Chinese semiconductor industry

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tphuang

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Horizong Robotics has launched Sunrise 3, dual core BPU w/ quad core CPU (A53) as part of its Developer Kit module
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It can do 5 TOPS. Also released TogetheROS.Bot robot OS 2.0 into Github, supporting many robotic calculation & acceleration usage

Looks like a good way to get new developers to write software into its platform
 

tokenanalyst

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The Institute of Microelectronics has made progress in the research of Chiplet thermal simulation models and tools​


In the post-Moore era, silicon-based CMOS technology , which relies on size reduction to improve device integration , is facing huge challenges in physical principles and process technology. Chiplet technology with high performance, low power consumption, and low cost advantages has become one of the important choices to continue Moore's Law. This technology uses advanced packaging technology to integrate multiple heterogeneous chips into a system chip with specific functions, so as to meet the application requirements of artificial intelligence and other fields. However, due to the substantial increase in chiplet heterogeneous integration density, the problem of heat dissipation poses severe challenges to the reliability of heterogeneous systems. How to propose a new thermal analysis method for the complexity of chiplet heterogeneous integrated systems, realize high-precision packaging thermal simulation and heat dissipation structure design, and develop thermal simulation models and tools that adapt to chiplet application scenarios have become important in the field of chiplet thermal analysis. direction.

  Based on the above problems, the multi-physics field simulation research group of the EDA Center of the Institute of Microelectronics proposed a general equivalent thermal conduction analysis method and An improved alternating-direction implicit floating-point optimization algorithm. By quickly and accurately solving the discrete equation of the ultra-large-scale sparse matrix , the simulation model and calculation process of the transient heat flow in the heterogeneous integration of core particles in a three-dimensional grid type were constructed for the first time. On this basis, the research group further extended it to a larger-scale and scaled heterogeneous integrated temperature simulation. The above model and solver can realize the efficient and accurate simulation of the transient heat flow of the chiplet heterogeneous integrated system, and lay the core technical foundation for the development of the chiplet heterogeneous integrated system temperature hot spot detection tool and the temperature sensing layout optimization algorithm . By improving the numerical discrete format and virtual point construction algorithm on the core particle heat flow simulation model, the efficiency of floating point operations has been increased by 2.74 times. Compared with the finite element method, under the premise of satisfying the calculation accuracy, the calculation efficiency of the Chiplet thermal simulator is increased by 27 times.

  This research was supported by the Strategic Class A pilot project of the Chinese Academy of Sciences, and the research results have been published in the top journal " Applied Thermal Engineering " in the field of thermodynamics (Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration, DOI : 10.1016/j.applthermaleng.2023.120609) and Microelectronics Reliability ( DOI : 10.1016/j.microrel.2022.114790; DOI : 10.1016/j.microrel.2023.115006) journals. Nie Chuanjun and Wang Chenghan, master students of the Institute of Microelectronics, are the first authors of the above-mentioned papers, and associate researcher Xu Qinzhi of the Institute of Microelectronics is the corresponding author of the above-mentioned papers.

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tokenanalyst

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Puru Semiconductor's automotive-grade EEPROM products have been awarded the AEC-Q100 certificate by SGS​


Recently, Puya Semiconductor's automotive-grade EEPROM series products have passed the AEC-Q100 Grade1 automotive-grade high-reliability certification of SGS, an internationally recognized testing, inspection and certification organization. Tong Hongliang, deputy general manager of Pura Semiconductor, Xu Chuangge, senior manager of SGS China Semiconductor and Reliability, and other important guests attended the certificate awarding ceremony. This certification marks that the efforts made by Puya Semiconductor in terms of automotive products have been recognized and affirmed by an international authoritative third-party organization.

AEC-Q100 is a reliability testing standard for automotive electronic components formulated by the Global Automotive Electronics Association. It is an important guideline for parts suppliers in the automotive industry and has a high authority in the global automotive industry. As one of the important members of the AEC (Automotive Electronics Council) Automotive Electronics Committee, SGS has been involved in the testing and certification of automotive electronics products for many years, and has joined AEC-Q100, Q101, Q102, Q103, and Q200 subcommittees to participate in the standard formulation work. With professional technology, rich experience, complete equipment and high-quality service, SGS Semiconductor and Reliability Laboratory has become a professional testing laboratory in China, and has been recognized by China National Accreditation Service for Conformity Assessment (CNAS) and many customers. recognized.

In recent years, the automotive electronic and electrical architecture is rapidly evolving from distributed to domain fusion and centralized control. At the same time, driven by the "new four modernizations" trends of electrification, networking, intelligence, and sharing, memory chips carrying data storage and transmission are becoming an increasingly important part of the development of automotive intelligence. Demand is constantly being released.

According to third-party statistics, NOR Flash downstream automotive electronics has a global market capacity of 1 billion US dollars, and EEPROM has a space of 100 million US dollars, and both have maintained continuous growth.

The automotive NOR Flash application market generally covers a capacity range from 512Kbit to 2Gbit, while EEPROM generally covers a range from 2Kbit to 2Mbit. It is mainly used in ADAS, body control, radar, camera, display, wireless/Bluetooth connection, navigation, BMS and other fields.

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tokenanalyst

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NAURA (002371.SZ): The company’s high aspect ratio etching machine for memory devices has completed research and development, and entered the process testing stage, and various technical indicators have basically met customer requirements

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North Huachuang stated at the performance briefing that the company's etching equipment is aimed at customers such as 12-inch logic, storage, power, and advanced packaging. It has completed mass production verification of hundreds of processes, and the cumulative shipment of ICP etching products has exceeded 2,000 cavities. 8-inch CCP etching equipment has been supplied to the market in batches, and 12-inch CCP etching equipment has entered client verification.
 

tokenanalyst

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Kaide Quartz high-end quartz products industrialization project started​


CapitaLand Quartz held the commencement ceremony of the industrialization project of high-end quartz products. The total investment of the project is 500 million yuan, focusing on building 8-inch and 12-inch high-end quartz component research and development production lines. process.
The project is operated by Beijing Kaixin New Material Technology Co., Ltd. (referred to as: Kaixin New Material), a wholly-owned subsidiary. At present, the new factory of Kaixin New Materials has built two high-end thermal processing and cold processing production lines, which can realize the personalized customization needs of customers for different products. It is understood that Kaide Quartz is a quartz product processing enterprise with a history of more than 20 years. After years of continuous development, it has established a mature and efficient R&D and innovation system, and its technical level is at the domestic leading level.

The company's main business is the production, research and development and sales of quartz glass products such as quartz instruments, quartz pipes, and quartz boats; the company's products are used as production consumables for downstream companies, and are widely used in the field of semiconductor integrated circuit chips, photovoltaic solar energy industry and other fields. In 2022, Kaide Quartz will achieve a total operating income of 182 million yuan, a year-on-year increase of 9.4%; realize a net profit of 53.93 million yuan attributable to the parent company, a year-on-year increase of 35.4%. According to Zhang Kaixuan, general manager of CapitaLand Quartz, the trial production of the company's high-end quartz product industrialization project has gone smoothly. It is expected that the sales and production capacity of high-end quartz products for CapitaLand Quartz Semiconductor will increase steadily in the next few years.

The company's 12-inch high-end product business is gradually improving. This year, the company's 12-inch products mainly complete trial products and small batch orders. The completion of this project will optimize the product structure of Cade Quartz, greatly improve the technical level and production capacity of Cide Quartz, and accelerate the process of localization of quartz components.​

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tonyget

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North Huachuang stated at the performance briefing that the company's etching equipment is aimed at customers such as 12-inch logic, storage, power, and advanced packaging. It has completed mass production verification of hundreds of processes, and the cumulative shipment of ICP etching products has exceeded 2,000 cavities. 8-inch CCP etching equipment has been supplied to the market in batches, and 12-inch CCP etching equipment has entered client verification.

They did not answer the question. The question was "what is the breadth depth ratio of their latest product"
 
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