I did not expect CR Micro to be moving up the tech ladder so fast. Last time I checked a few years ago they were making car chips, yes, but mostly sensors and MCUs with 180+ nm.
Chinese semiconductor industry
- Thread starter Hendrik_2000
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umm looks like they are using trading companies in South East Asia.
Seems like they have no choice? Huahong is forced to do the same with their new Wuxi plant?
Just for the novices here, what kind of additional expertise are required (how hard is it) to go from 65-90nm to 40nm for example?
In 2022, the list of the first set of major equipment to be identified in Suxichang was announced, including semiconductor equipment
Among them, Suzhou City includes Jingchuang's advanced AR9000 automatic precision scribing machine, Xinmeng Semiconductor's XM-ENEPIG-12-21 automatic electroless nickel-palladium-gold system equipment (Cu), Yuanzhuo Optoelectronics Diss-35ML solder mask circuit Direct writing lithography equipment connection, 30 equipment such as Sudaweige's MiScan200UV laser direct writing system; Wuxi City includes Laplace's low-pressure chemical vapor deposition horizontal coating system (LPCVD), Yiwen Electronics' high-capacity and low-consumption plasma polysilicon Etching machine 2000ICP, Altway's semiconductor aluminum wire bonding machine and other 20 equipment; Changzhou City includes 20 equipment such as VCSEL chip comprehensive test system of Ketai Optical Core.
New SME.
Hua Hong bought some of that equipment, it looks like they're still buying items for lower node productions is my guess.
Most directly, changing from KrF to ArF lithography which means changing from KrF resist to ArF resist, a major leap as it means new chemical handling processes for the fab and new types of equipment.
But also there's the move from Si oxide gate insulatir to high K dielectric (HfO2) to prevent leakage current across the gate insulator which necessitated a new Hf CVD/ALD process instead of simple thermal oxidation for oxide formation. And that also means introducing dielectric etch.
Next you have move from polysilicon gate to metal gate, which again means switching from silanes CVD to metal deposition, which also means introducing metal etching, including etching of very tough metals like Ni, W, etc.
And finally you have strain engineering. The strain on the Si lattice caused by crystal structure mismatch between different materials doesn't matter above 90 nm but becomes important below that node. It must be explicitly taken into consideration.
The period of the self-traceable grating has extremely high accuracy and minimal uncertainty due to its traceability to natural constants. It is an essential task to shorten the period of self-traceable grating to below 100 nm. In this paper, the self-traceable Cr grating with a period of 212.8 nm prepared by laser-focused atomic deposition (LFAD) is used as the mask, and the second-order frequency doubling (�=2) of the Cr grating is performed by extreme ultraviolet interference lithography (EUV IL). The Cr grating is designed for the best second-order diffraction efficiency. By optimizing the orthogonality between the laser standing wave and the atomic beam, a Cr grating with a peak-to-valley height of 60 nm is prepared. After exposure and development with PMMA 672.01 photoresist, the Si grating is finally obtained by pattern transfer. And its average pitch is evaluated as (53.2 ± 0.1) nm. The exposure results of different photoresists and the uniformity of grating patterns are discussed. The peak-to-valley height of the Si grating is about 50 nm, and the full width at half maximum is about 20 nm. This research provides the possibility for the wider application of self-traceable gratings in advanced nanofabrication and precision measurement.
China Micro Corporation (688012): The rapid expansion of revenue scale has made progress in key etching equipment
Zhongwei Company released its 2022 performance report. The company's annual revenue was 4.74 billion yuan, a year-on-year increase of 52.50%; the net profit attributable to the parent was 1.17 billion yuan, a year-on-year increase of 15.66%; A year-on-year increase of 183.44%.
The rapid development of ICP and CCP etching equipment business: the company's CCP capacitive high-energy etching equipment shipments have grown rapidly, and it has received bulk orders from many customers. Since the launch of China Micro's ICP etching equipment, it has continuously expanded its application scope, rapidly expanded the market and received batch orders. It has been applied to more than 20 customers' logic, DRAM, 3D NAND and other chip production lines. Momentum is strong.
Multi-dimensional layout to expand new markets: The thin-film equipment and testing equipment market deployed by AMEC is the third and fourth largest equipment market except lithography and etching. The company's MOCVD equipment products are the key core equipment for the manufacture of III-V compound semiconductors. They are used in emerging fields such as lighting, large-area display screens, power devices, and micro-displays. The market scale and application fields are expanding rapidly.
Progress in extremely high aspect ratio etching equipment: the FLEX series equipment of LAM in the United States is the most important obstacle restricting the expansion of domestic 3D NAND production; the extremely high aspect ratio used by China Microelectronics for more advanced microscopic device manufacturing processes Etching equipment has made gratifying progress and is expected to contribute sales revenue to the company. The breakthrough and large volume of this kind of equipment will help the major customers of China Microelectronics to resume production expansion and strongly stimulate their own performance.
The rapid development of ICP and CCP etching equipment business: the company's CCP capacitive high-energy etching equipment shipments have grown rapidly, and it has received bulk orders from many customers. Since the launch of China Micro's ICP etching equipment, it has continuously expanded its application scope, rapidly expanded the market and received batch orders. It has been applied to more than 20 customers' logic, DRAM, 3D NAND and other chip production lines. Momentum is strong.
Multi-dimensional layout to expand new markets: The thin-film equipment and testing equipment market deployed by AMEC is the third and fourth largest equipment market except lithography and etching. The company's MOCVD equipment products are the key core equipment for the manufacture of III-V compound semiconductors. They are used in emerging fields such as lighting, large-area display screens, power devices, and micro-displays. The market scale and application fields are expanding rapidly.
Progress in extremely high aspect ratio etching equipment: the FLEX series equipment of LAM in the United States is the most important obstacle restricting the expansion of domestic 3D NAND production; the extremely high aspect ratio used by China Microelectronics for more advanced microscopic device manufacturing processes Etching equipment has made gratifying progress and is expected to contribute sales revenue to the company. The breakthrough and large volume of this kind of equipment will help the major customers of China Microelectronics to resume production expansion and strongly stimulate their own performance.
Jiaxin, a subsidiary of Wanye Enterprise, successfully won the bid for the characteristic craft line project
According to the bid winning announcement issued by Binet, recently, Wanye Enterprise( 19.500 , 0.22 , 1.14% ) (600641.SH)'s Jiaxin Caneng's chemical deposition equipment for boron-phosphorus-silicon dioxide thin films and titanium/nitride Titanium deposition equipment successfully won the bidding project for the construction of a characteristic process production line.
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