Chinese semiconductor industry

Please, Log in or Register to view URLs content!

A few days ago, Korean media reported that SK Hynix had some quality problems in the DRAM chip production process this month.

It is reported that the main cause of the DRAM wafer production process problem is the quality problem of the high-k value zirconium-based film material provided by SK trichem.

Due to impurities in the materials supplied by SK Trichem, production of several SK Hynix-related production equipment was temporarily suspended. SK Hynix said: "Immediately took measures such as cleaning operations and did not cause production loss." However, it is reported that SK is studying compensation for equipment stoppage and replacement of parts in accordance with the terms of the contract.

It is reported that SK Hynix has suspended the material procurement of SK Trichem until the problem is resolved. In this regard, SK Trichem explained: "There was a problem with the purity of the material supplied to SK Hynix, which caused an increase in the pressure of some equipment in the process, causing (equipment) to stop operating." He said. The procurement of materials for some production lines that have problems has been reduced, and it is planned to start supplying higher quality products from the end of this month. "

According to the editor's understanding, the high-k value zirconium-based materials supplied by SK Trichem are crucial to the production of DRAM.

Since the main issue affecting DRAM process scaling is capacitance, in order to store data reliably, capacitance needs to be greater than a certain threshold. To continue to manufacture capacitors that occupy a smaller area, the capacitor can be made higher, the film thinner, or the K value of the film can be increased. But the problem is that although taller and thinner capacitors can be reliably made from the perspective of mechanical stability, as the film thickness decreases, the leakage will increase, and as the film K value increases, the band gap will also decrease. Will cause leakage problems. The current standard is to use a composite film consisting of an aluminum-based oxide film for low leakage and a zirconium-based film for high-k values. DRAM is deposited atomically thin on the DRAM core element capacitor with a high-potassium preconditioner. DRAM distinguishes between 0s and 1s by whether or not it stores charge in a capacitor. The narrower the line width, in order to solve the interference problem between capacitors, it is necessary to deposit high potassium substances with higher heritability. Therefore, high-K substances are the core materials that have an important impact on the production and operation of DRAM

According to the editor of EDN, SK Trichem is a material affiliated company of SK Group, which is a joint venture between SK Materials and Japan's Trichem Research Institute (TCLC). In 2021, the holding business unit of SK Materials will be absorbed into SK and become a subsidiary of SK. SK Corp. has a 65 percent stake and TCLC has a 35 percent stake.

SK Trichem achieved annual sales of 150 billion won for two consecutive years in 2020 and 2021, but sales are expected to exceed 200 billion won last year as supplies to SK Hynix increase.

Click to expand...

Xinyuan Micro(KingSEMI): Focus on the front-end glue coating and developing equipment, and enter the production capacity release period of fund-raising projects​

1. After sorting out the company's product categories, it was found that whether it is glue coating and developing equipment or cleaning equipment, Xinyuan Micro's current products are still mainly used in the field of back-end packaging. The company is currently in the front-end field with higher demand for equipment and higher unit value transition period.

2. In the next few years, the upper limit of Xinyuanwei's revenue is relatively easy to quantify. Xinyuanwei's overall equipment production capacity planning, after the actual production capacity, the total annual output of glue coating and developing equipment can reach 63 units, and the annual output of chemical cleaning equipment 12 sets, and the annual output of physical cleaning equipment is 50 sets. It is estimated that the company's revenue in 2023 will be 1.9 billion yuan, a year-on-year increase of 42%, and the net profit attributable to the parent company will be 219 million yuan, a year-on-year increase of 53.5%.

3. The market still gives relatively high valuations to companies actively deploying in the field of front-end equipment.



Overview of Xinyuanwei's overall production capacity planning




the national policy also clarifies the goals and vigorously supports domestic semiconductor equipment companies to complete the domestic substitution of fab equipment. "Made in China 2025" requires that the localization rate of 90-32nm process equipment will reach 50% before 2020, the localization rate of 90nm lithography machine will be realized, and the localization rate of key packaging and testing equipment will reach 50%; the 20-14nm process equipment will be domestically produced before 2025 The conversion rate reached 30%, realizing the localization of immersion lithography machines. At the same time, the first phase of the current national large fund gradually insists on fulfilling the expected semiconductor packaging and testing and design links, and the 200 billion yuan raised by the second phase of the large fund focuses more on investing in weaker equipment and materials, which will strongly promote the domestic semiconductor industry. The rise of equipment manufacturers has further accelerated the domestic substitution of semiconductor equipment.

Please, Log in or Register to view URLs content!

启明 930 采用 12nm 工艺生产，HUB Chiplet 采用 RISC-V CPU 核心，可通过灵活搭载多个 NPU Side Die 提供 8~20TOPS（INT8）稠密算力。启明 930 可独立用于 AI 加速卡，亦可通过 D2D 扩展多种功能型 Side Die 进行集成，具备多种产品形态

Click to expand...

tonyget said:

Last week's bidding，American equipment still following in

View attachment 107553

Click to expand...