Because China is confident enough to not waste ammo now there is already capability to make 7nm chips so can afford to wait for proper systems to come online then go on offensive when you are ready with all the cards at your disposal
Chinese semiconductor industry
- Thread starter Hendrik_2000
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Bro my take, a friendly reminder to the Dutch, you have only 2 years to profit from us after that we will flood our product to challenge your monopoly.
That is why the US want to put China on the sanctions escalator so they can block Chinese high tech products at least in the west/NATOStan.Bro my take, a friendly reminder to the Dutch, you have only 2 years to profit from us after that we will flood our product to challenge your monopoly.
And can they afford a $3,500 Iphone? well maybe because the value of the dollar will plummet.
The project of Jiyi Technology (JETPLASMA) High-end Semiconductor Equipment R&D Center opened
According to news from Jiwei.com, on March 17, the project of Jiyi Technology's high-end semiconductor equipment R&D center opened.
According to the news from Shanghai Real Estate Minhong Group , the high-end semiconductor equipment research and development center project of Jiyi Technology uses Zhizaoyuan No. 21 factory building with a construction area of 9348.3 square meters. The total investment of the project is 400 million yuan, and the output value is expected to be 200 million yuan per year.
Founded in 2015, Jiyi Technology is a semiconductor equipment company specializing in the application of plasma technology. The company's main products include plasma stripping machine, plasma etching machine (for the third-generation semiconductor industry), and plasma cleaning machine. The product line is widely used in silicon-based chip manufacturing, compound chip manufacturing, LED chip manufacturing, and semiconductor chip manufacturing. Packaging and medical electronics. (Proofreading/Han Xiurong)
Domestic EDA makes another breakthrough, Sierxin(S2C) releases OmniArk hardware simulation system product.
In order to meet the increasingly complex chip design and the increasingly strong demand for localization, Sierxin has launched a new OmniArk enterprise-level hardware simulation system. This product is independently researched and developed by Sierxin. It has a number of core technologies with independent intellectual property rights, and realizes fully automatic compilation of ultra-large-scale designs. At present, it has been promoted and used by many chip design companies, and can help SoC design customers such as automotive electronics, CPU, AI, 5G, and cloud computing to achieve complex simulation verification.
"OmniArk Xinshending enterprise-level hardware emulation system adopts ultra-large-scale commercial scalable array architecture design, and the chassis module structure is convenient for maintenance and expansion. The product form ranges from desktop to cabinet type, and the design capacity can be expanded to 2 billion gates. It includes a A set of convenient and easy-to-use software system, supports GUI graphical interface and TCL script commands, and integrates the complete process of compiling, running and debugging." According to Li Yanrong, senior vice president of Sierxin, the company's ultimate goal is to reach 20 billion gates, and the basic market will be All integrated circuits above can be verified in the company's hardware simulation system.
"If you want to do a good job, you must first sharpen your tools." While providing a hardware acceleration platform, OmniArk also provides innovative supporting software with various functions, including automatic error correction of user design syntax, Smart P&R technology, ABS ( Auto-Block Select) technology, diversified signal acquisition methods, etc., allow users to achieve MHz-level simulation acceleration, fully automatic intelligent compilation process, powerful debugging capabilities, and multiple simulation verification modes. It also has a rich VIP library, which is suitable for system-level verification of ultra-large-scale high-end general-purpose chip design, and can meet the needs of different verification scenarios.
"OmniArk Xinshending enterprise-level hardware emulation system adopts ultra-large-scale commercial scalable array architecture design, and the chassis module structure is convenient for maintenance and expansion. The product form ranges from desktop to cabinet type, and the design capacity can be expanded to 2 billion gates. It includes a A set of convenient and easy-to-use software system, supports GUI graphical interface and TCL script commands, and integrates the complete process of compiling, running and debugging." According to Li Yanrong, senior vice president of Sierxin, the company's ultimate goal is to reach 20 billion gates, and the basic market will be All integrated circuits above can be verified in the company's hardware simulation system.
"If you want to do a good job, you must first sharpen your tools." While providing a hardware acceleration platform, OmniArk also provides innovative supporting software with various functions, including automatic error correction of user design syntax, Smart P&R technology, ABS ( Auto-Block Select) technology, diversified signal acquisition methods, etc., allow users to achieve MHz-level simulation acceleration, fully automatic intelligent compilation process, powerful debugging capabilities, and multiple simulation verification modes. It also has a rich VIP library, which is suitable for system-level verification of ultra-large-scale high-end general-purpose chip design, and can meet the needs of different verification scenarios.
EDA is known as the "tip of the pyramid" technology in the semiconductor industry and is an indispensable support tool for the integrated circuit industry. The monopoly of EDA has caused EDA to become the link with the most serious external dependence in the domestic semiconductor industry.
In the increasingly complex international trade environment, domestic EDA calls for independent control are loud, and dozens of domestic manufacturers have entered the market from their respective advantageous fields, starting to break through.
Silxin is undoubtedly one of the most dazzling ones. Lin Junxiong, CEO and president of S2C, told Jiweiwang that among domestic EDA companies, S2C is not only the earliest digital EDA manufacturer, but also ranks first in the total number of global customers. Since its establishment in Shanghai in 2004, the company has focused on the front-end verification business of digital chips, and has established good cooperative relations with more than 600 customers around the world.
Moore threads validated themselves with another cloud provider AWCloud (not sure why they make themselves sound like AWS).
It does make me wonder why they are the only one constantly talking about certifying with different cloud services. Are other GPU players not dong it or are they just reporting everything.
It does make me wonder why they are the only one constantly talking about certifying with different cloud services. Are other GPU players not dong it or are they just reporting everything.
The production line of the Shanghai Tongxin structure pan-semiconductor vacuum cavity project started
Recently, the production line of the pan-semiconductor vacuum chamber project of Shanghai Tongxin Structure Technology Co., Ltd. officially started in the Internet Baodi Park. As the domestic top-level pan-semiconductor vacuum chamber automation and intelligent production line, the commencement and commissioning of the project production line will effectively promote the integration of local intelligence and the semiconductor industry, and greatly empower the regional industrial energy level.
At the opening ceremony, Shanghai Tongxin Structure Technology Co., Ltd. was unveiled and opened. At the same time, the production line of the pan-semiconductor vacuum chamber project was officially launched. As a production line completely independently built by domestic enterprises, which can guarantee the supply of relevant basic components and supporting capabilities, the intelligent production line of pan-semiconductor vacuum chambers with the same core structure can solve the needs of product localization and localization. After the production line is put into operation, the production capacity will reach an annual output of 300 sets of equipment, and the annual output value will exceed 100 million yuan. In the next step, the company will carry out the production line planning of the second and third phases.
It is understood that the coating and deposition process is the key core process for the manufacture of semiconductor integrated circuits, photovoltaics and liquid crystal panels, and its process equipment and key components have long relied on imports. , Etching process equipment key core devices. The traditional manufacturing of hollow body, heating base, and heat dissipation substrate mostly adopts old technical routes such as overall engraving, screw joint sealing, brazing/arc welding, etc., which has high cost, low yield, low comprehensive performance, limited service life, and safety. Disadvantages such as low reliability. The project team of Shanghai Tongxin Structure Technology Co., Ltd. has overcome the problems existing in the manufacturing process of the traditional technical route through the core technology research and development and reserve, and innovatively adopted green solid-phase molding technology. It has now mastered a number of mature technologies and is committed to breaking the vacuum chamber Key core components such as body and components have long relied on foreign imports. The commissioning of the intelligent production line will also meet the needs of localization, localization and mass production of products in related industries.
At the ceremony, Shanghai Tongxin Structure Technology Co., Ltd., Central South University and Harbin Institute of Technology jointly established the "Special Component Solid Phase Forming Technology" joint laboratory and the "Special Connection Technology" joint laboratory. Cooperation in technology and product development.
At the opening ceremony, Shanghai Tongxin Structure Technology Co., Ltd. was unveiled and opened. At the same time, the production line of the pan-semiconductor vacuum chamber project was officially launched. As a production line completely independently built by domestic enterprises, which can guarantee the supply of relevant basic components and supporting capabilities, the intelligent production line of pan-semiconductor vacuum chambers with the same core structure can solve the needs of product localization and localization. After the production line is put into operation, the production capacity will reach an annual output of 300 sets of equipment, and the annual output value will exceed 100 million yuan. In the next step, the company will carry out the production line planning of the second and third phases.
It is understood that the coating and deposition process is the key core process for the manufacture of semiconductor integrated circuits, photovoltaics and liquid crystal panels, and its process equipment and key components have long relied on imports. , Etching process equipment key core devices. The traditional manufacturing of hollow body, heating base, and heat dissipation substrate mostly adopts old technical routes such as overall engraving, screw joint sealing, brazing/arc welding, etc., which has high cost, low yield, low comprehensive performance, limited service life, and safety. Disadvantages such as low reliability. The project team of Shanghai Tongxin Structure Technology Co., Ltd. has overcome the problems existing in the manufacturing process of the traditional technical route through the core technology research and development and reserve, and innovatively adopted green solid-phase molding technology. It has now mastered a number of mature technologies and is committed to breaking the vacuum chamber Key core components such as body and components have long relied on foreign imports. The commissioning of the intelligent production line will also meet the needs of localization, localization and mass production of products in related industries.
At the ceremony, Shanghai Tongxin Structure Technology Co., Ltd., Central South University and Harbin Institute of Technology jointly established the "Special Component Solid Phase Forming Technology" joint laboratory and the "Special Connection Technology" joint laboratory. Cooperation in technology and product development.
Huawei will enter into selling semiconductor manufacturing equipment...
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