Features of TSV (Through Silicon Vias) key process equipment and prospect of localization.
TSV is one of the most advanced technologies in the semiconductor manufacturing industry and has been applied to many products. The selection of key equipment to realize its manufacturing process is closely related to the selection of process, which directly determines the performance of TSV to some extent. Based on the review of the process flow and key technologies of TSV, the author of this paper introduces several key process equipment's such as deep hole etching, vapor deposition, via filling, and chemical mechanical polishing (CMP) in detail. Under the premise of process requirements, relevant suggestions are put forward for the selection and application of different equipment and the factory service requirements for equipment installation, and at the same time, the localization prospect of TSV equipment is made
3-Specific application of TSV key equipment.
The key process equipment of TSV is sophisticated and expensive, and the different process methods adopted by different equipment suppliers have a great impact on the selection of auxiliary equipment, factory service conditions, safety and environmental management, etc. According to the actual process requirements and technical conditions, a set of mature TSV production line equipment is taken as an example to recommend suitable TSV equipment. There is a large gap in the price of equipment at home and abroad. Due to the risk of foreign embargoes, when encountering a domestic manufacturer that can provide process equipment, we should check the process methods, reliability, service guarantee, and user evaluation of domestic equipment. On the premise of ensuring that the requirements of the production process are met, a special inspection will be carried out, and domestic equipment will be recommended first.
3.1 Type selection and application of deep reactive plasma etching equipment
At present, the mainstream deep silicon etching equipment in foreign countries is mainly controlled by equipment manufacturers such as Applied Materials and Fanlin Semiconductor in the United States. However, in recent years, domestic microelectronic equipment manufacturers have made amazing progress. The plasma etching machines launched by Zhongwei Semiconductor Equipment Co., Ltd (AMEC). and North Huachuang Microelectronics Equipment Co., Ltd (Naura). can achieve high aspect ratio etching and meet the requirements of most production processes. Requirements, with the ability to achieve excellent sidewall morphology control, stable uniformity, and extremely high etching selectivity. In the follow-up investigation of equipment procurement, it was verified by test pieces that the deep reaction plasma etching equipment produced by NAURA can meet the product processing requirements. It adopts a modular design, and the whole machine includes a process module (PM: Process Module) and a transmission module (TM: Transfer Module). The transfer module is equipped with manipulators to transfer wafers between it and the process modules. The equipment has an intelligent software operating system to realize the automatic etching process of a single wafer.
3.2 Type selection and application of PECVD vapor deposition equipment
Many companies at home and abroad have various mature products. For example, the British SPTS company provides wafer etching, PVD, CVD and other equipment for domestic MEMS, advanced packaging, LED and other industries, and its comprehensive technical strength is currently in the leading position in the industry. Its PECVD equipment is mainly used for low-temperature single-sided deposition of low-stress silicon nitride and silicon oxide films. The transfer arm will automatically transfer the substrate to the process chamber module. Spreading and process automation; Shenyang Tuojing Technology Co., Ltd (Piotech). in China has chemical vapor deposition equipment with 100% independent intellectual property rights, which can be matched with high and low frequency power supplies to quickly deposit low-stress, high-uniform silicon oxide, silicon nitride, Silicon oxynitride and other film layers support the application of low-temperature TEOS process in TSV and other fields. The equipment is equipped with EFEM, loadlock, transfer module, process module, etc. British SPTS needs to use H2 for post-processing to remove the moisture in the film layer and improve the long-term stability of the film layer, such as film stress, breakdown voltage, leakage current and other indicators; Shenyang Tuojing uses High energy, ionizes the water in the process into active groups according to different states, eliminates the influence of water absorption of the film layer, ensures the continuity and stability of the film layer, and does not require H2.
3.3 Application of PVD equipment selection
In recent years, North Huachuang (Naura) has increasingly occupied the domestic market by virtue of its own strength. Therefore, in the actual equipment selection research, in addition to the sample test at SPTS, sample production was also carried out at North Huachuang Company. Because the PVD equipment is used in the micro-nano processing production of the actual high-density packaging substrate, it is used to solve the problem of difficult deposition of barrier layer/seed layer on the inner wall of the high-aspect-ratio micro-nano through-hole, and improve the interconnection reliability of the metallized micro-nano through-hole. Therefore, when selecting PVD equipment, in addition to meeting the technical indicators of metal film deposition on the sidewalls of high aspect ratio holes such as 20*200μm and 20*100μm, attention is also paid to whether the equipment has substrate degassing, pre-cleaning and through-hole sidewall Magnetron sputtering coating process, intelligent operating system can realize automatic production function. The Polaris T620 equipment produced by Huachuang Company has four process modules: degas, preclean, high-cavity Ti sputtering deposition, high-cavity Cu sputtering deposition, and automatic transmission module and Facility module. The substrate degassing, pre-cleaning and through-hole side wall magnetron sputtering coating process, with intelligent operating system, can realize automatic production, so it becomes the final choice.
3.4 Type selection and application of electroplating copper filling equipment 3.2 Type selection and application of PECVD vapor deposition equipment
Many companies at home and abroad have various mature products. For example, the British SPTS company provides wafer etching, PVD, CVD and other equipment for domestic MEMS, advanced packaging, LED and other industries, and its comprehensive technical strength is currently in the leading position in the industry. Its PECVD equipment is mainly used for low-temperature single-sided deposition of low-stress silicon nitride and silicon oxide films. The transfer arm will automatically transfer the substrate to the process chamber module. Spreading and process automation; Shenyang Tuojing Technology Co., Ltd (Piotech). in China has chemical vapor deposition equipment with 100% independent intellectual property rights, which can be matched with high and low frequency power supplies to quickly deposit low-stress, high-uniform silicon oxide, silicon nitride, Silicon oxynitride and other film layers support the application of low-temperature TEOS process in TSV and other fields. The equipment is equipped with EFEM, loadlock, transfer module, process module, etc. British SPTS needs to use H2 for post-processing to remove the moisture in the film layer and improve the long-term stability of the film layer, such as film stress, breakdown voltage, leakage current and other indicators; Shenyang Tuojing uses High energy, ionizes the water in the process into active groups according to different states, eliminates the influence of water absorption of the film layer, ensures the continuity and stability of the film layer, and does not require H2.
3.3 Application of PVD equipment selection
In recent years, North Huachuang (Naura) has increasingly occupied the domestic market by virtue of its own strength. Therefore, in the actual equipment selection research, in addition to the sample test at SPTS, sample production was also carried out at North Huachuang Company. Because the PVD equipment is used in the micro-nano processing production of the actual high-density packaging substrate, it is used to solve the problem of difficult deposition of barrier layer/seed layer on the inner wall of the high-aspect-ratio micro-nano through-hole, and improve the interconnection reliability of the metallized micro-nano through-hole. Therefore, when selecting PVD equipment, in addition to meeting the technical indicators of metal film deposition on the sidewalls of high aspect ratio holes such as 20*200μm and 20*100μm, attention is also paid to whether the equipment has substrate degassing, pre-cleaning and through-hole sidewall Magnetron sputtering coating process, intelligent operating system can realize automatic production function. The Polaris T620 equipment produced by Huachuang Company has four process modules: degas, preclean, high-cavity Ti sputtering deposition, high-cavity Cu sputtering deposition, and automatic transmission module and Facility module. The substrate degassing, pre-cleaning and through-hole side wall magnetron sputtering coating process, with intelligent operating system, can realize automatic production, so it becomes the final choice.
In this area the Author don't mention any equipment only explain the process. But the are some localized tools in this area.
And this others.
3.5 Selection and application of thinning and polishing equipment.
In recent years, domestically produced ultra-thin wafer thinning and polishing equipment has achieved mass production and application, achieving the high performance level of similar international equipment.
Beijing Tesidi Semiconductor Equipment Co., Ltd. is a professional manufacturer of thinning and polishing CMP equipment. It can provide a substrate thinning and polishing system, which consists of 1 thinning equipment, 1 polishing equipment, and 1 placement equipment. It is used for HTCC nitrogen Thinning, polishing, and patch processing of aluminum substrates, in which the thinning equipment processes the substrate to the target thickness through rapid thinning and online thickness measurement system; the polishing equipment polishes the thinned surface through the action of polishing pad and polishing liquid , to reduce the surface roughness of the substrate; SMT equipment is suitable for bonding the substrate to the ceramic carrier as a carrier for thinning and polishing. After actual testing, it meets the actual production requirements of this case.
Some others players in this area are:
and
3.6 TSV Equipment Installation Factory Service Requirements
Again the author do not say any players but my guess that some of those would be.
Nata for etching gases.
dl-kg for CMP
JiangFeng for sputtering targets
sinyang Electroplatting.
