I agree there were a ton of EUV technology being developed in China for years well before this point. Where I differ is from the paper you referred to for example, I would consider that to be academic research based development into the principles of EUV operation with regards to key sub-systems, principles, etc. The latest developments from Huawei and its partners (if true) I would consider to be a step ahead of that because it is moving towards more of the system integration and implementation of a full operational workflow that would approximate the end-to-end use sequence under expected operating conditions which is closer to the goal of a functional commercial system. I guess where I am coming from is that the latest developments (if true) are the next stage in evolution and development of the earlier work you pointed to. This is not to overlook those developments, but that those concepts are built upon by someone like Huawei into something that can fit their operational needs.There already a lot of EUV technologies in China already since very early, including prototype machines. And the development of EUV in China just keep growing, already posted some of that stuff here and the rabbit hole is pretty deep. And yes there is a lot of patented technologies in EUV masks, pellicles and photoresists and there is already signs of commercial activity in China regarding EUV technologies, including EUV mask, maybe someday I will post some findings in the future or not. So is very probably that Huawei receiving a lot of support in this endeavor, I would not surprise if a bigger level of support than SMEE. Given the fact the Huawei can hire more people than SMEE.
Huawei is not TSMC or SMIC, so for now it seems they just need some kind of EUV machine that can be used to make the most critical layers of their most advanced chips, so I don't think they are looking for something as performant as the ones that a big pure and play foundry needs. The patent make it to seem that they are looking something that can pattern an specific critical layer. Looks like everything else is going to be done with SMEE immersion and dry machines.
And the yes they are probably cutting through some of ASML patents, given the size of the portfolio that ASML has in China
They put a video in their own website and then remove it.
Agreed, Huawei will focus on something that fits their needs, EUV or otherwise and the level of performance will reflect that. That being said, I think their patent does reflect their requirements from an EUV setup since it may be specific to their process of patterning certain layers as you pointed out. That is just my speculation, and we will have to see how the final implementation shapes out.