All of these 28nm+packaging = 14nm or 14nm+packaging=7nm is none sense. It doesn't work that way.Has anyone got a update on China's domestic DUV machines fore 28nm chips. I understand that it will be at least till 2025 before it comes out. You can have 28nm chips with packaging you can get 14nm. China is already good with packaging machines. Or I'm I wrong in my understanding of the situation.
At 14nm, the unit cell is smaller (so you can pack more transistor in a given area, or higher transistor density) all the while having better performance and power consumption than 28nm. So even packaging by stacking multiple 28nm chips to obtain the same total number of transistor in a given planar area (or claim of reaching same transistor density), it still won't reach the same performance or power consumption of a 14nm monolithic chip. And we are just talking about BEOL, I've not even start to talk about the benefit of smaller features of 14nm in the FEOL portion of the chip
Same logic would apply to claim of 14nm+packaging = 7nm monolithic chip.
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