3 years old information.
what about 2022 ?
3 years old information.
Doubt it, Chinese fabs has always had a strong preference for ASML products probably due the strong Taiwanese influence in their semi industry. So if they are going to stockpile is going to be from ASML.So does anyone know why China hasn't also been stockpiling Canon/Nikon DUVs? Those should have no American content in them whatsoever.
Perhaps, but still these FDPR are annoying and moving to fabs that are a mix of Chinese/Japanese equipment seems to be a possible way forward.Doubt it, Chinese fabs has always had a strong preference for ASML products probably due the strong Taiwanese influence in their semi industry. So if they are going to stockpile is going to be from ASML.
Probably even higher now.3 years old information.
what about 2022 ?
Agree, that is the way to goPerhaps, but still these FDPR are annoying and moving to fabs that are a mix of Chinese/Japanese equipment seems to be a possible way forward.
People no longer focus on EUV infrastructure readiness. 3nm risk production has been in progress for almost 3Q now, we are on the verge of 3nm HVM. Infrastructure for 3nm is set.Probably even higher now.
Well, At least looks like TEL is getting.People no longer focus on EUV infrastructure readiness. 3nm risk production has been in progress for almost 3Q now, we are on the verge of 3nm HVM. Infrastructure for 3nm is set.
What you should be asking for is the HiNA EUV infrastructure readiness table.