Chinese semiconductor industry

Jiaxin Semiconductor's 109-acre industrial park will complete all completion and acceptance this year​

Jiaxin Semiconductor will complete the completion and acceptance in 2023, and will become the largest industrial park in East China with a factory area of 140,000 square meters. One of the important R&D and manufacturing bases of integrated circuit front-end equipment in the region, thus forming a complete range of equipment R&D and manufacturing bases, and further promoting the completion of the core equipment base of the Yangtze River Delta Integrated Development Demonstration Zone.

tokenanalyst said:

View attachment 115479
Another HG. I didn't knew this one, they are becoming a plague and of course he is using a very influencing think tank as a platform for advocating for policy recommendations that could have far reaching consequences for an entire industry that he has nothing to do with. Like in the days before the disaster of the Iraq War, people who have never been in a war advocating for war.


Memory chips don't scale as fast as logic chips, compared to logic chips memory chips scale more linearly, so that give some memories players chance to catch-up, that makes the memory market more even, but also is creating walls for new technologies like AI, also make memory very susceptible to boom burst cycles as players cramp the industry.
The logic market in the other side is unforgiving, it move really fast and that why TSMC is a behemoth because introduce new logic processes quickly and efficiently.
I think Chinese companies could made breakthroughs on memory faster than logic even using mostly domestic tools, they will definitely make breakthroughs with logic as well as we saw with SMIC 7nm process but I think memory and storage will be faster. Jinhua is still alive, kicking and hiring people.

Click to expand...

What are your thoughts about computing in memory as a leapfrog tech? It seems like equivalent transistor density for even a low layer count (~32) 3D NAND chip would be ridiculous compared to planar.

FairAndUnbiased said:

What are your thoughts about computing in memory as a leapfrog tech? It seems like equivalent transistor density for even a low layer count (~32) 3D NAND chip would be ridiculous compared to planar.

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

Click to expand...

Probably why everyone is just going to keep adding layers to NAND right now and will do so with DRAMs in the future

FairAndUnbiased said:

What are your thoughts about computing in memory as a leapfrog tech? It seems like equivalent transistor density for even a low layer count (~32) 3D NAND chip would be ridiculous compared to planar.

Please, Log in or Register to view URLs content!

Please, Log in or Register to view URLs content!

Click to expand...

computing in memory would be an excellent solution for the memory wall problem.

NAND like access compute in memory structures will be pretty nice, the problem is that computation consume more energy than just storage, energy dissipate in heat and a 3D structure heat dissipation becomes complicated even for small structures like GAAFET let alone memory.

MRAM seems like another good option for compute in memory chips.

tokenanalyst said:

Sanan SiC project received 10 billion capital injection​

Recently, Sanan's Chongqing SiC project "big moves" have frequently appeared:

● Construction of a 22.8 billion silicon carbide project with STMicroelectronics (.link.)

● Today, Sanan Optoelectronics announced that they received a capital injection of 10 billion yuan from Chongqing.


On July 4, Sanan Optoelectronics issued the "Announcement Regarding Changes in the Equity Structure of Controlling Shareholders". The announcement stated that Fujian Sanan Group and Chongqing Gaoyong Enterprise Management Partnership (Limited Partnership) signed the "About Xiamen Sanan Electronics Co., Ltd. capital increase agreement."

The agreement stipulates that Chongqing Gaoyong will increase the capital of Sanan Electronics by 10 billion yuan. After the completion of the capital increase, Chongqing Gaoyong will hold 23.13% of the shares of Sanan Electronics, becoming the second largest shareholder.

As of the disclosure date of this announcement, Sanan Electronics has received all the funds for the capital increase, and the industrial and commercial change registration is in process.

Please, Log in or Register to view URLs content!

Click to expand...

More from Sanan


Sanan already has Sic MOSFETs orders exceeding 7B RMB & in negotiation w/ more NEV customers

Sanan invested 16B RMB in Hunan fab, production rate already 15k wpm of Sic & 2k wpm of GaN. Looking to raise SiC to 30k wpm this yr

Hunan plant is a large integrated Sic fab. Looks like it's got plenty of orders on book for even more fab if it wanted

Dongxin shares: LPDDR4x products are being tested on the client side and the import progress is in line with expectations​

Dongxin shares disclosed the latest research summary, saying that the company's self-designed and developed LPDDR4x products have provided samples to customers for testing, and the import progress is in line with expectations.

According to the 2022 annual report, NAND accounts for more than 60% of sales, and DRAM and NOR account for about 6%-7% each. MCP accounts for about 20% of sales.

Among them, the DRAM of Dongxin's standard products is mainly DDR3, and the low-power series are currently mass-produced with LPDDR1, 2 and LPDDR4x products under test, which are currently 25nm process.

In the field of NOR Flash, the company uses the ETOX process, and on the basis of the ETOX process, develops a larger-capacity NOR Flash to further expand the application fields such as industrial and telecommunication equipment.

Dongxin shares pointed out that the company has a layout of automotive-grade storage products in both the NAND and NOR fields, and related products are in the process of active research and development and introduction. The introduction of automotive-grade memory generally requires product production certification, platform certification used by customers, first-tier supplier certification, and final overall vehicle factory certification, which takes a long time.

The MCP of Dongxin Co., Ltd. is mainly used as a module customer, and its demand is relatively stable. It is used in industrial, automotive and other fields. From the perspective of the application market, the 5G module is an incremental market, and the future market demand will grow exponentially; with the transition from 3G and 4G to 5G, the unit price and capacity of MCP are also increasing. In the field of 3G and 4G, more customers use 1Gb NAND+1Gb LPDDR2, 4Gb NAND+2Gb LPDDR2 is used at most, and in the 5G field, the initial configuration of customers is 4Gb NAND+4Gb LPDDR4.

Dongxin shares said that the company's MCP applications mainly include feature phones, IoT M2M modules, etc. The requirements for the MCP of the products in these applications are to ensure long-term supply, such as 5-10 years or even longer.

Rogers invested more, and the high-power semiconductor ceramic substrate project signed a contract with Suzhou Industrial Park​

According to the news from Rogers Corporation, the planned total investment of the project is 100 million U.S. dollars, with an initial investment of 30 million U.S. dollars. It is planned to be completed and put into use next year. After the project is put into production, Rogers Suzhou will become the only base in the world that owns the R&D and manufacturing of all the Group's products outside the Rogers US headquarters.

Rogers pointed out that ceramic substrate, an advanced base material, will be the core material of the third-generation power semiconductor module. It has reliable applications in new energy vehicles and renewable energy industries, and it is bound to become a new growth point for Rogers.

It is reported that in 2002, Rogers officially settled in Suzhou Industrial Park. For more than 20 years, Rogers has gone from a manufacturing base with a single production line to a factory with a full range of products such as foam, busbars, high-frequency circuit boards, and high-power semiconductor ceramic substrates. During this period, it also carried out strategic mergers and acquisitions to expand its business The territory has gradually become a comprehensive Asia-Pacific regional headquarters based on manufacturing, integrating procurement, logistics, finance, personnel, information technology, legal affairs and other services and management.

In June this year, Suzhou Mayor Wu Qingwen met with Rogers Global President and CEO Colin Gouveia. Colin Gouveia said that Rogers will continue to be optimistic about the development prospects in Suzhou. Thanks to the government for its support, Rogers will seize development opportunities, accelerate investment layout, and contribute to the high-quality development of new energy vehicles and other industries.

The first EDA tool that supports PCIe Gen5 prototype verification is launched on the market, accelerating AI design with high performance​

On July 4, 2023, S2C, a well-known digital front-end EDA supplier in the industry, released the latest generation of prototype verification solution-Shentong Logic System S8-40. In addition to supporting PCIe Gen5, the new product also has a wealth of connection options, massive data transmission bandwidth, and complete prototype verification supporting tools, providing an effective solution for current large storage and big data designs such as AI and GPU chips.
On July 4, 2023, Sierxin (S2C), a well-known digital front-end EDA supplier in the industry , released the latest generation of prototype verification solution - Xinshentong Logic System S8-40. In addition to supporting PCIe Gen5, the new product also has a wealth of connection options, massive data transmission bandwidth, and complete prototype verification supporting tools, providing an effective solution for current large storage and big data designs such as AI and GPU chips.

More and more official comments about semiconductor by China, it looks like China is going to start making countersanctions like in the trade war when Trump came to power

tphuang said:

Probably why everyone is just going to keep adding layers to NAND right now and will do so with DRAMs in the future

Click to expand...

It is just a matter of time that NAND will have 1024 layers ... my guess is before 2030 .... so 10-20 TB SSD will be common by then and cheaper than HDD .. especially if CHina is leading in SSD technology and manufacturing