Laser creates semiconductor wafer "exclusive ID card"
With the continuous development and progress of technology, the semiconductor industry has higher and higher requirements for the quality of wafers, and the quality control of wafers is more stringent. In order to meet the needs of quality control and process improvement, it is also convenient to manage and track the wafers in the subsequent production, testing and packaging processes to ensure the stable traceability of the wafers, and
can be clearly marked on the surface of the wafer or die character, one-dimensional code or two-dimensional code and other specific identifiers. Usually, the logo contains information such as the wafer manufacturer code, some technical parameters, and the serial number of a single wafer, which is equivalent to the "ID card" of the product.
In order to achieve time traceability, the mark must be able to be read at all times during the process, which places higher requirements on the wafer marking machine.
Laser marking uses a high-energy beam to irradiate the workpiece non-contact. While quickly completing the marking instructions, it can ensure the original accuracy of the workpiece and avoid pressure damage to the workpiece. At the same time, it has environmental protection, no consumables, high precision and high efficiency. Therefore, it is more in line with the high-quality marking requirements of wafers. The processing principle of wafer laser marking is not fundamentally different from common laser marking.
The wafer laser marking machine independently developed by Han’s Semiconductor can meet the requirements of precise laser marking on the wafer , and can mark the wafer surface of different materials. Different types of lasers are used according to the difference of product materials, and are equipped with high-speed scanning vibration. Mirror, Robot dual-arm manipulator, wafer aligner, to achieve the purpose of high speed, high precision, good effect and stable performance. According to the user's product size requirements, Han's Semiconductor can provide corresponding models from 2 inches to 12 inches.
Semiconductor automatic wafer marking machine
0 1Processing capacity1. Wafer materials: Si, SiC, InP, GaSb, GaN, sapphire, Glass, LT and other materials;
2. Compatible with multiple wafer sizes: 2-6 inches, 4-8 inches, 8-12 inches;
3. Marking position: front, back (including permeable membrane), double-sided;
4. Wafer carrier: material box, Loadport (support FOUP, FOSB);
5. Character type (in line with SEMI standard):• Letters ABC etc.• Number 123 etc.• Barcode BC-412 SEMI T1• QR code QRDM (optional)• Characters include dot matrix method (5x9 single line density / 10x18 double line density)
0 2The main parameters
Under the current general trend of accelerated transformation and upgrading of domestic advanced manufacturing industries, Han's Semiconductor has always taken independent innovation as the foundation of sustainable development with its leading technology and quality advantages, continued to maintain a forge ahead trend, dig deep into the market supply, and expand the scope of services. Taking market demand as the starting point, it provides a steady stream of system processing and intelligent workshop solutions for the pan-semiconductor industry, and is committed to enhancing the international competitiveness of my country's equipment manufacturing industry.