As long they stay on topic its does matter what they talk about.
Chinese semiconductor industry
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Big packaging for high performance computing chips.
Shenghejing Microsemiconductor realizes mass production of large-size chip wafer-level full RDL substrateless packaging
Shenghejing Micro Semiconductor (Jiangyin) Co., Ltd. (hereinafter referred to as "Shenghejing Micro"), a leading advanced packaging and testing enterprise located in Jiangyin National High-tech Industrial Development Zone, Jiangsu Province, takes advantage of multi-layer fine line width RDL rewiring processing technology. , cooperated with Haowei Technology Co., Ltd. to realize the mass production of large-scale full RDL trace packaging structure of near-memory computing chips, marking the first successful implementation of wafer-level fan-out packaging instead of traditional substrate packaging in China, providing large-scale The dual choice of computing chip packaging structure also expands the supply chain capacity assurance capabilities of high-efficiency computing chip customers.
Cuckoo 2 Chip
The chip size of the packaged Cuckoo 2 reaches 800mm² , and the finished product size reaches 1600mm² . It adopts the 4-layer RDL rewiring process of Shenghejing Micro. Compared with traditional packaging, advanced packaging has the functional advantages of increasing the functional density of chips, shortening the interconnection length and performing system reconstruction. The new breakthrough in the platform's practice in the industrial field will help to further expand the application of advanced packaging in emerging markets such as artificial intelligence, blockchain, 3D space computing and 8K high-definition, and further satisfy the computing blowout in the coming metaverse era. need.
Starting with advanced 12-inch high-density bumping and rewiring processing, it is committed to providing world-class mid-section silicon wafer manufacturing and testing services, and continues to develop advanced 3D packaging (3D Packaging) processing business. Intellectual property's SmartPoser™ multi-chip integrated processing platform is making substantial progress in a growing number of industries.
At a high level a few years ago YMTC had the following foreign dependencies lithography, ion implantation, etching, and chemical and physical vapour deposition and chemical-mechanical planarisation. We know that (quoting external source)
“Naura Technology Group represents China’s hope to later challenge Applied Materials, which is based in Santa Clara, California, and makes a wide range of chip production equipment. Shanghai’s Advanced Micro-Fabrication Equipment (AMEC) is China’s version of Lam Research of the US, renowned for building essential etching machines. Tianjin-based Hwatsing Technology produces cutting-edge chemical-mechanical planarisation equipment and is set to break Applied Materials’ monopoly on the technology”. Guess it’s a question of much progress those three have made….
but these same people were all wrong frequently. the coming crash was china was supposed to happen 20 years ago.
what we see is that every major components of EUV are being developed and made progress.
Lam Research would be more like a combination between, ACMR shanghai, AMEC, Naura, Piotech.
I had been looking for ALE etching equipment in China for a while and looks like Naura has develop some equipment for that, dating back 2019. I guess R&D from AMEC in this area is probably no far behind.
NAURA successfully developed atomic layer etching equipment, adding a new talent to high-end equipment
Release time: 2019-03-20
Recently, the Atomic Layer Etching (ALE) equipment independently developed by NAURA has successfully entered the production line of well-known customers in the industry, adding a new talent to domestic equipment in the fields of advanced manufacturing and high-end equipment.
Traditional plasma etching equipment will face a series of challenges such as etching damage, loading effect and control accuracy after entering the technology generation below 14nm and other etching fields with low damage requirements. The effective solution is atomic layer etching. technology. The atomic layer etching based on the cycle mode is different from the conventional plasma etching in principle. A typical layer-by-layer etching method is shown in the figure below. First, the combined gas is introduced into the etching chamber and adsorbed on the surface of the material to form a combined layer. This modification step is self-stopping, that is, the reaction stops as soon as the surface is saturated. Next, the excess bonding gas in the etching chamber is removed, and the etching gas is introduced. After the etching gas forms a plasma, the surface of the material is bombarded with ions to physically remove the previously generated bonding layer, thereby leaving the underlying unmodified surface. This removal process is still self-stopping because once the bond layer is completely removed, the process will also terminate and will not continue to remove the underlying material. After the above steps are completed, a layer of material on the surface can be precisely removed. The above process is repeated continuously, and the etching depth, etching rate, etc. can be precisely controlled by controlling the number of cycles.
Principle of Atomic Layer Etching The atomic layer etching equipment developed by North Huachuang Microelectronics integrates key technologies such as precise control of plasma energy, ultra-fast gas switching, and synchronous control of radio frequency and gas. Through the repetition of surface modification and surface removal, the effect of layer-by-layer etching is achieved, and an etching process with precise controllability, good uniformity, small surface roughness, low damage and no load effect is realized. The equipment has successfully achieved client process validation.
Atomic layer etching technology is a representative of high-end technology in the field of integrated circuits and chip manufacturing. It can be widely used in the manufacture of integrated circuits, silicon-based semiconductor devices, III-V compound devices, graphene and other two-dimensional material devices.
NAURA will take this as an opportunity, based on customer needs, continue to innovate, boost industrial technological progress, and bring infinite possibilities to the industry.
NAURA successfully developed atomic layer etching equipment, adding a new talent to high-end equipment
Release time: 2019-03-20
Recently, the Atomic Layer Etching (ALE) equipment independently developed by NAURA has successfully entered the production line of well-known customers in the industry, adding a new talent to domestic equipment in the fields of advanced manufacturing and high-end equipment.
Traditional plasma etching equipment will face a series of challenges such as etching damage, loading effect and control accuracy after entering the technology generation below 14nm and other etching fields with low damage requirements. The effective solution is atomic layer etching. technology. The atomic layer etching based on the cycle mode is different from the conventional plasma etching in principle. A typical layer-by-layer etching method is shown in the figure below. First, the combined gas is introduced into the etching chamber and adsorbed on the surface of the material to form a combined layer. This modification step is self-stopping, that is, the reaction stops as soon as the surface is saturated. Next, the excess bonding gas in the etching chamber is removed, and the etching gas is introduced. After the etching gas forms a plasma, the surface of the material is bombarded with ions to physically remove the previously generated bonding layer, thereby leaving the underlying unmodified surface. This removal process is still self-stopping because once the bond layer is completely removed, the process will also terminate and will not continue to remove the underlying material. After the above steps are completed, a layer of material on the surface can be precisely removed. The above process is repeated continuously, and the etching depth, etching rate, etc. can be precisely controlled by controlling the number of cycles.
Principle of Atomic Layer Etching
Atomic layer etching technology is a representative of high-end technology in the field of integrated circuits and chip manufacturing. It can be widely used in the manufacture of integrated circuits, silicon-based semiconductor devices, III-V compound devices, graphene and other two-dimensional material devices.
NAURA will take this as an opportunity, based on customer needs, continue to innovate, boost industrial technological progress, and bring infinite possibilities to the industry.
This whole topic is sitting in one big information vacuum. We don't have an end-to-end layout of the IC process and what the current-day domestic capabilities are at each step. On the military side at least there's announcements of here's xyz with these metrics - here it's so piecemeal with suppliers announcing products here and there. At some point SMIC, YMTC are going to have to say something to customers indicating what they can or can't do.
Yup, perfect timing with the CHIP ACT, we're save...lol The moral lesson, Intel is too big to fail....lol
On a side note, maybe they have the reason to halt their FAB expansion in the US, IF the US gov't insist, the numbers don't match up and may demand the whole subsidies instead of sharing with others.
INTEL SEES PC VENDORS REDUCING INVENTORY, SLASHES PC MARKET OUTLOOK
JULY 29, 2022, 01:06 PM EDT
“Our Q2 PC unit volumes suggest we are shipping below consumption as some of our largest customers are reducing inventory levels at a rate not seen in the last decade,” said Intel CEO Pat Gelsinger.
Citing a “sudden and rapid decline in economic activity,” Thursday told analysts that the chip giant is seeing its PC vendor partners reduce inventory levels at a rate not seen in the last decade and as a result is lowering its PC market outlook.
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“Our Q2 PC unit volumes suggest we are shipping below consumption as some of our largest customers are reducing inventory levels at a rate not seen in the last decade,” Gelsinger told analysts after Intel’s Client Computing Group reported a 25 percent decline in sales to $7.7 billion for its second fiscal quarter ended July 2 compared with $10.3 billion in the year ago quarter.
Intel now expects PC TAM (Total Addressable Market) to “decline roughly 10 percent in calendar year 2022 characterized by broadening consumer weakness and relative strength in enterprise and higher end SKUs,” said Gelsinger.
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Intel Chief Financial Officer David Zinsner, for his part, cited a “softening” PC macroeconomic environment and “inflationary pressures.”
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Zinsner said Intel expects to take restructuring charges in the current quarter. Furthermore, he expects “macroeconomic conditions to continue to soften with the potential for a recessionary scenario to materialize.”
Intel is also seeing “economic headwinds” impacting the data center business and as a result is now lowering server (TAM) to reflect “more modest” growth,” said Gelsinger. “Increasing economic concerns are leading to a reduction in second half demand,” he said.
The server market adjustment came after Intel reported a 16 percent decline in sales for its data center and AI group to $4.6 billion compared with $5.5 billion in the year ago quarter.
Intel expects to grow “slower than the overall data center market,” said Gelsinger. “It’s not a fact we like but the forecast we see,” he said. “We have a singular focus to regain performance and TCO .(total cost of ownership) leadership across all workloads and use cases from enterprise to cloud.”
Overall, Intel reported a $454 million loss for the quarter on a 22 percent decline in sales to $15.3 billion. In the year ago quarter, Intel reported earnings of $5.0 billion on sales of $19.6 billion. Intel shares were down 10 percent on Friday to $35.53 in the wake of the disappointing results.
“This quarter’s results were below the standards we have set for the company and our shareholders,” said Gelsinger in a prepared statement. “We must and will do better. The sudden and rapid decline in economic activity was the largest driver, but the shortfall also reflects our own execution issues.”
As it looks to the second half, Intel is “planning for volatility as the world adjusts to the end of a two plus year pandemic and the unprecedented stimulus governments used to fight it,” said Gelsinger.
Mike Turicchi, vice president at Gainesville,Va.-based NCS technologies, said he fears the tech industry is only at the start of a downturn.
“I fear this trend will continue and will most certainly have a negative impact on the industry, causing customers to reconsider purchases,” he told CRN. “We are hearing rumblings about upcoming price increases from many of our technology partners.”
Gelsinger also pointed to the continued supply chain challenges that have hampered Intel. “Across the economy, supply chain issues have both limited the ability to meet demand in some areas and driven inventory well above normal levels in others,” he said.
Bob Venero, CEO of Fort Lauderdale, Fla.-based Microsoft partner Future Tech Enterprise, No. 95 on the CRN 2022 SP500, said customers are waiting up to four months for PC and laptop shipments because of supply chain challenges and constraints.
“The commercial PC market is booming,” he said. “The growth is there. We are seeing tremendous increases in the PC and laptop requirements from our customers. What is impacting the fulfillment of those needs is lack of supply. We need Intel and the component manufacturers to boost up demand and come up with alternative solutions so we can start shipping based on the current demand that we have.”
The problem is customers are “kicking the PC and laptop demand down the road because we can not fulfill in a timely manner,” said Venero. “That is forcing us to forecast further out. We are forecasting and ordering six months in advance for our customers at this point.”
Ron Martin, senior business development manager at IT distribution behemoth TD Synnex, said while the chip shortage has been an issue for some specific components, the Clearwater, Florida, and Fremont, California-headquartered company is still able to deliver a lot of products.
“There might be a little bit longer lead time,” he told CRN. “But it‘s but it’s not getting completely deferred. I‘ll have something that was not available for six months, but then, boom, all of a sudden, it’s available.”
The very largest IT users tie up a lot of the parts and components, and Intel, as well as others are, he said, are working to get what they need. “If a project gets canceled, it frees up to 100,000 of this or 10,000 of that,” he said.
Gelsinger, for his part, said Intel is prepared to manage through the volatile market conditions. “We are prepared to manage through a slowdown typical of the normal cycles the semiconductor industry has experienced over the last 50 years,” he said.
As a result of the “high level of uncertainty” going forward, Zinsner said the company has lowered its full year sales and earnings estimates and is moving to a “range based approach to revenue guidance” for the rest of the year. “There’s also a risk for continued COVID related impacts on demand and the supply chain to continue throughout the year,” said Zinsner.
Intel now expects full year adjusted earnings of $2.30 per share on revenue of $65 to $68 billion. That compares with a forecast from three months ago of $3.60 in earnings and $76 billion in sales.
Intel is also planning on lowering “core expenses” in 2022 and is continuing a slowdown in hiring. Last month, in an internal memo sent to employees, Intel said it is “pausing all hiring and placing all job requisitions on hold” in the personal computer chip division.
All that said, Gelsinger said he does not see “expense discipline” impacting the company’s strategy to “process performance parity” with competitors in 2024 and “unquestioned leadership in 2025. “This goal is our true North star,”
Especially China is now swapping out intel/amd systems and replacing with their own fully indigenous computer systems.
What is it you don't know where what came from in my article?
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