Chinese semiconductor industry

Status
Not open for further replies.

tphuang

Lieutenant General
Staff member
Super Moderator
VIP Professional
Registered Member
Not news. But I found TIPro7000/7100 on aliexpress.

Problem is they dont seem to ship oversee !?!?

Please, Log in or Register to view URLs content!
Please, Log in or Register to view URLs content!
this shows the problem indicated here
Please, Log in or Register to view URLs content!


Chinese SSDs are getting so cheap that south korean ones can't compete. Why Samsung & SK prices are way down and still can't sell out. If YMTC can increase their production quickly in 2024, we might be seeing a permanent drop in SSD prices.
 

pevade

Junior Member
Registered Member
this shows the problem indicated here
Please, Log in or Register to view URLs content!


Chinese SSDs are getting so cheap that south korean ones can't compete. Why Samsung & SK prices are way down and still can't sell out. If YMTC can increase their production quickly in 2024, we might be seeing a permanent drop in SSD prices.

A year or so ago I bought a 1TB SSD from hikvision and it cost around 899 Yuan. Now that same spec SSD from TiPlus (YTMC) is now 449 Yuan.
 

hvpc

Junior Member
Registered Member
while China semiconductor fabrication sector is growing, rest of the world is not stagnant either.

Japan’s ambition to establish 2nm production capability continues to chug along. If all goes well, they will have 2nm capability before China.
Please, Log in or Register to view URLs content!


so while we celebrate progress in China, just want to remind y’all to have a global perspective and not just flat out assume we are doing better than reality.
 
Last edited:

antiterror13

Brigadier
while China semiconductor fabrication sector is growing, rest of the world is not stagnant either.

Japan’s ambition to establish 2nm production capability continues to chug along. If all goes well, they will have 2nm capability before China.
Please, Log in or Register to view URLs content!

well, yes of course ... like in boxing that your opponent only allow to use one arm, but apparently even with one arm (embargo) still could beat you with the supports of all crowds and coaches
 

tonyget

Senior Member
Registered Member
Please, Log in or Register to view URLs content!

China Breaks Through Restrictions with Advanced Chiplet Strategy: 3D-IC Breakthrough in Chinese Ethereum Miner​


TechInsights Reveals Design of the Jasminer X4 with DBI Hybrid Bonding.
Please, Log in or Register to view URLs content!
to learn more.


TechInsights made a remarkable discovery on the Jasminer X4 Ethereum miner ASIC, developed by China-based crypto mining machine manufacturer Jasminer. This design marks the industry’s first-ever application of DRAM to logic direct bond interconnect (DBI).
TechInsights found hybrid bonding technology in Yangtze Memory Technologies Company’s (YMTC) Xtacking 3.0 architecture, where logic circuits were bonded to a separate wafer with storage cells in their 3D NAND products. Jasminer X4 uses this technology differently—it represents the first instance where the logic circuits have been bonded directly to DRAM.

The Jasminer X4 showcases the ability of a Chinese company, under trade restrictions, to combine matured technologies to create high-performance, cutting-edge applications creatively. A sizable 32 mm × 21 mm logic die employs the earlier XMC (Wuhan Xinxin Semiconductor Manufacturing Co.) planar 40/45 nm CMOS technology. The large die is patterned using two masks, which could represent a design workaround for a reticle constraint. The flip chip is assembled within the package.
Additional findings covered in the Disruptive Event Brief:
  • Xilinx Zynq FPGA on the board containing the Mining ASIC.
  • Jasminer X4 is the first Ethereum miner ASIC to utilize a storage mining design.
To learn more about these findings,
Please, Log in or Register to view URLs content!
and stay tuned for additional findings.
 

tokenanalyst

Brigadier
Registered Member
while China semiconductor fabrication sector is growing, rest of the world is not stagnant either.

Japan’s ambition to establish 2nm production capability continues to chug along. If all goes well, they will have 2nm capability before China.
Please, Log in or Register to view URLs content!


so while we celebrate progress in China, just want to remind y’all to have a global perspective and not just flat out assume we are doing better than reality.
I have my doubts, after a decade of stagnation all the sudden this startup that nobody has ever heard of before will reach the level that took years of trial and error to Samsung and TSMC who have way more resources and talent than this rapidus company. I hope they succeed because I am all for more competition and lower prices but I am a bit skeptical.
I mean research and development and successes in GAAFET in China and even subnanometer transistors is not something unheard before.


 

tokenanalyst

Brigadier
Registered Member
Please, Log in or Register to view URLs content!

China Breaks Through Restrictions with Advanced Chiplet Strategy: 3D-IC Breakthrough in Chinese Ethereum Miner​


TechInsights Reveals Design of the Jasminer X4 with DBI Hybrid Bonding.
Please, Log in or Register to view URLs content!
to learn more.


TechInsights made a remarkable discovery on the Jasminer X4 Ethereum miner ASIC, developed by China-based crypto mining machine manufacturer Jasminer. This design marks the industry’s first-ever application of DRAM to logic direct bond interconnect (DBI).
TechInsights found hybrid bonding technology in Yangtze Memory Technologies Company’s (YMTC) Xtacking 3.0 architecture, where logic circuits were bonded to a separate wafer with storage cells in their 3D NAND products. Jasminer X4 uses this technology differently—it represents the first instance where the logic circuits have been bonded directly to DRAM.

The Jasminer X4 showcases the ability of a Chinese company, under trade restrictions, to combine matured technologies to create high-performance, cutting-edge applications creatively. A sizable 32 mm × 21 mm logic die employs the earlier XMC (Wuhan Xinxin Semiconductor Manufacturing Co.) planar 40/45 nm CMOS technology. The large die is patterned using two masks, which could represent a design workaround for a reticle constraint. The flip chip is assembled within the package.
Additional findings covered in the Disruptive Event Brief:
  • Xilinx Zynq FPGA on the board containing the Mining ASIC.
  • Jasminer X4 is the first Ethereum miner ASIC to utilize a storage mining design.
To learn more about these findings,
Please, Log in or Register to view URLs content!
and stay tuned for additional findings.
Interesting how the mining industry have become a test bed for new semiconductor technologies. From being the first to use Samsung 3nm to SMIC 7nm to this.
 
Status
Not open for further replies.
Top