Chinese semiconductor industry

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tphuang

tphuang

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saw this posted about Shanghai Sinyang Q&A from last year.
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Looks like they were the only domestic option in etching solution, electroplating solution & various cleaning fluids. Not sure if that's still the case.
Looking to claim 50% of China's domestic market in etching solution
Looks like they were supplying this to YMTC and SMIC. They are able to be used in SMIC's 14nm process.
Had high hopes at the time for revenue from YMTC based on 300k wpm production capacity, but as we know, YMTC is stuck under 100k for now.
At the time, CXMT was validating their PCMP product.

They were just getting into photoresists with development for iLine, Krf, Arf & EUV. Looks like they got the first two into mass production. That's not bad for 1 year.

I'm generally optimistic about companies that can get into new product lines and make progress in short time.
 
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gelgoog

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Each of the YMTC fabs is supposed to have 100k wafers per month capacity. AFAIK Fab 1 is at full capacity, so all 100k wafers, and Fab 2 was supposed to be moving in equipment for initial production this year. Then the US sanctions on fab equipment for NAND hit.

YMTC managed to have the best product in the market in terms of performance in both bandwidth and bit density. I do not know why the YMTC CEO was kicked out. I mean any problems YMTC does have right now were clearly outside his control. What could he do about something like US tools ban? I hope the YMTC CEO finds success in future endeavors since he is clearly talented and managed to deliver unlike a lot of Chinese semi companies. For example the other Unigroup memory fab projects were a big failure.
 
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tokenanalyst

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SMIC Thermal Technology launched photoelectric imaging chip preparation, testing and packaging services to help the development of new material photoelectric imaging technology​


Liu Yanfei, general manager of SMIC Thermal Technology (Beijing) Co., Ltd. (abbreviation: SMIC Thermal Technology), said: "Currently, the research on optoelectronic materials is undergoing rapid changes, from the original single-point device research to array-type devices. This not only has huge application value, but also includes new mechanisms, new mechanisms and new methods that single-point devices do not have. To meet this demand, SMIC has launched focal plane imaging chip processing based on new materials, Packaging and testing services, I believe it can help many researchers achieve higher academic achievements." In the early research of the company, it has already had the integration experience of one-dimensional, two-dimensional, zero-dimensional and organic semiconductors and other optoelectronic materials, which can provide Customers provide fast customized solutions.

According to the user's requirements for the electrode structure and electrode material on the chip surface, we can provide micro-nano processing and testing services, including megasonic cleaning, high-precision photolithography, electrode deposition, wet etching, scribing, wire bonding, etc., for imaging The processing and preparation of chips provide the basis for technology and technology. At the same time, the company has two-dimensional/three-dimensional surface profiler, Fourier transform infrared spectrometer, optical microscope and other testing equipment, which can control the process quality of customized chips to ensure the processing quality and performance requirements of imaging chips.

MBXY-CR-bed4fd4c9114fa1a1c72cfe065ef9914.png


Focal Plane Test System

The focal plane detector is the heart of an imaging device. The focal plane measurement system is an automatic parameter measurement system, which can complete the measurement of the core important parameters of the focal plane detector and the best control signal of the detector. Core parameters include sensitivity, response spectrum, response non-uniformity, blind metamap, etc. The scale of the measurement array includes 320×256, 640×512 and 1280×1024, etc.

MBXY-CR-5560139d602beae46564372a33a09b8d.png


High Reliability Package

The company has vacuum/inert gas parallel seam welding, glue dispenser and other chip packaging equipment, which is suitable for linear, linear array or rotary packaging of optoelectronic devices, semiconductor devices and other products. The size can cover 2mm-180mm rectangular shell and circular shell with diameter less than φ150mm. Editable welding force 2~20N, independent closed-loop control of welding force. With automatic pre-welding operation. Through the shaping and positioning of the high-performance recognition system, and the positive and negative pressure release and take-up functions of the suction nozzle, the transfer and positioning of the cover material and the precise placement of the cover can be realized.

MBXY-CR-3fe9544550ce6314b3bef036fba08f91.png


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FairAndUnbiased

FairAndUnbiased

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tokenanalyst said:

SMIC Thermal Technology launched photoelectric imaging chip preparation, testing and packaging services to help the development of new material photoelectric imaging technology​


Liu Yanfei, general manager of SMIC Thermal Technology (Beijing) Co., Ltd. (abbreviation: SMIC Thermal Technology), said: "Currently, the research on optoelectronic materials is undergoing rapid changes, from the original single-point device research to array-type devices. This not only has huge application value, but also includes new mechanisms, new mechanisms and new methods that single-point devices do not have. To meet this demand, SMIC has launched focal plane imaging chip processing based on new materials, Packaging and testing services, I believe it can help many researchers achieve higher academic achievements." In the early research of the company, it has already had the integration experience of one-dimensional, two-dimensional, zero-dimensional and organic semiconductors and other optoelectronic materials, which can provide Customers provide fast customized solutions.

According to the user's requirements for the electrode structure and electrode material on the chip surface, we can provide micro-nano processing and testing services, including megasonic cleaning, high-precision photolithography, electrode deposition, wet etching, scribing, wire bonding, etc., for imaging The processing and preparation of chips provide the basis for technology and technology. At the same time, the company has two-dimensional/three-dimensional surface profiler, Fourier transform infrared spectrometer, optical microscope and other testing equipment, which can control the process quality of customized chips to ensure the processing quality and performance requirements of imaging chips.

MBXY-CR-bed4fd4c9114fa1a1c72cfe065ef9914.png


Focal Plane Test System

The focal plane detector is the heart of an imaging device. The focal plane measurement system is an automatic parameter measurement system, which can complete the measurement of the core important parameters of the focal plane detector and the best control signal of the detector. Core parameters include sensitivity, response spectrum, response non-uniformity, blind metamap, etc. The scale of the measurement array includes 320×256, 640×512 and 1280×1024, etc.

MBXY-CR-5560139d602beae46564372a33a09b8d.png


High Reliability Package

The company has vacuum/inert gas parallel seam welding, glue dispenser and other chip packaging equipment, which is suitable for linear, linear array or rotary packaging of optoelectronic devices, semiconductor devices and other products. The size can cover 2mm-180mm rectangular shell and circular shell with diameter less than φ150mm. Editable welding force 2~20N, independent closed-loop control of welding force. With automatic pre-welding operation. Through the shaping and positioning of the high-performance recognition system, and the positive and negative pressure release and take-up functions of the suction nozzle, the transfer and positioning of the cover material and the precise placement of the cover can be realized.

MBXY-CR-3fe9544550ce6314b3bef036fba08f91.png


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interesting, usually logic fabs don't do sensors as those use larger process nodes. Looks like SMIC is repurposing some older lines.
 
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bettydice

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tokenanalyst said:
This is a Chinese semiconductor thread not a necessary a political thread, the word hegemonic is wide range and is mostly political so thread will likely to devolve into political crap.
And by the way if lithography is the "hegemonic technology" against China then we are looking at the wrong hegemony because Europe and Japan is where the most of the suppliers of that technology really are.
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Chinese semiconductor and political are not mutually exclusive. There is no separate political thread, either. Developing/investing/funding/supporting/using China's domestic semiconductor technology/equipment/industry is politically motivated and is a political matter mostly because America has been politicizing it. i.e. The CHIPS and Science Act. This "Chinese semiconductor industry" thread was created in the wake of Donald Trump regime's trade war as you can see in the first post.

Both Europe and Japan are under control of America.
 
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Red Moon

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bettydice said:
Chinese semiconductor and political are not mutually exclusive. There is no separate political thread, either. Developing/investing/funding/supporting/using China's domestic semiconductor technology/equipment/industry is politically motivated and is a political matter mostly because America has been politicizing it. i.e. The CHIPS and Science Act. This "Chinese semiconductor industry" thread was created in the wake of Donald Trump regime's trade war as you can see in the first post.

Both Europe and Japan are under control of America.
Click to expand...
We know all of this, and most people understand the implications. But the topic here is an extremely interesting one and "geopolitical" discussion will quickly become generalized while going over the same arguments and topics that are discussed ad nauseam in some other threads -mostly by people who write much but read and think little.
 
T

tokenanalyst

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bettydice said:
Chinese semiconductor and political are not mutually exclusive. There is no separate political thread, either. Developing/investing/funding/supporting/using China's domestic semiconductor technology/equipment/industry is politically motivated and is a political matter mostly because America has been politicizing it. i.e. The CHIPS and Science Act. This "Chinese semiconductor industry" thread was created in the wake of Donald Trump regime's trade war as you can see in the first post.

Both Europe and Japan are under control of America.
Click to expand...
like @Red Moon said the problem is not the politics that directly surround the China semiconductor industry in this thread but the generalized politics that usually devolves into no nonsensical posting unrelated to this thread.
I and I think nobody else have not problem posting the latest brain cell killing stupidity of Marco Rubio about China semiconductor industry but I do have a problem of page after page of postings not related to semiconductors at all, nationalistic postings, name calling, "this bad and that good" and so on.​
 
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