Shenghejing Micro 3D multi-chip integrated packaging project J2B clean room decoration and MEP project started
According to the news released by Jiangyin High-tech Zone, the total investment of the project is 1.2 billion U.S. dollars. After the project is completed, it will reach production capacity of 80,000 pieces of bump technology products per month and 16,000 pieces of three-dimensional multi-chip integrated packaging products per month. The project will focus on the industrialization of three-dimensional multi-chip integrated packaging, and build a new high-end packaging and testing base that is China's leading and world-class.
On February 18, 2022, Shenghejing Micro's 3D multi-chip integrated packaging project officially started in Jiangyin High-tech Zone. According to the news at that time, the Shenghejing Micro 3D multi-chip integrated packaging J2B plant project started this time is expected to be completed and put into use by the end of 2023. After the completion of the project, the company will have a monthly production capacity of 120,000 wafer-level packaging and 20,000 chips for integrated processing.
It is reported that Shenghe Jingwei is the first company in mainland China to focus on the high-density bump processing of 12-inch mid-section silicon wafers, and is committed to the development of advanced silicon wafer-level advanced packaging technology and chip system integration processing business
According to the news released by Jiangyin High-tech Zone, the total investment of the project is 1.2 billion U.S. dollars. After the project is completed, it will reach production capacity of 80,000 pieces of bump technology products per month and 16,000 pieces of three-dimensional multi-chip integrated packaging products per month. The project will focus on the industrialization of three-dimensional multi-chip integrated packaging, and build a new high-end packaging and testing base that is China's leading and world-class.
On February 18, 2022, Shenghejing Micro's 3D multi-chip integrated packaging project officially started in Jiangyin High-tech Zone. According to the news at that time, the Shenghejing Micro 3D multi-chip integrated packaging J2B plant project started this time is expected to be completed and put into use by the end of 2023. After the completion of the project, the company will have a monthly production capacity of 120,000 wafer-level packaging and 20,000 chips for integrated processing.
It is reported that Shenghe Jingwei is the first company in mainland China to focus on the high-density bump processing of 12-inch mid-section silicon wafers, and is committed to the development of advanced silicon wafer-level advanced packaging technology and chip system integration processing business