SMIC: Plans to invest 4.2 billion yuan in the construction of the SMIC Shaoxing Phase III 12-inch wafer manufacturing pilot line project
According to news from Jiwei.com, on the evening of May 31, Shaoxing SMIC Manufacturing Co., Ltd. (hereinafter referred to as "SMIC") issued an announcement that the company's subsidiary SMIC Pioneer Integrated Circuit Manufacturing (Shaoxing) Co., Ltd. (hereinafter referred to as "SMIC") "SMIC Pioneer") and the Management Committee of Shaoxing Binhai New Area signed the "Settling Agreement", and planned to implement the mass production project on the basis of the third phase of the 12-inch pilot project. The SMIC Shaoxing Phase III 12-inch digital-analog hybrid integrated circuit chip manufacturing project with a production capacity of one piece per month.
On the same day, SMIC issued the "Announcement on Signing an Investment Agreement and External Investment". Signed the "SMIC Pioneer Integrated Circuit Manufacturing (Shaoxing) Co., Ltd. Investment Agreement" to invest in the construction of SMIC Shaoxing Phase III 12-inch specialty process wafer manufacturing pilot line project in Shaoxing Binhai New Area, mainly producing IGBT, SJ and other power chips, HVIC (BCD) and other power drive chips, SMIC Pioneer is the main body of the project.
The total investment of SMIC Shaoxing Phase III 12-inch specialty process wafer manufacturing pilot line project is 4.2 billion yuan, of which the registered capital is 3 billion yuan, which is used to build a research and development and monthly production of 10,000 pieces of 12-inch integrated circuit specialty process A pilot test line for small-scale engineering, domestic verification and production verification. The project plans to complete the construction of the pilot line in 2023, and form a technical reserve for the 12-inch power semiconductor device wafer process as soon as possible, and undertake technology transfer and small-scale trial production from 8 inches to 12 inches.
