Chinese semiconductor industry

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tokenanalyst

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TSMC president encourages furloughs, semiconductor recession storm spreads to working class​

Wei Zhejia, president of the foundry leader TSMC, recently sent an internal email in which he thanked employees for their hard work in the past three years, and rarely "encouraged employees to take more vacations", excluding those related to 3nm and below processes. Wei Zhejia's remarks set the tone for the semiconductor boom, and the recession storm has spread to the working class...

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tphuang

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A sign that China's IC sector continues to boom. They are now generating a decent size trade surplus in this sector. The number of chips imported also declined 12.6% (value did go up, suggesting higher end chip imported and inflation) in the first 3 quarters.

I'm expecting this trade surplus to grow with the recent sanctions.
 

henrik

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A sign that China's IC sector continues to boom. They are now generating a decent size trade surplus in this sector. The number of chips imported also declined 12.6% (value did go up, suggesting higher end chip imported and inflation) in the first 3 quarters.

I'm expecting this trade surplus to grow with the recent sanctions.
As some iPhones and iPads production have been moved to other countries, fewer chips are needed to be imported from Taiwan for assembly.
 

hvpc

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So with SMIC N+3 5nm chip coming in to play in late 2023, we will be a generation behind the leaders and ahead of the American Company by 2 generation (Intel 14nm). Now we know the reason for their hysteria, They thought Xi don't have the Chinaman's chance to succeed....lol

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2 hours ago — Both TSMC and Samsung Electronics are seeing their production scale for 3nm chips constrained due to difficulty in having good control of ...
Bro,
Facts you cited are not correct:
- N+3 is similar to tsmc N6 (on paper). But in reality, N+3 built with DUV will be inferior in terms of overall yield/quality than N6 built with EUV.
- Intel's 'N' (HVM) node as of Oct 2022 is Intel4. Intel4 output volume is now bigger than SMIC N+1
- Intel4 will reach output volume > the entire SN1 wafer output by late 2024.
- Intel4 has higher transistor density than tsmc N4.

So, your claim that 'N+3 is N5' & that 'SMIC will be ahead of Intel by 2 generations' are incorrect.
 

tokenanalyst

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Fast aerial image model for EUV lithography using the adjoint fully convolutional network​

Jiaxin Lin, Lisong Dong, Taian Fan, Xu Ma, and Yayi Wei

The effects of thick-mask and oblique incidence in extreme ultraviolet (EUV) lithography system make the aerial image calculation a challenging task. This paper develops a fast EUV lithography aerial image model based on a new kind of deep learning framework called adjoint fully convolutional network (AFCN). The AFCN consists of two adjoint data paths to respectively recover the real part and imaginary part of the complex mask diffraction-near-field (DNF). The feature-swapping technique is introduced to exchange the information between the real and imaginary data paths. The AFCN is trained based on a pre-calculated rigorous thick-mask DNF dataset. Given the estimated thick-mask DNF, the Abbe’s method is used to calculate the aerial image of the partially coherent lithography system. Compared to the traditional non-parametric kernel regression method, the proposed model reduces the error by more than 80% and achieves 25-fold improvement in computational efficiency.

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tphuang

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After the recent Silan Micro announcement of 144k 6-inch SiC wafers a year, now Basic Semi has also announced project to produce 6k 6-inch SiC wafers per month or 72k a year.

From a month ago,
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basic semi completed C4 round funding. It has established an automotive grade SiC Power chip production line in Wuxi. It is expected to reach 4 million modules per year by 2025.
 

xypher

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- Intel's 'N' (HVM) node as of Oct 2022 is Intel4. Intel4 output volume is now bigger than SMIC N+1
Source? And what is the volume of N+1?
- Intel4 has higher transistor density than tsmc N4.
This is the case with Intel 7 (10 nm per previous marking) and TSMC N7/N7P, however Intel chips that were made using this tech were worse than the AMD's Ryzen 3xxx that used TSMC 7FF (N7/N7P) in the overall performance, power consumption, and TDP. So density alone does not say much.
 

tphuang

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Cambrian has landed a 500 million RMB contract to build the AI data center for Nanjing smart computing data center. This includes the CPU, AI GPUs and the AI software.
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Looks like they are still losing money
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264 million RMB in revenue so far this year and 963 million in expenses.

Well, I guess that with Nvidia unable to supply chips, this is a good opportunity for Cambrian to secure some contracts. Seems like they are not having an issues with getting their chips produced at least.

Phytium signing contract with 成都芯谷 for supplying products
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