Can anyone explain to a tech noob like what does this entail?
China Breaks Through Restrictions with Advanced Chiplet Strategy: 3D-IC Breakthrough in Chinese Ethereum Miner
TechInsights Reveals Design of the Jasminer X4 with DBI Hybrid Bonding. to learn more.
TechInsights made a remarkable discovery on the Jasminer X4 Ethereum miner ASIC, developed by China-based crypto mining machine manufacturer Jasminer. This design marks the industry’s first-ever application of DRAM to logic direct bond interconnect (DBI).
TechInsights found hybrid bonding technology in Yangtze Memory Technologies Company’s (YMTC) Xtacking 3.0 architecture, where logic circuits were bonded to a separate wafer with storage cells in their 3D NAND products. Jasminer X4 uses this technology differently—it represents the first instance where the logic circuits have been bonded directly to DRAM.
The Jasminer X4 showcases the ability of a Chinese company, under trade restrictions, to combine matured technologies to create high-performance, cutting-edge applications creatively. A sizable 32 mm × 21 mm logic die employs the earlier XMC (Wuhan Xinxin Semiconductor Manufacturing Co.) planar 40/45 nm CMOS technology. The large die is patterned using two masks, which could represent a design workaround for a reticle constraint. The flip chip is assembled within the package.
Additional findings covered in the Disruptive Event Brief:
To learn more about these findings, and stay tuned for additional findings.
- Xilinx Zynq FPGA on the board containing the Mining ASIC.
- Jasminer X4 is the first Ethereum miner ASIC to utilize a storage mining design.
Chinese semiconductor industry
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Can anyone explain to a tech noob like what does this entail?
That is great and all and I hope they succeed, just saying that competing with Samsung and TSMC in volume production is a pretty tall order unless they poach lot of Taiwanese and Koreans engineers.
No worry, we have SSMB that can do 1nm on paper. Maybe you can post this in Japanese forum to cool them down.
Furong Investment Company——Qingchun Semiconductor has completed hundreds of millions of yuan in A+ round of financing to build a leading domestic supplier of silicon carbide power devices!
On April 26, Qingchun Semiconductor (Ningbo) Co., Ltd. (hereinafter referred to as "Qingchun Semiconductor"), a Furong investment company, announced that it has completed hundreds of millions of yuan in A+ round financing. This round of financing was jointly led by Weilai Capital, Silan Microelectronics and its strategic funds, and Walden International. The old shareholder Hillhouse Venture Capital continued to increase investment. Institutional support. This financing will be used to further improve the company's supply chain layout, expand the team, build a mass production laboratory and support product volume.
Since completing the A round of financing at the end of 2021, Qingchun Semiconductor has made a series of major progress in silicon carbide (SiC) device technology research and development and product development: the 1200V SiC MOSFET platform technology is mature, and multi-specification products have achieved mass production, and passed AEC-Q101 Vehicle-level certification and 960V-H3TRB reliability verification; launched the first domestic mass-produced 15V drive SiC MOSFET series products to fill the domestic gap, all performance indicators have reached or exceeded similar international products, and achieved nearly 100 shipments of SiC MOSFET chips 10,000 pieces, serving a number of leading customers in the photovoltaic and energy storage industries; launched the 1200V 14mΩ SiC MOSFET with the lowest domestic on-resistance, passed the verification of Tier1 manufacturers, and its performance is benchmarked against international mainstream main drive chips, and is currently being verified by many car companies. In the future, Qingchun Semiconductor will continue to make efforts in the main drive chips of electric vehicles, customize high-performance, high-reliability, and cost-effective main drive chips for new energy vehicle companies, take the lead in realizing the domestic substitution of main drive silicon carbide chips, and accelerate the assistance of my country's silicon carbide industry leapfrog development.
Since completing the A round of financing at the end of 2021, Qingchun Semiconductor has made a series of major progress in silicon carbide (SiC) device technology research and development and product development: the 1200V SiC MOSFET platform technology is mature, and multi-specification products have achieved mass production, and passed AEC-Q101 Vehicle-level certification and 960V-H3TRB reliability verification; launched the first domestic mass-produced 15V drive SiC MOSFET series products to fill the domestic gap, all performance indicators have reached or exceeded similar international products, and achieved nearly 100 shipments of SiC MOSFET chips 10,000 pieces, serving a number of leading customers in the photovoltaic and energy storage industries; launched the 1200V 14mΩ SiC MOSFET with the lowest domestic on-resistance, passed the verification of Tier1 manufacturers, and its performance is benchmarked against international mainstream main drive chips, and is currently being verified by many car companies. In the future, Qingchun Semiconductor will continue to make efforts in the main drive chips of electric vehicles, customize high-performance, high-reliability, and cost-effective main drive chips for new energy vehicle companies, take the lead in realizing the domestic substitution of main drive silicon carbide chips, and accelerate the assistance of my country's silicon carbide industry leapfrog development.
Looks like CAS is developing a R&D and manufacturing facility in that place, more probably for components and subsystems rather than complete machines. In that place "Nanjing Jiangning Economic and Technological Development Zone" are some of key suppliers of lithography parts.
The Chinese Academy of Sciences officially announced the elimination of the construction of domestic lithography machine bases
The Chinese Academy of Sciences officially announced the news of the construction of a domestic lithography machine base. This newly established base is the first domestic industrialization base focusing on the development of high-end lithography machines, which means that local Chinese companies will have the opportunity to further increase their market share in the field of semiconductor chip manufacturing.
It is reported that the domestic lithography machine base is located in Nanjing Jiangning Economic and Technological Development Zone, covering an area of about 250 mu, with a total investment of more than 20 billion yuan. The base will focus on the R&D, production, sales and service of high-end lithography machines, and is expected to achieve an annual sales revenue of more than 10 billion yuan by 2025, forming an annual output value of 20 billion yuan.
Indeed Japan is maybe the only nation to have almost full localization of IC equipment technology and also at advanced level. China will close the gap with Japan and eventually will have even more broad coverage, for instance in EDA tools. But today Japan is the most self-sufficient of the IC players.
But the elephant in the room is: where is the market?
2nm real volumes can only be in smartphones (Qualcomm, Mediatek, Unisoc), advanced AI (Nvidia, AMD, Chinese Biren and friends) and eventually advanced CPU (Intel, AMD, Chinese firms).
All the possible big customers of 2nm chips are in US, Taiwan (where they already have or will have soon localized fabs), and in China, where they will not be granted access to 2nm chips anyhow.
Official announcement ？Where is the news link？If it is official announcement there must be a news link
I think this may be 2nm equivalent carbon chips rather than silicon chips. Couple of years ago IBM announced success in a 2nm carbon chip. Now GlobalFoundries is suing IBM for transferring some chip technology to Rapidus.
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Interesting news. Beijing Baode have a production line to produce PCs, server computers using Kunpeng-920 CPUs.
here btw, is the product from their website I think. The product is PR210K. aimed for cloud computing, big data, distributed storage and other high end computation usage. It uses ARM applications.
Also looks like Baode has a long list of products using Kunpeng-920 CPU
here is the important part
My guess is that this production line is only going to be producing machines using Kunpeng-920 CPUs. If you do the calculation, that's going to be 150k + 20k * 2 = 190k Kunpeng-920 from just this line. It's not all that much by itself, but how many Kunpeng CPUs could Huawei possibly have stocked up from 2019? The fact that they can continue to supply themselves + package it for external sales indicate they are getting new ones produced.
here btw, is the product from their website I think. The product is PR210K. aimed for cloud computing, big data, distributed storage and other high end computation usage. It uses ARM applications.
Looks like each PR210K uses 2 Kunpeng-920 CPUs
Also looks like Baode has a long list of products using Kunpeng-920 CPU
here is the important part
This production line in Beijing alone will produce 150k PC and 20K server computers. Now Baode also works with Phytium and Loongson based on their website, but Loongson machine still uses 3B4000 CPU and only a couple of Phytium server computers are using S2500.
My guess is that this production line is only going to be producing machines using Kunpeng-920 CPUs. If you do the calculation, that's going to be 150k + 20k * 2 = 190k Kunpeng-920 from just this line. It's not all that much by itself, but how many Kunpeng CPUs could Huawei possibly have stocked up from 2019? The fact that they can continue to supply themselves + package it for external sales indicate they are getting new ones produced.
You can have cpu with few GB caches.
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