout precision stage, mask and the type of pumps bring used.

The resolution enhancement will come from better optical pieces.

EUV and DUV right now are going in parallel track. By the time smee has 7nm DUV,. 7nm EUV may come out at the same time.
 
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WTAN

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A little more about China first generation 30nm EUV lithography equipment .

Chanchun institute of optics and Harbin institute had worked on this EUV research and project more than 15 years.

Without this early background work and if China just start the EUV research now because of recent sanctions it would be a very Longshot scenario. I would say mission Impossible if they started now from scratch.

Because of early research and actual first gen prototype, chance of success for industrial enhancement and adoption is quite high


So, the future EUV lithography for industrial usage will most likely retain this prototype shape , or vessel vaccum chamber and layout of the cooling system around the chamber, and layout precision stage, mask and the type of pumps bring used.

The resolution enhancement will come from better optical pieces.

EUV and DUV right now are going in parallel track. By the time smee has 7nm DUV,. 7nm EUV may come out at the same time.
Nice Video by CAS on the EUV Components.
Looks like the CAS is revealing more of its EUV Research to the public now through this Video.
Usually when they do this, there has been some progress in EUV development.
 

ansy1968

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@WTAN @Oldschool

I'm not an engineer by profession, but watching the video and comparing it to ASML EUVL, The Chinese concept design is simpler and different? because its an experimental machine? or maybe with future refinement will be similar in design? your opinion please?


Image for post

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An illustration of the open TWINSCAN NXE:3350B ©ASML
How it works
A lithography system essentially is a projection system. Light is projected through a blueprint of the pattern that will be printed (known as a ‘mask’). Optics focus the pattern onto the silicon wafer, which has earlier been coated with a light-sensitive chemical. When the unexposed parts are etched away, the pattern is revealed. The tricky thing with EUV light is that it’s absorbed by everything, even air. That’s why an EUV system has a large high-vacuum chamber in which the light can travel far enough to land on the wafer. The light is guided by a series of ultra-reflective mirrors, made by our German partner Carl Zeiss. But EUV light is also notoriously hard to generate. An EUV system uses a high-energy laser that fires on a microscopic droplet of molten tin and turns it into plasma, emitting EUV light, which then is focused into a beam.
 
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nlalyst

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This is the first generation of EUV system developed. It started 2009 and completed in 2017. Its resolution is about 32nm.
They do have some back ground on this. Its not like they doing EUV from scratch now.

They could really speed it up if companies like Huawei, ZTE, SMIC sponsoring them and adopting the system in the industry a while back, before they got hit by sanctions. Maybe have to thank Trump otherwise all their research is just research , stashed in the lab.

...
Could you please clarify what in particular they achieved or what part of the system were they working on? Judging from the pictures alone, and the text's focus on '32nm lithography', their work doesn't seem to be related to EUV light generation.
 

WTAN

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@WTAN @Oldschool

I'm not an engineer by profession, but watching the video and comparing it to ASML EUVL, The Chinese concept design is simpler and different? because its an experimental machine? or maybe with refinement will be similar in design? your opinion please?


Image for post

Image for post

An illustration of the open TWINSCAN NXE:3350B ©ASML
How it works
A lithography system essentially is a projection system. Light is projected through a blueprint of the pattern that will be printed (known as a ‘mask’). Optics focus the pattern onto the silicon wafer, which has earlier been coated with a light-sensitive chemical. When the unexposed parts are etched away, the pattern is revealed. The tricky thing with EUV light is that it’s absorbed by everything, even air. That’s why an EUV system has a large high-vacuum chamber in which the light can travel far enough to land on the wafer. The light is guided by a series of ultra-reflective mirrors, made by our German partner Carl Zeiss. But EUV light is also notoriously hard to generate. An EUV system uses a high-energy laser that fires on a microscopic droplet of molten tin and turns it into plasma, emitting EUV light, which then is focused into a beam.
It is just an experimental design to verify that they have mastered the basic technologies behind EUV.
I think it will be refined and miniaturised and eventually end up being more compact.
Whether it will look exactly like this ASML Model is a big question?
This First Prototype machine probably used a Low Powered Light Source and had 2 Mirror Optics. It would be considered a 28nm to 32nm Node EUV Lithograph. It can produce for eg 28nm or 32nm Chips with a single exposure.
I believe Changchun is developing 4 Mirror Optics and using a 150W+ DPP EUV Light Source for the Production Model. They are still working on the Optics currently as far as i know.
 

WTAN

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More information on the EUV Prototype from the Changchun Institute Website.

Key technologies of extreme ultraviolet lithography has past the final acceptance
In June 21, 2017, the final acceptance meeting of “the research on the key technologies of extreme ultraviolet(EUV) lithography”, which is one project of the “Manufacturing equipment and complete process of very large scale integrated circuit” project supported by National Science and Technology Major Project of the Ministry of Science and Technology of China, was held in Changchun Institute of Optics, fine Mechanics and Physics, Chinese Academy of Sciences(CIOMP). The office of administration for implementing major project organized the meeting. The panel experts fully recognized the achievements of the project and approved the final acceptance of the project. The successful implementation of the project is an important step forward in the development of Chinese EUV lithography technology.

EUV lithography is a kind of projection lithography using the 13.5nm wavelength light. It is a reasonable extension of traditional lithography towards shorter wavelength. As the next generation of lithography, EUV lithography has been entrusted with the mission to save Moore's law. EUV lithography technology represents the highest level of applied optics. As a prospective research, this project consists of project indicators with highest standards, technical difficulties with tremendous bottlenecks, high innovation, as well as the serious technical blockade from developed countries.

Since 1990s, CIOMP has been focused on the research of EUV/X-ray imaging technology, especially in EUV light source, ultra-smooth surface polishing technology, EUV multilayer and correlation technology. And those aforesaid techniques form the applicative foundation of EUV optics. In 2002, the first EUV lithography prototype in China was developed, which verified the EUV lithography in principle. In 2008, EUV lithography technology was listed as a key research task in "32-22nm equipment technology forward-looking research" by the major project. CIOMP carried out the project of “The research on the key technologies of extreme ultraviolet lithography” as a leading organization, together with partners such as CAS Institute of Optics and Electronics, CAS Shanghai Institute of Optics and Fine Mechanics, CAS Institute Microelectronics, Beijing Institute of Technology, Harbin Institute of Technology, Huazhong University of Science and Technology.

The research team insisted the scientific spirit of perseverance, concentrates on the research, and accumulates propound knowledge. With eight years’ hard work, they have mastered a series of core technologies that limit the development of Chinese EUV lithography, such as ultrahigh accuracy aspheric mirror fabrication and testing, EUV multilayer, projection system integration and test, etc. A two-mirror EUVL objective system with the wave-front aberration better than 0.75 nm RMS was developed successfully, and a EUV lithography exposure apparatus was constructed. Using the apparatus, they achieved the first photoresist exposure pattern with 32 nm linewidth by EUV lithography in China. They established a relatively perfect research and development platform for key technology of exposure optical system, complete successfully the research contents and tasks of national major project, achieve leapfrog development in EUV optical imaging technology, and enhance significantly the core technologies of Chinese EUV lithography. At the same time, the implementation of the project contributed the establishment of a stable research team, and trained talents for our country to achieve sustainable development in the next generation lithography technology.
 

ansy1968

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It is just an experimental design to verify that they have mastered the basic technologies behind EUV.
I think it will be refined and miniaturised and eventually end up being more compact.
Whether it will look exactly like this ASML Model is a big question?
This First Prototype machine probably used a Low Powered Light Source and had 2 Mirror Optics. It would be considered a 28nm to 32nm Node EUV Lithograph. It can produce for eg 28nm or 32nm Chips with a single exposure.
I believe Changchun is developing 4 Mirror Optics and using a 150W+ DPP EUV Light Source for the Production Model. They are still working on the Optics currently as far as i know.
Thanks @WTAN , sorry for being a nuisance, I really appreciate your effort in educating me about the inner workings of the Semiconductor industry. :)
 
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