反贼殖人 are enemies of the people. No tears for crushing them with iron fists.
Chinese semiconductor industry
- Thread starter Hendrik_2000
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Unfortunately，the latest TiPlus7100 seems to be old 128L architecture，not new 232L architecture，according to Techinsight report
yeah, that's very disappointing of YMTC to deceive customers.
earnings call transcript with SMIC, a few main points
- the long delivery time equipment that they were mentioned (which required the $1.6 billion in additional capex) are of two types: 1) lithography machines - 18 months to 2 years for delivery 2) companies with low production - 18 months for delivery
- They mentioned that they got some tools, but cannot increase production until they have received the other needed tools. Part of the reason for the prepayment is to lockdown delivery slots so they can ensure production increases
- my feeling is that when they talk about prepayment for early delivery of long delivery time equipment, they are mostly talking about ASML lithography machines and that they are not only acquiring more future delivery slots for ASML expansion, but also more immediate delivery slots. When other companies are cutting back capex for 2023, it opens up certain delivery slots that SMIC can take advantage of. This will probably materialize throughout 2023.
- As for impact sanctions, it seems like existing American customers have long term contracts with SMIC, but are unsure if the new sanctions would affect them. As such, they are working with customers to clear up concerns so they can continue production. Keep in mind US is 20% of their market and purchases MCU, LAN and other products.
- utilization will be lower in Q4 than Q3 due to continued to demand weakness. Revenue will also be lower due to lower utilization and price drops. Sounds like consumer electronics is a bulk of their revenue, so its weakness has a big effect on their bottom line. auto chips is still a small market so high demand in auto chips doesn't offset consumer electronics weaknesses.
- They had 15 to 16k employees last year and they are already over 20k employees now. Sounds like they are having much better success in retaining and developing talents. They need new engineers, managers and R&D talent.
earnings call transcript with SMIC, a few main points
- the long delivery time equipment that they were mentioned (which required the $1.6 billion in additional capex) are of two types: 1) lithography machines - 18 months to 2 years for delivery 2) companies with low production - 18 months for delivery
- They mentioned that they got some tools, but cannot increase production until they have received the other needed tools. Part of the reason for the prepayment is to lockdown delivery slots so they can ensure production increases
- my feeling is that when they talk about prepayment for early delivery of long delivery time equipment, they are mostly talking about ASML lithography machines and that they are not only acquiring more future delivery slots for ASML expansion, but also more immediate delivery slots. When other companies are cutting back capex for 2023, it opens up certain delivery slots that SMIC can take advantage of. This will probably materialize throughout 2023.
- As for impact sanctions, it seems like existing American customers have long term contracts with SMIC, but are unsure if the new sanctions would affect them. As such, they are working with customers to clear up concerns so they can continue production. Keep in mind US is 20% of their market and purchases MCU, LAN and other products.
- utilization will be lower in Q4 than Q3 due to continued to demand weakness. Revenue will also be lower due to lower utilization and price drops. Sounds like consumer electronics is a bulk of their revenue, so its weakness has a big effect on their bottom line. auto chips is still a small market so high demand in auto chips doesn't offset consumer electronics weaknesses.
- They had 15 to 16k employees last year and they are already over 20k employees now. Sounds like they are having much better success in retaining and developing talents. They need new engineers, managers and R&D talent.
Zheshang Venture Capital's exclusive investment || Hanking Semiconductor Materials Co., Ltd. completed an angel round of financing of tens of millions of yuan
Recently, Hanking Semiconductor Materials Co., Ltd. announced the completion of an angel round of financing of tens of millions of yuan, exclusively invested by Zheshang Venture Capital. This round of financing will be mainly used for R&D investment and equipment procurement of silicon carbide products for semiconductor equipment.
Liaoning Hanking Semiconductor Materials Co., Ltd. (abbreviation: Hanking Semiconductor) was established in June 2022. It is a high-precision company specializing in SiC (scientific name: silicon carbide) sintering, CVD coating, finishing production, inspection and sales. end enterprise.
The silicon carbide products for semiconductor equipment independently developed by Hanking Semiconductor Materials Co., Ltd. have officially passed the customer test certification at the customer end. This move is the first to achieve a domestic breakthrough in technology, fill the gap in the country, and will greatly promote the development of the domestic semiconductor industry.
The ultra-high purity, stable chemical properties, ultra-high temperature resistance, high thermal conductivity, and ultra-low thermal expansion coefficient of silicon carbide for semiconductors make it play a core role in various processes in the field of IC manufacturing. The role of the component.
In recent years, on a global scale, the market space of silicon carbide materials for semiconductor production equipment consumables has grown steadily, and domestic demand has become increasingly strong. However, this product has extremely high requirements on material purity, complex processing technology and difficult processing. The product supply is controlled by foreign suppliers all the year round. Customers are faced with many difficulties such as low supply, long delivery time and high price. Hanking Semiconductor's technicians have taken the lead in becoming the first domestic manufacturer of silicon carbide consumables by virtue of their many years of deep cultivation experience and experience in the semiconductor field and international leading technology and production equipment. As of October this year, Hanking Semiconductor has initially built a product line with SiC Tube, SiC Boat, SiC Cap, SiC Fin, and SiC Ring as the main products. The next step will continue to increase R&D efforts to meet the needs of the semiconductor industry.
The movement of the Dapeng is not the lightness of a feather; the speed of the Qiji is not the standing of one foot. Hanking Semiconductor is united and united, adheres to the road of "quality development", and constantly realizes technological innovation and product upgrade. Hanking Semiconductor will definitely contribute its own strength to the development of China's semiconductor industry!
you left off an important revelation by SMIC on its expansion (from the Q & A section):
“Q: 8-inch and 12-inch capacity expansion distribution?
A: 8 inches, we have a stable production expansion plan. The production expansion in the first two years is basically 40040k/month, and this growth rate will be maintained the next year.
At the beginning of the year, we announced a 12-inch production expansion target, which has not changed much from the beginning of the year. The growth rate should be similar to or slightly higher than last year. In 5-7 years, the 12-inch target reached 340k/month.”
5-7 years……SMIC’s own estimate on when its announced 12” expansion plan will be completed is between 2027 to 2029.
With the advantages of high speed, high reliability and long service life, NOR flash memory plays an irreplaceable role in artificial intelligence, automotive electronics and industrial fields. At present, the commonly used planar NOR flash memory encounters a bottleneck in the size reduction of the technology generation below 50 nanometers, and it is difficult to further improve the integration density, optimize the device performance and reduce the manufacturing cost. In order to break through the above bottleneck, researchers have proposed a variety of three-dimensional NOR ( 3D NOR ) devices based on polysilicon channels, but the low mobility of polysilicon channels and slow reading speed affect the overall performance of NOR devices.
Recently, the research team of Zhu Huilong from the Institute of Microelectronics Integrated Circuit Advanced Technology Research and Development Center used the new vertical transistor process developed to produce a high-performance single-crystal channel 3D NOR flash memory device. The stacked transistors have both single-crystal silicon channels. It has the advantages of high performance and low manufacturing cost of three-dimensional integrated integration. It can achieve the same or better performance of single-crystal silicon channel planar NOR flash memory devices without upgrading the lithography machine. It can also greatly improve the memory integration density, Increase storage capacity. The 3 ′ 3 ′ 2 three-dimensional NOR flash memory array developed by the team achieves normal reading, writing and erasing, and achieves the goal of reading current, programming and erasing speeds comparable to two-dimensional NOR flash memory devices, and the new process is compatible with mainstream silicon-based processes. , easy to apply.
The related results are published as the cover and " Editors Picks " ( Editor's Picks ) article titled "A Novel 3D NOR Flash with Single-Crystal Silicon Channel: Devices, Integration, and Architecture" published in the international microelectronics top journal " IEEE Electron Device " Letters . Huang Weixing, a doctoral student of the Institute of Microelectronics, is the first author, and Zhu Huilong is the corresponding author. This is also the result of Zhu Huilong's research team's vertical nanodevice-related achievements again selected in the " Editor's Choice " article.
The related results are published as the cover and " Editors Picks " ( Editor's Picks ) article titled "A Novel 3D NOR Flash with Single-Crystal Silicon Channel: Devices, Integration, and Architecture" published in the international microelectronics top journal " IEEE Electron Device " Letters . Huang Weixing, a doctoral student of the Institute of Microelectronics, is the first author, and Zhu Huilong is the corresponding author. This is also the result of Zhu Huilong's research team's vertical nanodevice-related achievements again selected in the " Editor's Choice " article.
From the first article:
The anonymous official revealed that, in one instance at the CIIE, a large foreign semiconductor industry player "timely" demonstrated its lithography machines as Netherlands-based ASML came into the spotlight amid escalating US tech restrictions on China. "It probably envies ASML, which has had all the fame, and perhaps believes it can have some of the market share, should ASML choose to cede."
Nikon??
Wow. Increase 340,000 in 5 years
公司依据市场长期需求进行中长期的资本开支规划，建设进度有可能根据市场变化、采购周期、成本等因素进行适当调整。“未来5-7年，公司有中芯深圳、中芯京城、中芯东方等总共约34万片12英寸新产线的建设项目。基于这些项目长远安排的原因，公司要支付长交期设备提前下单的预付款，因此今年全年资本支出从50亿美元上调为66亿美元。”
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