SEMICON CHINA, equipment and material companies support the development of semiconductors.
1. Nanjing Yili Xinchuang Semiconductor Technology Co., Ltd.
In this SEMICON, Nili Xinchuang exhibited a whole series of defoaming product families represented by vacuum pressure defoaming system and wafer-level vacuum lamination system, intelligent packaging defoaming equipment and vacuum lamination equipment.
2. Festo (China) Co., Ltd.
Festo itself is involved in fields such as semiconductors, solar energy, biotechnology and pharmaceuticals, chemicals, water treatment, food and packaging industries, as well as rapidly developing medical technology and laboratory automation.
3. Heraeus Group
At this SEMICON, Heraeus’ products worthy of attention include water-soluble zero-halogen adhesive flux AP500X, and electromagnetic shielding solutions for 5G technology.
4. Drow Semiconductor
Zall's products mainly focus on chip sorting machines, automatic MGP plastic packaging Molding, SSC module trim form systems and other equipment. Among them, the high-speed and high-precision chip sorter can support 0.3*0.3~25*25mm chips, the highest UPH14000, the equipment accuracy is ±10um, and the angle is ±0.5°.
5. Mettler Toledo Technology (China) Co., Ltd.
METTLER TOLEDO's products in the field of semiconductors include solutions for the semiconductor industry in testing laboratories, PowerCellPDX digital weighing modules + RapidCal rapid calibration device combinations, and solutions at the factory and process levels.
6. Anhui Naike Equipment Technology Co., Ltd.
Anhui Naike Equipment is mainly engaged in the R&D, production and sales of intelligent manufacturing equipment used in the fields of plastic extrusion molding and semiconductor packaging.
7. Shanghai Guangchuan Technology Co., Ltd.
Guangchuan Technology is a Chinese-controlled high-tech enterprise jointly invested and established by Shenyang Fuchuang and Yaskawa Group, focusing on the research and development, manufacturing and sales of semiconductor robots and complete sets of transmission equipment. Products cover semiconductor wafer transfer atmospheric robot, semiconductor wafer transfer vacuum robot, semiconductor equipment front-end automation equipment EFEM, Sorter, vacuum platform, motion control and a complete set of wafer transfer solutions.
8. Upward Software (Shanghai) Co., Ltd.
This time semicon Shangyang Software presented its myCIM semiconductor CIM full-stack solution and Fully Auto CIM solution..
9. Shanghai Guona Semiconductor Technology Co., Ltd.
Ye Ying, the founder of Gona Semiconductor, introduced the Gona booth. Gona focuses on the segmented field of "wafer transfer". During SEMICON, Gona demonstrated its leading position in the fields of wafer front-end transfer module (EFEM), wafer sorter (SORTER), wafer storage system (STOCKER), and shared the latest research results and technological innovations.
10. Suzhou Huaxing Yuanchuang Technology Co., Ltd.
During this SEMICON, Huaxing Yuanchuang demonstrated SoC test solutions and PXIe platform detection solutions. It is worth noting that the T7600 SoC tester is an ultra-large-scale digital-analog hybrid test device, which adopts the latest chip technology and repeated simulation and optimization.
11. Shenzhen Liande Semiconductor Technology Co., Ltd.
At this SEMICON, Liande Semiconductor exhibited high-speed eutectic machines, soft solder die bonding machines, Mini LED wafer expanders, QFN lead frame front film attachers, etc. According to reports, Liande Semiconductor has deeply cultivated and laid out the five core technologies of "visual optics, artificial intelligence, precision machinery, software development, and electrical design".
12. Sidian Semiconductor Equipment (Shenzhen) Co., Ltd.
Silicon Electric exhibited a new generation of self-developed 12-inch automatic probe station-PT-930 and 8-inch automatic probe station-PT-9200.
13. CETC Electronic Equipment Group Co., Ltd.
At this exhibition, Dianke Equipment concentratedly displayed key core equipment such as ion implanters, chemical mechanical polishing, wet cleaning, vertical furnaces, and thinning and scribing. Among them, a full range of ion implanter products such as medium beam current, large beam current, high energy and third-generation semiconductors have been formed, full coverage of 28nm process has been realized, 300mm chemical mechanical polishing equipment has entered the mainstream production line, high-performance wafer cleaning and drying technology has reached the international advanced level, wet-process whole-line equipment has reached a new level, thinning equipment has successfully achieved ultra-precision grinding of silicon carbide wafers below 100 microns,
14. Kulicke & Soffa
K&S released the POWERCOMMTM POWERNEXXTM new generation ball welding machine and several consumable products at this exhibition; displayed the AsterionTM wedge welding machine with HPI high-power interconnection function;