Chinese semiconductor industry

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ansy1968

Brigadier
Registered Member
The esteemed SMEE Insider Havok has recently been revealing some information about a Arf 6khz Excimer Light Source for Immerssion DUVL.
What is surprising is that he claimed that a prototype Arf 6Khz Light Source was recently developed this year in 2022.
The Arf 6Khz 60W Light Source Prototype was actually developed last year in 2021 and used in the first prototype SMEE 28nm DUVL for testing.
So the Arf 6Khz Light source prototype that was developed just recently in 2022 could be the 90W version.

Of course this currently cannot be confirmed but i am sure more information will come out soon.
Hi sir, happy new year, I'm glad to hear from you again, I'm with you regarding the 60W light source, from the successful verification of SMEE 28NM DUVL and The domestic 28nm and 14nm line cannot be achieved without such accomplishment. And recently we are hearing rumors of final development of 22nm DUVL, it conjunct with what you are saying. So @olalavn is correct, we may see SSA 900 DUVL being introduced in 2024 and mass produce in 2025. :cool:
 

tokenanalyst

Brigadier
Registered Member
ACM's tool doesn't yet cover DUV ArF immersion, as far as I know. My understanding is that they are qualifying their ArF tool at a customer beginning this quarter, they will begin qualifying their i-line tool in the later part of 2023, and also do KrF in 2024.
Weird, I thought I saw that was going to be used for the 28nm lithography process which require immersion. I think there is a mistranslation or something, its strange that they are going to launch a new tool for each type of resists when most the industry just have one tool that can deal with multiple type of resists. So lead me to believe that is going to be one tool that is going to be verified for i-line, KrF and immersion later. For now looks like their client needs ArF with some urgency.
TEL:
1672371100996.png
Kingsemi:

1672371196026.png1672371308002.png
 

olalavn

Senior Member
Registered Member
Hi sir, happy new year, I'm glad to hear from you again, I'm with you regarding the 60W light source, from the successful verification of SMEE 28NM DUVL and The domestic 28nm and 14nm line cannot be achieved without such accomplishment. And recently we are hearing rumors of final development of 22nm DUVL, it conjunct with what you are saying. So @olalavn is correct, we may see SSA 900 DUVL being introduced in 2024 and mass produce in 2025. :cool:
Screenshot 2022-12-30 104031.png

lol, I talk with my friend when he ask me... I think around October 2024 - March 2025... we will have good news about China's EUV.
 
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Koron

Just Hatched
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Wei Shaojun, an official at the China Semiconductor Industry Association, said in a live-streamed speech on Thursday that the country’s current efforts to shore up the domestic chip industry by focusing on shortcomings is a strategic error.

He expects Beijing to revamp its approach in overcoming US restrictions by putting more resources in areas where China has an advantage, such as mature process technologies. “It’s a strategic mistake to only fill in the gaps,” Wei, a professor at Beijing’s Tsinghua University, said at the Chinese IC Summit in Shenzhen. “In the past few years, the more we tried to make up for our deficiencies, the more passive we have become.” “We should focus not on overcoming weaknesses, but on enhancing our strengths,” Wei said.

Regarding a recent news report by Reuters that said China would provide 1 trillion yuan (US$144 million) over the next five years to subsidise its semiconductor industry, Wei said he had checked with his contacts but “no one has spoken about such a plan”.

Instead, Wei said China will carry out a complete redesign of its strategy to better leverage resources and use a variety of ways to boost the industry. The new gameplan will be robust enough to last until 2035 at least, he said.
Unquote
 

ZeEa5KPul

Colonel
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Wei Shaojun, an official at the China Semiconductor Industry Association, said in a live-streamed speech on Thursday that the country’s current efforts to shore up the domestic chip industry by focusing on shortcomings is a strategic error.

He expects Beijing to revamp its approach in overcoming US restrictions by putting more resources in areas where China has an advantage, such as mature process technologies. “It’s a strategic mistake to only fill in the gaps,” Wei, a professor at Beijing’s Tsinghua University, said at the Chinese IC Summit in Shenzhen. “In the past few years, the more we tried to make up for our deficiencies, the more passive we have become.” “We should focus not on overcoming weaknesses, but on enhancing our strengths,” Wei said.

Regarding a recent news report by Reuters that said China would provide 1 trillion yuan (US$144 million) over the next five years to subsidise its semiconductor industry, Wei said he had checked with his contacts but “no one has spoken about such a plan”.

Instead, Wei said China will carry out a complete redesign of its strategy to better leverage resources and use a variety of ways to boost the industry. The new gameplan will be robust enough to last until 2035 at least, he said.
Unquote
Just one post in and I already know who it is...

The countdown's already begun, sleepy.
 

seemlay10

New Member
Registered Member
I have some questions about CXMT and YMTC.

Do you think that the abilities of engineers are different between CXMT and YMTC?

Compared to the advancement of YMTC, CXMT looks very very slow.

Do you think that DRAM development is harder than NAND development?

If the main difference between CXMT and YMTC comes from the compentence levels of engineers, then Chinese government should help CXMT to recruit engineers with high capabilities.

I also want Chinese goverment to increase the number of students majoring semiconductors in major universities.

How about your opinions?
 

bzhong05

New Member
Registered Member
Just one post in and I already know who it is...

The countdown's already begun, sleepy.
Note how the Chinese readout really differs from SCMP's...

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对于该传闻,魏少军教授回应称:“我没有听说过这个事情。我也核实了一下,确实没有人说有1万亿人民币的投入,这可能是捕风捉影,也可能有人在故意试探中国。因为这个新闻是从外媒发出来的。”

魏少军教授也强调:“我相信伴随着新的发展战略和措施,如果说未来只有1万亿人民币可能有点太小瞧我们了,后面的发展肯定不是以1万亿的方式发展,而是以更重要的国家大战略的方式发展集成电路。这里面的资源投入现在不好说,可能根据实际情况按需来拨款、按需来花费投入的资源。因此我选了几个词、科学、全面、系统、持续和大力度作为关键词。”

"Just one trillion RMB is a bit of an understatement.... we will develop the IC industry with an even more important national grand strategy and it will not come in the form of investing one trillion RMB.... the keywords of the strategy will be scientific, comprehensive, systemic, continuous, and intensive." - Wei Shaojun
 

FairAndUnbiased

Brigadier
Registered Member
Weird, I thought I saw that was going to be used for the 28nm lithography process which require immersion. I think there is a mistranslation or something, its strange that they are going to launch a new tool for each type of resists when most the industry just have one tool that can deal with multiple type of resists. So lead me to believe that is going to be one tool that is going to be verified for i-line, KrF and immersion later. For now looks like their client needs ArF with some urgency.
TEL:
View attachment 104073
Kingsemi:

View attachment 104074View attachment 104075
Kingsemi and ACM Research are direct competitors in many fields of wet chemistry once ACM gets into the resist coat/developing sector. Is China big enough to support 2 equipment companies in the same niche?
 

Anlsvrthng

Captain
Registered Member
I have some questions about CXMT and YMTC.

Do you think that the abilities of engineers are different between CXMT and YMTC?

Compared to the advancement of YMTC, CXMT looks very very slow.

Do you think that DRAM development is harder than NAND development?

If the main difference between CXMT and YMTC comes from the compentence levels of engineers, then Chinese government should help CXMT to recruit engineers with high capabilities.

I also want Chinese goverment to increase the number of students majoring semiconductors in major universities.

How about your opinions?
Good company culutre makes good engineers, not the universities.

Yout post identify the differences between the two company due to mistakes during hiring process, which is an interesting idea.


The issue is most likelly the management, training and development culture differences.
 
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