Chinese semiconductor industry

Status
Not open for further replies.
O

Oldschool

Junior Member
Registered Member
Alb said:
From the researches I made on the web below is a summary of the technological level of Chinese semi equipment makers for some of the major steps:
Lithography:
Smee. 28nm (to be confirmed) possibly 7nm with multiple exposures
Etching:
Amec. 5nm. 3nm under development
Naura. 14nm. 5nm under development
PVD:
Naura. 14nm. 5nm under development.
CVD:
Naura. 14nm. 5nm under development
Shenyang Piotech: 5nm
ALD:
Naura. 14nm. 5nm under development
Shenyang Piotech: 5nm
CMP:
Hwatsing 14nm.
Ion implanter:
CETC 28mm.
Metrology and defect inpection:
Several companies but not sure which node they are capable of.

I have probably firgotten some steps and would be helpful to add more steps/companies to the list.
Click to expand...

The most common equipment for any nanotechnology and semiconductor industry characterization is focus ion beam (FIB} for minor structure edit/modification, use ion to chip away the materials. (SEM)scanning electron microscope for taking a picture.
FIB-SEM combo tool is very common equipment in industry. EUV also uses FIB for mirror surface smoothness milling.
Any Chinese company making that. If not , then it's a must have in the to do list.
Should be very doable , less difficult than lithography.
 
A

antiterror13

Brigadier
Hendrik_2000 said:
In English google translate excellent news basically except for lithograph machine china is close to self sufficient from Si Ingot, wafer production, mask, engraving, cleaning, inspection etc

News! Jingce Semiconductor's eView automatic wafer defect review equipment was officially delivered
2020-12-23 16:44:40 Source: OLED industry
Please, Log in or Register to view URLs content!


Shanghai, December 23, 2020-Shanghai Jingce Semiconductor Technology Co., Ltd. ("Shanghai Jingce Semiconductor") announced the launch of its first semiconductor electron beam inspection equipment: eViewTM automatic wafer defect review equipment, which was officially delivered today Domestic customers help the localization of the semiconductor industry.

This equipment is a review and classification device based on scanning electron microscope technology. It is used in the integrated circuit manufacturing process. It can perform high-resolution review, analysis and classification of the results of optical defect detection equipment to meet the needs of 10x nm integrated circuit process manufacturing.


It is reported that eViewTM adopts self-developed scanning electron microscope technology with ultra-high resolution and is suitable for automatic detection of process defects in integrated circuit manufacturing processes of 10x nm and below.

Source: Accurate Test
Disclaimer: This article is edited and reproduced by this website. The purpose of reprinting is to convey more information. It does not mean that this website agrees with its views and is responsible for its authenticity. If it involves the content of the work, copyright and other issues, please contact this website within 30 days, and we will delete the content as soon as possible.
Click to expand...

I think it is safe to assume that China will be 100% self sufficient for 28nm next year and 14nm in 2023
 
W

WTAN

Junior Member
Registered Member
ansy1968 said:
Hi WTAN, gelgoog,

A question, in five years time as China strives for self sufficiency, where will you place the European, the Japanese and the US. Here in this video Europe will invest 145 billion euros to whim itself from American tech. For me it's good to have choices, But with sanction being weaponized (I think the world IC/semiconductor will be divided to 3 blocs (US , CHINA & the EU) with Japan a big question mark) , Nobody in its right mind will invest an expensive FABS equipment with uncertainty regarding supplies. Of the four , China has the market to sustain itself for a full spectrum top to bottom local IC development, what about others? will Japan be forced to JV with China to survived?

Please, Log in or Register to view URLs content!




Please, Log in or Register to view URLs content!

608 views1 hour ago

CC
Click to expand...
I think the biggest loser among the 3 blocs will be the US. Its illogical policy of using its Semiconductor IP as a weapon to sanction China will backfire disastrously.
This is already forcing the Europeans and China to develop their own Semiconductor technology and IP. Once the EU and China have developed their own technologies, they will never ever buy from the Americans again. The US will be regarded as an unreliable supplier of all types of technology.
The Americans will eventually lose their dominance in the Semiconductor field which they have led the world since the 1970's.
No wonder they called Trump a Moron in the early days of his Presidency.
China will be the biggest winner in all this as China has the Market to sustain a full Supply Chain of Semiconductor FABs and Equipment etc.
China will manufacture tech products that they may never have even considered doing if the US did not sanction them. This will expand Chinas Industrial base and turn China into a advanced Industrial economy.
Japan will have no choice but to get closer to China in order to stay relevant in the Semiconductor field.
The Americans will not hesitate to destroy Japanese Tech companies by using its sanctions on China to favour American companies.
 
A

ansy1968

Brigadier
Registered Member
WTAN said:
I think the biggest loser among the 3 blocs will be the US. Its illogical policy of using its Semiconductor IP as a weapon to sanction China will backfire disastrously.
This is already forcing the Europeans and China to develop their own Semiconductor technology and IP. Once the EU and China have developed their own technologies, they will never ever buy from the Americans again. The US will be regarded as an unreliable supplier of all types of technology.
The Americans will eventually lose their dominance in the Semiconductor field which they have led the world since the 1970's.
No wonder they called Trump a Moron in the early days of his Presidency.
China will be the biggest winner in all this as China has the Market to sustain a full Supply Chain of Semiconductor FABs and Equipment etc.
China will manufacture tech products that they may never have even considered doing if the US did not sanction them. This will expand Chinas Industrial base and turn China into a advanced Industrial economy.
Japan will have no choice but to get closer to China in order to stay relevant in the Semiconductor field.
The Americans will not hesitate to destroy Japanese Tech companies by using its sanctions on China to favour American companies.
Click to expand...
Hi WTAN,

Thanks for the explanation, I never understand how Trump become a billionaire, if your running a business there is a motto that we follow, "never let your customer become your competitor"
 
W

WTAN

Junior Member
Registered Member
ansy1968 said:
Hi horse,

another one from motif (china military forum), @WTAN is this the one you refer to as the huge SMIC FABS under construction in Beijing, 135,000 wafer pieces per month seems a lot.

You do know that SMIC is now under sanction, right? Under the reason blah blah blah. It doesn't stop them from expanding. If they're smart, they should remove as much American tech as possible moving forward.

SMIC Establishes New 12-Inch Wafer Subsidiary in Beijing​

Dec 07, 2020 04:56 PM (GMT+8)
The large semiconductor foundry plans to expand production capacity with the new subsidiary – and will promote sustainable development.
On December 4, 2020, SMIC announced plans to set up a new wafer fabrication company, SMIC Beijing, cooperating with China Integrated Circuit Industry Investment Fund II and Etown Capital, with a total investment of USD 7.6 billion and a registered capital of USD 50 billion. SMIC is investing USD 2.55 billion and taking 51% of shares of the newly-formed company.
SMIC Beijing, as a new subsidiary of SMIC, will mainly focus on producing 12-inch (300 mm) silicon wafers. It will provide multiple services, such as IC designs, wafers and IC tests, and IC packaging. According to SMIC, the establishment of the subsidiary can help the company expand its production scale, reduce its production costs, and promote its sustainable development. It is estimated that SMIC's 12-inch (300 mm) silicon wafer production capacity will reach 135,000 pieces per month when finished.
According to its Q3 report, SMIC achieved revenue of CNY 20.8 billion in the first nine months, up 30.2% compared with the same period of 2019. Notably, the net profit reached CNY 3.08 billion yuan, soaring 168.63% year-on-year. The net profit of the first three quarters has nearly doubled compared with the whole year of 2019. The new-established subsidiary will facilitate its further development.
Related link:
Please, Log in or Register to view URLs content!
Click to expand...
The huge SMIC FAB that i was refering to is a 28nm FAB.
 
W

WTAN

Junior Member
Registered Member
Skywatcher said:
By "EUVL could appear sometime in 2025" do you mean a working prototype, or mass production?
Click to expand...
I would say a EUVL working Prototype would be revealed which will then be subject to testing.
This would be at the end of the next 5 year plan (2021-2025).
However it could be much sooner as CAS has gathered together many companies to work on this project, including Huawei.
With the sanctions, there will be pressure on the EUVL Alliance to come up with a indigenous EUVL as soon as possible in order not to fall behind too much in the tech race.
Funding is a big issue with the CAS and SMEE and the inclusion of Huawei will play a big part in speeding up work on the EUVL.
 
A

ansy1968

Brigadier
Registered Member
WTAN said:
I would say a EUVL working Prototype would be revealed which will then be subject to testing.
This would be at the end of the next 5 year plan (2021-2025).
However it could be much sooner as CAS has gathered together many companies to work on this project, including Huawei.
With the sanctions, there will be pressure on the EUVL Alliance to come up with a indigenous EUVL as soon as possible in order not to fall behind too much in the tech race.
Funding is a big issue with the CAS and SMEE and the inclusion of Huawei will play a big part in speeding up work on the EUVL.
Click to expand...
Hi WTAN,

From our previous discussion, regarding the EUVL everything is ready except for the light source, has CIOMP able to make progress on its DPP project? or its a dead end and they are looking for other solution?(cause of delay)
 
Nobonita Barua

Nobonita Barua

Senior Member
Registered Member
WTAN said:
I would say a EUVL working Prototype would be revealed which will then be subject to testing.
This would be at the end of the next 5 year plan (2021-2025).
However it could be much sooner as CAS has gathered together many companies to work on this project, including Huawei.
With the sanctions, there will be pressure on the EUVL Alliance to come up with a indigenous EUVL as soon as possible in order not to fall behind too much in the tech race.
Funding is a big issue with the CAS and SMEE and the inclusion of Huawei will play a big part in speeding up work on the EUVL.
Click to expand...
What about mass production of 7nm equivalent N+1? Will it be stopped until the equipment are delivered?
 
Status
Not open for further replies.
Top