Chinese semiconductor industry

Status
Not open for further replies.

tphuang

Lieutenant General
Staff member
Super Moderator
VIP Professional
Registered Member
More turbulence ahead for semiconductor industry, many semiconductor companies might be forced to be sold or relocated or exited certain market.
Please, Log in or Register to view URLs content!
The hits just keep coming. If this doesn't push the Koreans to go 100% at de-Americanizing their production line, then nothing will.

Basically, the Koreans and ymtc/cxmt are in the same place now, because ymtc actually stocked up tools for this exact scenario. The only difference is that the lam employees are still servicing the Korean fabs. If this causes samsung and so to sell their mainland fabs to china, it would be a huge gift to ymtc and cxmt.

Lol, a law aimed at kneecapping china ends up knee capping micron's competitors! Who said the American politicians are all fools. This is like 4d chess.

Seriously though, china need to be having conversations with Korean firms about how they can help each other to get through this period smoothly. One year is basically no time.

Bro,
Facts you cited are not correct:
- N+3 is similar to tsmc N6 (on paper). But in reality, N+3 built with DUV will be inferior in terms of overall yield/quality than N6 built with EUV.
- Intel's 'N' (HVM) node as of Oct 2022 is Intel4. Intel4 output volume is now bigger than SMIC N+1
- Intel4 will reach output volume > the entire SN1 wafer output by late 2024.
- Intel4 has higher transistor density than tsmc N4.

So, your claim that 'N+3 is N5' & that 'SMIC will be ahead of Intel by 2 generations' are incorrect.

Do you have actual numbers on this n+3 that's different than what's posted earlier? N+2 improved is equivalent in transistor density and energy consumption as Samsung 4 nm based on the roadmap posted earlier this thread. N+3 is 3 nm process using euv. Do you have anything that states otherwise? I am really curious if there are better sources on this.
 

ZeEa5KPul

Colonel
Registered Member
I thought it would be good to summarize the present state of the Chinese lithography industry at this point of YOOL 2022:

DUV:
  • The SSA800 has met expectations (or disappointed them, depends who you ask) and delivered to customers for 28nm production. It is roughly comparable to an ASML NXT:1980Di. China has achieved completely indigenous 28nm volume production.
  • The SSA800 is expected to be used in 14nm production through multipatterning next year.
  • A follow-on DUVL machine (name unknown) using a more powerful light source and improved workbench for single exposure production of 22nm and multipatterning of 7nm (perhaps 5nm?) is expected Soon™. Expected to be comparable to ASML NXT:2050i.
EUV:
  • There were some rumours of a 150W DPP EUVL tool supposed to be released around now. Obviously, no such thing has materialized, which means it's A) very secretive or B) as I suspect, DPP is not a viable path to commercial EUV.
  • Everything about LPP EUV is a black box (at least in comparison to DUV). No word on the status of the CO2 laser, the optics, etc. All we "know" is that a machine should be ready around 2025.
  • SSMB is a very interesting dark horse, but I don't think it's in the running for China's first generation EUVL. If it lives up to its promise, it would be a vast improvement over LPP EUVL and China would gain enormous advantages from getting to it first.
I'd welcome the inputs, thoughts, and critiques of knowledgeable members like @WTAN, @tokenanalyst, and @FairAndUnbiased.
 
Last edited:

tokenanalyst

Brigadier
Registered Member
Does the manufacturing of PCB need cutting edge high tech?
There is not clear cut answer to that question, all depends the complexity of the PCBs you want to make and what volume you want. Very simple LDI single layers ones you can make a few dozens at a home with simple tools:
simplePCB.jpg
Complex multilayers HDI PCBs require.....quite of a lot of tools and the capital investment is not small, way more complex higher resolution lithography machines, bulk photoresist, copper plating tools, drilling tools, in some case microdrilling laser tools, automatic inspection tools, cleaning tools a whole lot.
ComplexPCB.jpg

As with packaging, PCB manufacturing is becoming quite complicated. some much that KLA just acquire a company just for that.

Please, Log in or Register to view URLs content!

And then top of that you have ceramic PCBs that are really hard to work it and hybrid ICs, used in extreme applications like in Aerospace or communications , which the Chinese have made quite an investment. Those require even more complex manufacturing.
Etching is quite difficult in this type of boards.

CeramicPCB.jpg


Is not as impressive as Chip making but you can do microfabrication in a lab with laser-DMD lithography and with lab size deposition, etching, thermal processing tools if you want to microfabricate a few things too.
Saying PCB making is just low tech stuff is pretty much an underestimation. PCB-> packaging-> RF-> MEMs ->ICs, doesn't matter difficulty-cost increase with complexity, size, accuracy and volume.
 

tokenanalyst

Brigadier
Registered Member
I thought it would be good to summarize the present state of the Chinese lithography industry at this point of YOOL 2022:

DUV:
  • The SSA800 has met expectations (or disappointed them, depends who you ask) and delivered to customers for 28nm production. It is roughly comparable to an ASML NXT:1980Di. China has achieved completely indigenous 28nm volume production.
  • The SSA800 is expected to be used in 14nm production through multipatterning next year.
  • A follow-on DUVL machine (name unknown) using a more powerful light source and improved workbench for single exposure production of 22nm and multipatterning of 7nm (perhaps 5nm?) is expected Soon™. Expected to be comparable to ASML NXT:2050i.
EUV:
  • There were some rumours of a 150W DPP EUVL tool supposed to be released around now. Obviously, no such thing has materialized, which means it's A) very secretive or B) as I suspect, DPP is not a viable path to commercial EUV.
  • Everything about LPP EUV is a black box (at least in comparison to DUV). No word on the status of the CO2 laser, the optics, etc. All we "know" is that a machine should be ready around 2025.
  • SSMB is a very interesting dark horse, but I don't think it's in the running for China's first generation EUVL. If it lives up to its promise, it would be a vast improvement over LPP EUVL and China would gain enormous advantages from getting to it first.
I'd welcome the inputs, thoughts, and critiques of knowledgeable members like @WTAN, @tokenanalyst, and @FairAndUnbiased.
I know that Chinese fabs are testing and verifying SMEE scanners, is all a black box, but It could be that the first batch of immersion scanners are going to Huawei to the new fabs that they want to make, in their website they say they are going to make 28nm chips and looks like they don't have a high volume output at the beginning.

All the EUV the patent and research paper information suggest that they are going either with LPP and/or SSMB as the light source, one interesting paper and a patent from CAS suggest trying to shorten the wavelength to 6.7nm using a new target material which could increase the resolution but require more power input. In term of high power lasers the Chinese laser industry is growing pretty fast. Research information says the CAS is working with a least two players to develop the high power lasers for EUV application.

1666825396421.png
 

ZeEa5KPul

Colonel
Registered Member
I know that Chinese fabs are testing and verifying SMEE scanners, is all a black box, but It could be that the first batch of immersion scanners are going to Huawei to the new fabs that they want to make, in their website they say they are going to make 28nm chips and looks like they don't have a high volume output at the beginning.
That's been the case since 2021 (I believe the machines were delivered early 2021 or late 2020). If they still haven't ramped up production, that could indicate problems.
Research information says the CAS is working with a least two players to develop the high power lasers for EUV application.
Could you post the source for this?
In term of high power lasers the Chinese laser industry is growing pretty fast.
The charts you posted show encouraging progress, however, those are fibre lasers, not the CO2 MOPA laser used in LPP.
 

tokenanalyst

Brigadier
Registered Member
Could you post the source for this?
According to this paper:

Please, Log in or Register to view URLs content!
In order to improve the ability to independently develop high-performance chips, my country has started EUVL research. The project "7000 W axial fast flow CO 2 laser" jointly undertaken by Wuhan Optics Valley Keweijing and Huake has successfully passed the acceptance and reached the international advanced level, forming a series of 1 kW–10 kW fast axial flow CO 2 laser products. It will be developed in the direction of high-power and high-purity radially polarized fast axial-flow CO 2 lasers [
Please, Log in or Register to view URLs content!
] . Huazhong University of Science and Technology has successfully developed a series of cross-flow CO 2 lasers with powers of 2 kW, 5 kW and 10 kW, and successfully commercialized more than 100 sets of high-power cross-flow CO 2 laser processing systems [
Please, Log in or Register to view URLs content!
] . Pan Qikun et al. [
Please, Log in or Register to view URLs content!
] proposed a laser power stabilization method and laser power amplification system, which effectively improved the stability of the output narrow pulse width laser power and pulse energy after CO 2 laser amplification. After that, the team proposed a dual-wavelength laser coaxial output system, which solved the problem that tunable CO 2 lasers could not output dual wavelengths at the same time, and improved the use of dual-wavelength CO 2 lasers in EUV lithography light sources in the MOPA system . power extraction efficiency and consistency of dual-wavelength CO laser beam quality, polarization degree, and transmission direction in [
Please, Log in or Register to view URLs content!
Please, Log in or Register to view URLs content!
] . Shanghai Institute of Optics and Mechanics proposed a molten droplet generation device for EUV light sources, and then proposed an integrated tin raw material canning system for droplet targets in EUV light sources, which can obtain more uniform melting tin, and its high degree of integration, safe and convenient operation, suitable for the canning of EUV light source tin raw
Please, Log in or Register to view URLs content!
[
Please, Log in or Register to view URLs content!
] . Yin Peiqi et al. [
Please, Log in or Register to view URLs content!
] conducted extensive research on the characteristics of plasma generated by laser pulse irradiation of droplets, and carried out experimental research on Nd:YAG laser-induced droplet plasma by using direct imaging method and shadow method, and analyzed the droplet plasma. The expansion characteristics of the body plume and the movement of the droplets under the laser action. Sun Qin et al. [
Please, Log in or Register to view URLs content!
] carried out research on the diagnosis method of tin plasma characteristics irradiated by pulsed laser, and used Langmuir probe to obtain the time evolution of electron temperature and electron density of tin plasma generated by irradiation with different laser energies. Qi Lehua et al. [
Please, Log in or Register to view URLs content!
] conducted research on the uniform generation and shape change of droplets. Through numerical simulation and experimental research on the uniform droplet spraying process, it was found that the droplet jet velocity mainly depends on the spray pressure, and the droplet flow uniformity mainly depends on the spray pressure. Depending on the disturbance frequency and disturbance amplitude, the pressure field of the jet changes periodically. Xiao Yuan et al. [
Please, Log in or Register to view URLs content!
] used a self-developed metal droplet generation system to analyze the influence of impurities attached to the nozzle wall of the droplet generator on the ejection stability and the effect of process parameters on the uniformity of the droplet. The development has certain reference value. Wang Zhanshan et al [
Please, Log in or Register to view URLs content!
]A Mo/Si multilayer spherical mirror suitable for 13.5 nm extreme ultraviolet light was developed. The diameter of the spherical mirror is 125 mm and the radius of the curved surface is 143 mm. The uniformity of the multilayer film thickness of the spherical mirror is below 0.8%. The diameter of the circular mirror is 300 mm. The Shanghai Institute of Optics and Mechanics successfully produced a 13.5 nm EUV mirror in 2011, with a test reflectivity of 67.8%, close to the theoretical maximum value of 73.7% [
Please, Log in or Register to view URLs content!
] . Wang Xun et al. [
Please, Log in or Register to view URLs content!
] used the reactive magnetron sputtering process, combined with the "hysteresis loop" relationship composed of sputtering voltage and oxygen flow rate, to prepare a metal oxide protective layer with excellent purity, roughness, density and uniformity. . Sun Shizhuang et al. [
Please, Log in or Register to view URLs content!
] used molecular dynamics model to simulate the probability of reflection and re-sputtering during the deposition of Mo/Si atoms, and prepared multilayer film samples on substrates with different tilt angles through magnetron sputtering experiments to verify the simulation. Simulation results of the model. Sun Shizhuang et al. [
Please, Log in or Register to view URLs content!
] obtained the relationship between air pressure and target-substrate distance and film surface roughness.
Today, we are in the process of upgrading and transforming DUV to EUV lithography. Through the continuous efforts of domestic researchers, active learning and reference of foreign advanced technologies, coupled with the support of strong comprehensive national strength, my country's lithography technology and semiconductor industry will definitely enter the fast lane of development. And gradually shorten the gap with the international advanced level.


This company is developing CO2 lasers that could be used in Laser Produced Plasma application for EUVL, basically making it the second commercial company in China involved in the EUVL project. Also there are a lot of other achievements in this paper.

Please, Log in or Register to view URLs content!

The charts you posted show encouraging progress, however, those are fibre lasers, not the CO2 MOPA laser used in LPP.
There are companies that develop MOPA lasers in China, like Raycus, so working with those to develop a high power system is maybe path. There could be other pathways, just because someone did it in some way that doesn't mean is the only way.
 

ansy1968

Brigadier
Registered Member
There it is folks, TSMC will not allowed themselves to be harvested, they're anxiously waiting for Xi to fulfilled his promise of peaceful co existence (huge Chinese market) and to liberate them from American yoke by means of a Chinese EUVL. ;)

TSMC says efforts to rebuild US semiconductor industry are doomed to fail​

Please, Log in or Register to view URLs content!
| Oct 24, 2022
TSMC
Please, Log in or Register to view URLs content!



Apple supplier TSMC believes that US efforts to rebuild chip manufacturing at home are doomed to fail, as it finds itself caught between China and the United States in a tech cold war.

Morris Chang founded TSMC in 1987 when Taiwan recruited him from the US to help build an electronics industry. The contract manufacturer rose to become the top chipmaker in the world, commanding 20% of global wafer fabrication and 92% of advanced chip capacity.
US share in global chip manufacturing shrunk from 37% in 1990 to 12% in 2020, but the country wants to regain its dominance. In particular, US Department of Defense is worried that the country's dependence on Taiwan could put chip supplies for the defense industry at risk.
In response, President Biden signed the
Please, Log in or Register to view URLs content!
into law on August 9, 2022. It provides over $52 billion to help US companies build new semiconductor facilities, fund research, and expand existing manufacturing.


Taiwan isn't happy about the move because it sees its semiconductor dominance as a "silicon shield." The government believes that if China were to attack the country, the US would come to its aid to prevent China from seizing the industry.


Please, Log in or Register to view URLs content!

Market share for countries in semiconductor manufacturing
When US House Speaker Nancy Pelosi visited Taiwan in August, she met with Morris Chang and Mark Liu, chair of TSMC. Chang told Pelosi that Washington's efforts to rebuild its chip manufacturing were doomed to fail,
Please, Log in or Register to view URLs content!
Financial Times.
But the United States may not have much choice. Analysts at investment bank Credit Suisse have estimated that if the world loses access to Taiwan's chip plants, it will disrupt the production for everything from computers to cars.
Apple would be impacted too, as it relies heavily on TSMC for chip production. While it has expanded some of its manufacturing to other countries such as
Please, Log in or Register to view URLs content!
and
Please, Log in or Register to view URLs content!
, those moves do not diversify Apple's chip supply at all.
Still, TSMC remains a major supplier for Apple and other companies, and its future between the US and China is uncertain.
"The monopoly in semiconductor production creates instability," said Brad Martin, director of the National Security Supply Chain Institute at the Rand Corporation. "If the US is faced with a need to make a decision between protecting its economy and defending Taiwan, that starts to become a very stark decision."
TSMC has made some efforts to help the US by planning a semiconductor facility
Please, Log in or Register to view URLs content!
, the first such chip facility it will develop outside of its home country. TSMC expects it will reach its production start in early 2024.
 
Last edited:
Status
Not open for further replies.
Top