Chinese semiconductor industry

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european_guy

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Piotech's PECVD can be used for 128 layer 3D NAND flash. According to IPO document last year, 192 layer is in research and development.

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NF-300H TEOS 设备由拓荆科技承担了国家十三五重大专项,自主研发,拥有自主知识产权。应用于128层及以上3D NAND闪存芯片的生产。可实现SiO2、SiN(ONON)多层薄膜堆叠结构和Thick TEOS 薄膜,在均匀性、颗粒度、粗糙度、应力及产能等方面实现技术突破,设备性能指标达同类产品水平。

Thanks for the info!

This equipment is for deposition, for etching I guess is AMEC.
 

european_guy

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@KYli bro ASML escape the gauntlet and good for them after all they fought hard to maintain their business relationship with China. The real victim here is TSMC cause Samsung had the support of their gov't while Tsai sell the family jewel which isn't her to begin with to the Americans. So what will the future be of TSMC, I ask all members of their opinions, I for one think their zenith is this year, after that with the economic downturn let's see, my prediction in the short term (2026) we may see SMIC at 3rd (3nm a generation) behind the 2 leaders (Samsung and TSMC 2nm and a big uncertainty) by 2028 the three will have parity and 2030 onward maybe first place.

Long term TSMC or becomes American (maybe Intel buys a share of it like Western Digital in Kioxa) and Taiwan becomes like Japan, a US satellite province, or TSMC becomes Chinese through Taiwan reunification although at the moment the first scenario is more likely. For instance see Pelosi's trip: US always doubles down when someone asks them not to do something. For their hegemonic mentality they want to be the only one that can tell others what not to do, but nobody can tell them.

I agree TSMC is at his best now, in the future they will certainly lose the dominant position due to both US and Chinese companies that are investing big now just for this target: TSMC will first lose to Intel, then (in the long term, say 10-15 years from now) to SMIC. Without banning on EUV it would have been even sooner.
 

PopularScience

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CNC for lithography machine's lens

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产品名称:光刻机投影物镜零件超精密磨床ULTRA 700VG CNC

应用领域:光刻机、集成电路、光学等领域超精密关键元器件表面超精密纳米磨削。

技术亮点:(1)Z轴自研制的全封闭液体静压导轨,具有优异的运动精度,极好的减震性能,“零摩擦”无爬行,重复定位精度可达±0.1μm;(2)液体静压回转工作台轴向跳动(直径500mm处测量)0.2μm;(3)Z轴进给可执行单脉冲位移量0.1μm;(4)X轴直线度≤0.1μm/100mm,≤0.3μm/350mm;(5)Z轴直线度≤0.1μm/100mm,≤0.2μm/250mm;(6)X轴与工作台平行度≤0.2μm/350mm;(7)Z轴与工作台平行度≤0.2μm/250mm。
 

hvpc

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Long term TSMC or becomes American (maybe Intel buys a share of it like Western Digital in Kioxa) and Taiwan becomes like Japan, a US satellite province, or TSMC becomes Chinese through Taiwan reunification although at the moment the first scenario is more likely. For instance see Pelosi's trip: US always doubles down when someone asks them not to do something. For their hegemonic mentality they want to be the only one that can tell others what not to do, but nobody can tell them.

I agree TSMC is at his best now, in the future they will certainly lose the dominant position due to both US and Chinese companies that are investing big now just for this target: TSMC will first lose to Intel, then (in the long term, say 10-15 years from now) to SMIC. Without banning on EUV it would have been even sooner.
What metric is used to compare who wins/loses? Overall revenue? Revenue from foundry business? Technical capability? Or just plain wafer capacity? Or profit margin?

I think the technical capability + capacity indices gap between tsmc and competition will actually grow bigger in the next few years. tsmc’s expansion plan in the most advanced nodes is higher than its closest competition. tsmc has not peaked yet.
 

tokenanalyst

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CNC for lithography machine's lens

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产品名称:光刻机投影物镜零件超精密磨床ULTRA 700VG CNC

应用领域:光刻机、集成电路、光学等领域超精密关键元器件表面超精密纳米磨削。

技术亮点:(1)Z轴自研制的全封闭液体静压导轨,具有优异的运动精度,极好的减震性能,“零摩擦”无爬行,重复定位精度可达±0.1μm;(2)液体静压回转工作台轴向跳动(直径500mm处测量)0.2μm;(3)Z轴进给可执行单脉冲位移量0.1μm;(4)X轴直线度≤0.1μm/100mm,≤0.3μm/350mm;(5)Z轴直线度≤0.1μm/100mm,≤0.2μm/250mm;(6)X轴与工作台平行度≤0.2μm/350mm;(7)Z轴与工作台平行度≤0.2μm/250mm。
Interesting.

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Looks like They finish the lenses with Ion beam figuring and coating
 

tokenanalyst

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I think they confused Taiwan with the US. Because the irony is outstanding. LOL.

China Micro's 5nm etching machine plans to ship TSMC's US factory in the second half of the year​


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Jiwei.com, according to Shangguan News, the etching machine manufactured by China Micro Semiconductor Equipment (Shanghai) Co., Ltd. will be shipped to TSMC's US factory in the second half of this year for 5nm process chip production.

The report shows that Zhongwei Company, located in the Jinqiao Comprehensive Bonded Zone, insisted on closed-loop production during the current round of Shanghai epidemic, and the company's operations continued to make new breakthroughs. In the closed-loop production, the company's raw material import needs were also greatly assisted by Pudong Customs, and the customs guided Zhongwei. The company handles online declarations through channels such as "single window", "Internet + customs", and releases the goods immediately after the appearance inspection at the port, and the goods are unpacked and inspected in the enterprise's clean room. The customs clearance has changed from the previous two weeks to two or three days.

The report also revealed that Anji Microelectronics Technology (Shanghai) Co., Ltd., which is also located in the Comprehensive Bonded Zone, also received strong help from Pudong Customs, making Anji Technology the first “bonded R&D” pilot in each comprehensive bonded zone in Shanghai. The cost of the company is greatly saved, which in turn feeds back research and development, and the progress of the company's chemical mechanical polishing liquid 7-10 nanometer research and development project has been greatly accelerated

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