Chinese semiconductor industry

Researchers at High Energy Accelerator Research Organization, Japan (KEK) are researching on ERL-FEL powered euv.
It can generate 10kW.
According to their claim, although it's in prototype stage, the setup will cost less than LPP euv machine.

China is not behind though
But the arrangement is HUGE in size, even larger than SSMB.
I wish both of them luck.

tphuang said:

So as we get to 2024 and 2025, will Chinese tech firms still be reliant just on Intel & Nvidia chips or will they start buying Huawei or T-Head or Loongson or Biren/Moore thread/Cambrian designed chips that are produced at SMIC?

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I thought Chinese firms had already moved to local alternatives away from Nvidia and Intel, since US government already banned Chinese firms from sourcing advanced chips from any US tech company?

Michael90 said:

I thought Chinese firms had already moved to local alternatives away from Nvidia and Intel, since US government already banned Chinese firms from sourcing advanced chips from any US tech company?

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Sanctions these days are very, very leaky. It's fairly easy for industry giants like Nvidia and Intel to take advantage of loopholes to sanction dodge, such as with Nvidia's AI chips (where it retains full functionality but just has a lower clock speed).

Robot: Some new dual-arm vacuum manipulators have entered the client verification stage​

Robot (300024.SZ) stated on the investor interaction platform on April 19 that the company's products in the semiconductor equipment business include atmospheric manipulators, vacuum manipulators and other products, EFEM, and vacuum transfer platforms. The downstream industries served are semiconductor process equipment manufacturers . In terms of vacuum manipulators, the company's two-axis vacuum direct-drive manipulator products have been applied in small batches and multi-batch applications at the client; the three-axis vacuum direct-drive manipulator product is in the client verification stage, and it combines the application of the new controller software and hardware platform. It can support the long-term application of downstream customers; the four-axis vacuum direct-drive manipulator product is in the research and development stage. At present, the company has successfully developed a variety of new dual-arm vacuum manipulators, and some products have entered the client verification stage.

The first phase of Shaanxi SMIC Fusheng high-end integrated circuit packaging and testing project is expected to achieve mass production in May​

According to Baoji News, the high -end integrated circuit sensor packaging and testing project of SMIC Fusheng Electronic Technology Co., Ltd. is expected to achieve mass production in May this year.

According to reports, the high-end integrated circuit sensor packaging and testing project of SMIC Fusheng Electronic Technology Co., Ltd. has a total investment of 950 million yuan, which will be invested in two phases. 100 packaging test lines. At present, the first phase of the project has been completed, and it is expected to achieve mass production in May this year. According to Gu Guoming, the production manager of SMIC Fusheng Electronic Technology Co., Ltd., it is still in the debugging stage and will be mass-produced in May this year. The products are mainly used in daily life such as lighting, automotive electronics, power supplies, and chargers.

On March 12, the commissioning ceremony of SMIC's high-end integrated circuit packaging and testing project was held in the Western Sensor Industrial Park, Weibin District, Baoji City, Shaanxi Province.

SMIC Fusheng official news shows that SMIC Fusheng Electronic Technology Co., Ltd. was jointly established by Shaanxi Lusu Gongchuang Technology Co., Ltd. and Shaanxi Weibin Development Investment Co., Ltd., specializing in the design, production and sales of semiconductor discrete devices and integrated circuits. It is a key enterprise in Shaanxi Province. SMIC Fusheng Electronic Technology Co., Ltd. will enter the Western Sensor Industrial Park in Weibin District, Baoji City, Shaanxi Province in October 2022.

Superpower 2030.

ASML earnings report for 1Q23. TSMC and Samsung's EUVL investments are obvious; the US sales are potentially the newer Intel/Micron/TSMC/Samsung factories but hard to say specifically. China's share of total ASML sales is 8% but difficult to make any conclusions simply because of the ArFi-EUVL price differential

USTBasisRollCarry said:

ASML earnings report for 1Q23. TSMC and Samsung's EUVL investments are obvious; the US sales are potentially the newer Intel/Micron/TSMC/Samsung factories but hard to say specifically. China's share of total ASML sales is 8% but difficult to make any conclusions simply because of the ArFi-EUVL price differential

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Also, I think the big conclusion from this is that EUVL sales are in the sole domain of TSMC and Samsung for the foreseeable future until either China creates its own EUVL or the US spends a gazillion dollars to pay Intel to do it

USTBasisRollCarry said:

ASML earnings report for 1Q23. TSMC and Samsung's EUVL investments are obvious; the US sales are potentially the newer Intel/Micron/TSMC/Samsung factories but hard to say specifically. China's share of total ASML sales is 8% but difficult to make any conclusions simply because of the ArFi-EUVL price differential

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All based on when deliveries are happening. Chinese sales should be a lot higher in Q2 since that's when SMIC is rumored to be getting some last minute 2050i (if you believe Chinese social media) before the export restrictions kick in



Anyhow, Loongson's 3C5000 server CPUs have now found there way to Beijing's National Science and Technology Communication Center. 450 sets of air conditioned control terminals using 3C5000
This is an IoT control system solution launched by Loongson and 小物科技.

huemens said:

China chip event draws Applied Materials, others despite U.S. tensions​

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The gall of some of these companies though lol. I hope their representatives were grilled on potential future sanctions and how those might be cut off from servicing. Ditto with current chip restrictions