The development of equipment has been localized, and Hunan has made breakthroughs in semiconductor technology research.
According to the Hunan Daily, among the top ten technical research projects in Hunan Province in 2021, the two projects of "Key Technology Research for the Localization of Third-Generation Semiconductor Core Equipment" and "8-inch Integrated Circuit Complete Equipment" have successfully passed the comprehensive inspection.
According to the report, the "Key Technology Research of the Localization of Third-Generation Semiconductor Core Equipment" project was undertaken by the 48th Research Institute of China Electronics Technology Group Corporation. The project has broken through key technologies such as 6-inch SiC (silicon carbide) epitaxial growth equipment and high-temperature high-energy ion implantation machine process performance, production capacity, stability, and reliability improvement.
The project has realized the localization and engineering of 6-inch SiC epitaxial growth equipment and SiC high-temperature high-energy ion implantation machine. The equipment meets the requirements of large-scale mass production process and has the ability of industrial application. It is reported that the research and development equipment has been successfully launched and applied to domestic third-generation semiconductor head users.
The "8-inch integrated circuit complete set of equipment" project is jointly undertaken by the 48th Research Institute of China Electronics Technology Group Corporation and Hunan Chuwei Semiconductor Technology Co., Ltd. Through the collaborative innovation of domestic equipment, technology and products, the project has made breakthroughs in key technological breakthroughs such as vertical furnace tubes and silicon epitaxy equipment, completed process verification, and realized industrialized production.
At present, the project has completed the online verification of 43 sets (sets) of domestic core process equipment, and the localization rate of the entire line of process equipment has reached 95%. The current production line has reached a production capacity of 20,000 pieces per month, and the chip yield rate has reached 98%.
