Chinese semiconductor industry

Several research results of K9000S
I won't post a dieshot for the time being, instruction from the above.

1. The CPU architecture that has never been seen before, supports hyper-threading, and the basic cache is 64/(512)1024/4096
2. The never-before-seen GPU architecture, 4CU, is similar to the future desktop (server) GPU architecture
3. Hugely advanced 5G communication technology integrated baseband
4. Diesize is slightly larger than K9000, about 110mm²

Let's discuss it again in the future. The amount of information is too large.

Chinese scientists have successfully used 2D materials to make 12-inch wafers, an important technology that complements traditional silicon-based chips. The breakthrough of this new atomic-thickness semiconductor material paves the way for the transition to the next generation of semiconductor technology.

In collaboration with Liu Can, a professor at Renmin University of China, and Zhang Guanyu, a researcher at the Institute of Physics of the Chinese Academy of Sciences, Liu Kaihui's team developed this manufacturing strategy in Beijing and verified it at Songshan Lake Materials Base Laboratory in Dongguan On July 30

tonyget said:

The satellite communication chip on Mate60pro，anybody recognize which company's chip it is？


View attachment 117877

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According to an article on IT Times, CETC was responsible for this. Huawei collusion with Chinese military confirmed!

siegecrossbow said:

According to an article on IT Times, CETC was responsible for this. Huawei collusion with Chinese military confirmed!

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US: Quick! We need to sanction Huawei and CETC for this!

Oh wait...

PopularScience said:

Several research results of K9000S
I won't post a dieshot for the time being, instruction from the above.

1. The CPU architecture that has never been seen before, supports hyper-threading, and the basic cache is 64/(512)1024/4096
2. The never-before-seen GPU architecture, 4CU, is similar to the future desktop (server) GPU architecture
3. Hugely advanced 5G communication technology integrated baseband
4. Diesize is slightly larger than K9000, about 110mm²

Let's discuss it again in the future. The amount of information is too large.

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This guy thinks the new chip is from a ASML 1980Di with brand new CPU and GPU structure

Psyclonus said:

This guy thinks the new chip is from a ASML 1980Di with brand new CPU and GPU structure

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IF true then Huawei FAB it using second hand machine. PXW in Shenzhen come to mind?

ansy1968 said:

如果属实，那么华为 FAB 它使用的是二手机器。想到深圳的 PXW 吗？

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so at now, based on all known information, the most possible deduction is huawei has its own FAB, maybe use some second had machine?

Psyclonus said:

so at now, based on all known information, the most possible deduction is huawei has its own FAB, maybe use some second had machine?

Click to expand...

Speculation on my part BUT the evidence are there, there are reports that the Chinese purchased a lot of second hand equipment and Huawei had secretly set up PXW to FAB its chip, So we have to connect the dot to make our conclusion. Frankly I believed that Huawei use a 3 prong approached as urgency dictates. One using old ASML duvi with cooperation and coordination with ICRD (they have a NXT 1980i machine for research purposes), or using SMIC and the third one is that they had received a SMEE SSA800 DUVi unit and proceed to test, evaluate and verify the machine.

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Apr 20, 2022 — TOKYO -- Prices of secondhand chipmaking machines have soared over the past two years on ravenous demand,
especially in China, ...






Nov 3, 2020 — The wafer fab is set to be run on behalf of Huawei by Shanghai IC R&D Center (ICRD), a chip research company funded by the Shanghai municipal ...

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Aug 23, 2023 — Huawei, PXW, Fujian Jinhua and the other companies identified by SIA ... The SIA estimates there are at least 23 fabrication facilities in ...

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Aug 23, 2023 — Huawei is looking forward producing DRAMs, logic, microcontrollers, ... s (PXW) fab that specializes on image sensors and RF chips; ...

Will people please stop with this HW fabbing SoC nonsense. This is fab'd at SMIC.

btw, also 2035 claim doesn't make sense to me. SMIC hasn't started its 7nm production back in 2020 yet. It's 14nm process was also not mature. It makes far more sense to me that most of these chips were fabbed last year to start of this year.

if they have 2050i, why would they not use it for their 7nm process? Where do people get these 1980Di claims from? Sure, 1980Di may be part of the process, but it's not going to be used for the most critical layer.