sorry, unrelated post...
Kirin 9000s chip is based on PC architecture..
1 big core, 8 small cores, 12 threads
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Fifth row is hyper threading
sorry, unrelated post...
Kirin 9000s chip is based on PC architecture..
1 big core, 8 small cores, 12 threads
View attachment 117963View attachment 117964
This chart is faked .
seriously amazing here. Looks like a lot of progress made and their revenue is up YoY more than AMECKingSemi income up 37% and R&D up 80%
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Tools for 28nm and smaller size nodes already reached mainstream levels and had been verified by their costumers.
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After its release in December 2022, the company's third-generation immersion-type high-capacity glue-coating and developing equipment platform architecture FT300 (Ⅲ) has been widely recognized by downstream customers. During the reporting period, the company further improved and optimized the third-generation platform architecture and internal cavity unit. In the future, the platform architecture will be fully backward compatible with ArF, KrF, I-line, offline and other processes as a universal architecture. The company has also made good progress in high-end offline equipment. Among them, the ultra-high temperature baking Barc equipment has achieved repeated orders from customers; the SOC equipment used in other spin-coating processes has been introduced by customers. It replaces the traditional filling process and effectively expands the product application field and market space of the glue developing machine. (2) Since its release in 2018, Qiandao Physical Cleaning Equipment Co., Ltd., Spin Scrubber, a Qiandao physical cleaning machine, has quickly broken the foreign monopoly and established a leading advantage in the domestic market by virtue of its advantages of high production capacity, high particle removal capacity, and high cost performance.
A spokeswoman for the company said ASML will be able to continue to ship the products in its NXT:2000i and more advanced DUV models, which fell under the restrictions as of Sept. 1, for the remainder of 2023.
There may have been an error in my previous posting, but my edit button seems to have disappeared, so I had to make a new post.This chart is faked .
In the Geekbench 5.1.0 tests I found with exact source.
Kirin 9000s without SMT:Single-Core Score:993,Multi-Core Score:3738 (white review )
Kirin 9000s With SMT on:Single-Core Score:1007,Multi-Core Score:4025(phone on air purifier, Geekerwan Geekerwan
SMT improves the Multi-Core Score by about 7.68%, while SMT does not result in single-core performance gains.
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there is a lot of claims left and right these days on weibo and such. I would advise that we all just wait for a few weeks and more solid data will come outThere may have been an error in my previous posting, but my edit button seems to have disappeared, so I had to make a new post.
Supposedly Geekbench version 5.1.0 recognizes SMT, and the 3738 score is also the score run with SMT turned on. The multi-core score increase from 3738 to 4025 seems to be just due to heat dissipation.
It also confirms that Huawei is getting into advance packaging (Chiplets, 2.5D and 3D) and MEMSseriously amazing here. Looks like a lot of progress made and their revenue is up YoY more than AMEC
Except for CXMT, all other major players seem to be using them
there we got RX6003 series is an RF chip for tiantong-1根据芯智讯在万方数据上查询的信息显示,RX6003这款射频收发芯片似乎与广州润芯信息技术有限公司有关。
该公司于2022年12月7日在万方数据上出版了一篇题为《面向天通一号卫星移动通信系统FDD终端的收发隔离设计》的论文,其中就提到了射频收发芯片RX6003。
根据企查查资料显示,广州润芯信息技术有限公司,成立于2008年,位于广东省广州市,是一家以从事研究和试验发展为主的企业。其控股股东为海格通信,持股50.69%。
yes, rather than people obsessing over whether or not Huawei is producing 7nm chips, effort will be better spent on figuring out what these fabs they are partnering up or buying are actually producingIt also confirms that Huawei is getting into advance packaging (Chiplets, 2.5D and 3D) and MEMS