Same principle applies to both immersion and dry lithography
Chinese semiconductor industry
- Thread starter Hendrik_2000
- Start date
- Status
Same principle applies to both immersion and dry lithography
The first two parameter "机器整体套刻精度" "光源中心波长稳定性" still applies. If you have any doubt，feel free to leave your question at the comment section on havok's Zhihu page
SMEE SSA600 was "rated" at 90nm resolution capability whereas ASML XT1460 is "rated" at 65nm partly because SSA600 uses 0.75NA and the latter uses 0.93NA projection lens. XT1460 also have additional features that enable lower k1 capabilities. SSA600 was reverse engineered based on ASML's older PAS5500/1150C.
SMEE KrF is currently rated with 110nm resolution limit just like ASML's XT860; both with 0.80NA projection lens. ASML does have a higher NA KrF system, XT1060 that is outfitted with 0.93NA and hence it would have better resolution capability of 80nm.
| Make / Model | Resolution (nm) | k1 | wavelength (nm) | NA | Litho Type |
| SMEE SSB800 | 350 | 0.62 | 365 | 0.65 | Scanner |
| ASML XT400 | 350 | 0.62 | 365 | 0.65 | Scanner |
| Canon FPA5550/iZ2 | 350 | 0.55 | 365 | 0.57 | Stepper |
| SMEE SSC800 | 110 | 0.36 | 248 | 0.82 | Scanner |
| ASML XT860 | 110 | 0.35 | 248 | 0.80 | Scanner |
| Canon FPA6300/ES6A | 90 | 0.31 | 248 | 0.86 | Scanner |
| ASML XT1060 | 80 | 0.30 | 248 | 0.93 | Scanner |
| SMEE SSA600 | 90 | 0.35 | 193 | 0.75 | Scanner |
| ASML 5500/1150C | 90 | 0.35 | 193 | 0.75 | Scanner |
| ASML XT1460 | 65 | 0.31 | 193 | 0.93 | Scanner |
| ASML NXT1470 | 57 | 0.27 | 193 | 0.93 | Scanner |
There's nothing holding SMEE back in terms of their target scanner capability. It's mere choices of what NA lens they plan to put into the system.
What would be holding SMEE back would mostly be all the HVM features required to enable low k1 process capability. The few tidbits Havoc mentioned, to me, are merely basic requirements to make a scanner function (to meet tool acceptance test specification). To go beyond just an equipment that could pass tool acceptance versus one that would do well in production are all the nitty gritty control capabilities, which at this point are mostly missing on SMEE systems. These basic capabilities are missing on the lone SMEE iline SSB800 system, so I don't see why these features would be available on any of their subsequent KrF, ArF, or ArFi releases in the near term.
Last edited:
I re-checked ATP spec for SSB800 & XT400, they were both spec'ed at 280nm. The lower k1 for these scanners versus Canon's iLine stepper now makes more sense.
| Make / Model | Resolution (nm) | k1 | wavelength (nm) | NA | Litho Type |
| SMEE SSB800 | 280 | 0.50 | 365 | 0.65 | Scanner |
| ASML XT400 | 280 | 0.50 | 365 | 0.65 | Scanner |
| Canon FPA5550/iZ2 | 350 | 0.55 | 365 | 0.57 | Stepper |
| SMEE SSC800 | 110 | 0.36 | 248 | 0.82 | Scanner |
| ASML XT860 | 110 | 0.35 | 248 | 0.80 | Scanner |
| Canon FPA6300/ES6A | 90 | 0.31 | 248 | 0.86 | Scanner |
| ASML XT1060 | 80 | 0.30 | 248 | 0.93 | Scanner |
| SMEE SSA600 | 90 | 0.35 | 193 | 0.75 | Scanner |
| ASML 5500/1150C | 90 | 0.35 | 193 | 0.75 | Scanner |
| ASML XT1460 | 65 | 0.31 | 193 | 0.93 | Scanner |
| ASML NXT1470 | 57 | 0.27 | 193 | 0.93 | Scanner |
Bro I like the guerilla comment...lol Ren Zheng Fei is a true Maoist, creating multiple soviet base to grow and survive (just like the red army they used captures equipment to fight). Their long march had ended, as they consolidate. This year is their coming out moment as they start their offensive, I for one can't wait for a major battle in 2024 as they may release a 7nm indigenous chip.
Year '23 & '24 will be very exciting as Huawei re-enter the smartphone markets, incl 5G chips.. meanwhile both TSMC & Samsung must be getting nervous as China's EUV should appear by '27 at the latest? Huawei & others in China will be major IDM's
Huada Jiutian: The company has carried out the research and development of EDA+AI technology and chiplet advanced packaging design technology
Jiwei.com news (text/Bai Yuxuan) On January 12, Huada Jiutian stated on the investor interaction platform that the company has carried out research and development of EDA+AI technology and chiplet advanced packaging design technology, and the company will continue to improve its advanced technology. Layout, continuously improve technological advancement and product competitiveness, meet the needs of more customers and create value for customers.
- Status