Chinese semiconductor industry

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Pkp88

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Semiconductor China sanctions keep adding up 1) 14nm limit 2) Memory/Logic restricted at 128 layers 3) Restricting export of GAA EDA software to Chinese firms (needed for AI leading edge). Effectively the United States is pursuing restrictive policy on all seminconductor efforts in China even those for civilian use. Chinese firms are effectively on an entity list when it comes to chip design entirely.

Unless China finds work arounds they're effectively stuck at semiconductors from 5-10 years ago.

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tokenanalyst

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BGI Jiutian: Circuit simulation tools, layout integration and other technologies have reached the international leading level​


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Huada Jiutian stated on the investor interaction platform on August 2, "Huada Jiutian is the largest EDA enterprise with the most complete product line and the strongest comprehensive technical strength in China. The company combines its own technology accumulation and continuous technology development, research and development and It has mastered a number of core technologies, and has formed an industry-leading technical advantage in the field of EDA tool software and related services. Some products and technologies have reached the international leading level. EDA tools are necessary tools for integrated circuit design, manufacturing, packaging, testing, etc., and are one of the strategic foundational pillars that run through the entire integrated circuit industry chain. With rapid development, the design scale, complexity, and technological advancement have been continuously improved, and the role of EDA tools has become more prominent, which has become a key factor in improving design efficiency and accelerating industrial technological progress and innovation."

It is understood that BGI Jiutian was established in 2009 and has been focusing on the research and development of EDA tools since its establishment. Combining its own technology accumulation and continuous technology development, the company has developed and mastered a number of core technologies, forming an industry-leading technological advantage in the field of EDA. Focusing on the continuous upgrading of EDA technology in the integrated circuit industry and the continuous expansion of the application field, the company has achieved many innovative achievements.

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hullopilllw

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light source: Changchun yes but EUV is only 14nm... 3 years ago... there were news about it being resolved.... as for Photoresist it's a problem... 2023 they will solve it
Are you the same olala from twitter ? I suggest you spare this forum from your spamming on mostly baseless misinformation on chinese semiconductor development progress, it is one thing to be supportive china and another to push worthless chest thumping articles.
 

tokenanalyst

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Are you the same olala from twitter ? I suggest you spare this forum from your spamming on mostly baseless misinformation on chinese semiconductor development progress, it is one thing to be supportive china and another to push worthless chest thumping articles.
And reverse, it is one thing to be anti-china and another to push worthless chest thumping articles.
 

tokenanalyst

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Xtacking 3.0 officially debuted YMTC once again broke through the technical barrier​


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At the 2022 Flash Memory Summit, the annual event of storage technology, Yangtze Memory Technologies Co., Ltd. (YMTC) officially released its heavyweight product, the fourth-generation TLC 3D flash memory X3-9070 based on Xtacking® 3.0 (Xtacking® 3.0) technology.

2400MT/s I/O transfer rate, 1Tb capacity in a smaller single chip, 50% increase in performance and 25% reduction in power consumption, the key indicators of X3-9070 have reached the top level in the industry. At the same time, the launch of the third-generation Xtacking technology has also enabled YMTC to have greater initiative in the increasingly fierce competition in storage technology.

Crystal stack technology upgrade


Xtacking technology is the core of the strong competitiveness of YMTC's flash memory series. Since its introduction in 2018, this technology has brought higher density, faster I/O speeds and shorter time-to-market to flash products.

Xtacking technology places peripheral circuits on top of memory cells, allowing chip processing to move from plane to three-dimensional. That is, peripheral circuits are processed on one wafer, memory cells are processed on another wafer, and the two wafers are respectively completed and then bonded through millions of metal VIAs (Vertical Interconnect Accesses, vertical interconnection channels). Compared with traditional 3D NAND flash memory architecture, Xtacking can bring faster I/O transfer speed, higher storage density and shorter time to market.

Xtacking technology has four advantages: first, better performance, second, more advanced technology, third, cost advantages, and fourth, higher flexibility.

In traditional 3D NAND flash memory, the area occupied by peripheral chips is about 30-40%. As the number of stack layers increases to more than 128 layers, the area occupied by peripheral chips will reach more than 50%. The Xtacking structure reduces the area of peripheral chips. A higher density than conventional NAND flash memory is achieved.

At the same time, Xtacking realizes parallel and modular product design and manufacturing, which can shorten the product development time by three months and shorten the production cycle by 20%, thereby greatly shortening the time-to-market of 3D NAND products. In addition, this modular approach also makes it possible to introduce innovative functions of NAND peripheral circuits to realize the customization of NAND flash memory.

X3-9070 adopts the latest Xtacking 3.0 architecture. After years of iterative innovation, the latest Xtacking technology has made the X3-9070 the highest density flash memory particle product in the history of YMTC, achieving a storage capacity of 1Tb with a smaller chip size.

For the performance of Xtacking technology, Gregory Wong, founder and chief analyst of Forward Insights, gave a very high evaluation, believing that the hybrid bonding technology of storage array and peripheral logic circuit is very important to promote the innovative development of 3D NAND technology.

Gregory Wong emphasized: "The X3-9070 is a key industry milestone equipped with the advanced flash memory technology chip stack 3.0 platform. This also indicates that the hybrid bonding technology of memory cells and peripheral logic circuits is expected to become the mainstream of the industry in the future."

After the iterative development of Xtacking from 1.0 to 3.0, YMTC has accumulated rich experience in the field of 3D heterogeneous integration, and has successfully built a number of YMTC storage system solution products based on crystal stack technology, including SATA III, PCIe Gen3, Gen4 Solid-state drives, as well as embedded storage products such as eMMC and UFS for mobile communications and other embedded applications, have won wide acclaim from industry partners.

Realize 200+ layer stack and constantly break the limit

The competition of storage technologies, on the one hand, is the reading speed, and on the other hand, the storage density. When flash memory enters the 3D era, stacking technology is mainly used to achieve larger storage capacity in a smaller space and area. Therefore, the number of stacked layers replaces the process and becomes the new flash memory evaluation standard. As leading companies continue to expand the market layout of 3D NAND flash memory and promote technological innovation and evolution, the stack height of 3D NAND flash memory is constantly breaking the limit.

Although it started late, YMTC dared to innovate in technology. It started from 32-layer stack, and after the accumulation of 64-layer stack, it skipped the 96-layer stack flash memory promoted by Samsung, Micron, Toshiba and other companies, and carried out 128-layer 3D NAND. The research and development of flash memory, and the success of the research and development will be officially announced in 2020.

The 128-layer 3D NAND flash memory produced by YMTC has the highest storage density per unit area, the highest I/O transmission speed and the highest single NAND flash memory chip capacity among known models in the industry. In just three years, YMTC has achieved the leap from 32 to 128 floors.

After the breakthrough, YMTC's research and development speed continued to accelerate. Relevant media have reported that YMTC will skip the original 192-layer technology, directly challenge the higher number of layers, and mass-produce it by the end of 2022. Therefore, the X3-9070 launched this time is full of expectations.

Although the official information on the number of stack layers of the X3-9070 has not been given, the product has reached the international leading technical level based on the characteristics of the product and the information provided by many industry insiders, which also marks another major breakthrough in domestic 3D NAND products. .


Breaking through the 200-layer mark can enable 3D NAND to obtain faster I/O speeds. Therefore, the X3-9070 achieves an I/O transfer rate of up to 2400MT/s, which is 50% more optimized than the previous generation.

Jiweiwang also noticed that the X3-9070 adopts a 6-plane design. You must know that by increasing the number of planes, the concurrency of the flash memory can be greatly improved, and the performance can be greatly improved. Therefore, compared with the traditional 4-plane, the performance of X3-9070 is improved by more than 50%, while the power consumption is reduced by 25%, which can bring more attractive total cost of ownership (TCO) to end users.

The more powerful performance also enables the X3-9070 to meet the needs of many emerging applications. As Chen Yi, Executive Vice President of YMTC said, "X3-9070 flash memory particles are YMTC's ingenious work in the field of 3D flash memory in recent years. It has excellent performance and extremely high storage density, and can be quickly and efficiently applied to mainstream applications. In commercial scenarios, we will face new demands and challenges brought about by the booming 5G, cloud computing, Internet of Things, autonomous driving, artificial intelligence and other new technologies.”

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ansy1968

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This is a nice move as what can TSMC make without sand?
@henrik the next move is neon laser, bro I always argue why bomb and destroy TSMC FABS, why destroy something you own? there are other means to punished them, like the US did to SMIC we can do the same by blocking and throwing a monkey wrench on their manufacturing process, Yes they can find an alternative BUT that will drive them crazy with cost escalation and production disruption. This is a better way to punish your love one or relative rather than killing them...lol

While SMIC with full gov't backing and support even with older process can survive and prosper, Bro SMIC is the future, my good friend and mentor @hvpc may disagree (compare to TSMC) BUT the sign is there, A captive market due to geopolitical tension, a large scientific base to get talents and gov't support plus subsidies.
 
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MortyandRick

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Are you the same olala from twitter ? I suggest you spare this forum from your spamming on mostly baseless misinformation on chinese semiconductor development progress, it is one thing to be supportive china and another to push worthless chest thumping articles.
Many on this forum who have followed him over the years are quite convinced that this person knows what he’s talking about. do you have any examples where he is just wrong?
 
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