Also known as Mattson Technology
Chinese semiconductor industry
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Also known as Mattson Technology
I think would be difficult to manufacture Rad Hardened ICs using current smaller nodes techniques. Even automakers have a lot of difficulty moving on from reliable matures nodes, let alone the military.
But there are some areas that someone may want to trade off some reliability over some performance or a lower price. There were using COTS components may be useful.
From your own source:
Gas dispenser showerhead (table 25): hole layer count is the only difference but the specifications overlap. Other difference is using or not using LPC leach measurements. But this is just a tiny part of the cost of the showerhead and LPC is ez pz to do.
Structural components (table 27): only qualitative difference, they aren't able to elucidate a quantitative difference. All they say is "even lower Ra values" or something. This sounds like promotion of their products rather than a hard standard tbh.
Reactors (table 24): almost no different between 28 nm and 14 nm or even 7 nm. Only requirement is to clean in 100 class rather than 1000 class cleanroom.
So your source doesn't really contradict me.
From my own work, the cleaning requirement are all the same for outsourced clean, they will use the cleanroom they have existing which is typically class 100.
Instead how about you try to find a final machine sold as being only for 28 nm and above?
How do you know that they aren't using this as a timeline of their improvement rather than as hard standards for parts acceptance?
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Hey from your source, if this was indeed 100% hard standards with 0 deviation allowed, it meant that they were using 200 mm wafer in 2016.
This is obviously false. 300 mm wafers were introduced in 2002 which was 130 nm process.
How to reconcile this fact???
I interpret this entire graph as an example of the improvements the company is making relative to itself in the past, not that they have the definitive answer to what makes a 28 nm vs 14 nm vs 7 nm component.
Yup China will inundate us, not with Cheap products BUT with Chip products!...lol with SMEE SSA800 DUVL and its future iteration, we can say China will commoditize the 14nm, 12nm, 10nm and 7nm chip markets, leaving 5nm and 3nm niche chips to the present 3 market leaders.
The global chip market continues to expand, and China, the largest market, is continuing to increase production capacity. It is predicted that China will add 25 12-inch fabs in the next five years. By 2026, the total monthly production capacity of China's 12-inch fabs will exceed 2.763 million wafers, an increase of 165.1% from the current level. In 2021, the global market will experience a painful chip shortage due to multiple factors such as the epidemic, the booming "household economy" and electric vehicles. Many governments have shouted the slogan of chip self-sufficiency and actively promoted the construction and expansion of fabs locally. China, which has been sanctioned by the United States, has accelerated its pace. Under the impact of geopolitical friction and the epidemic, China's semiconductor industry has entered an unprecedented period of rapid development in the past five years, and China's domestic chips have gradually entered the main stage. Not long ago, SEMI announced that China will lead the world in terms of 8-inch production capacity. Obviously, China is building the chip factory for tomorrow. So, how will China plan its domestic semiconductor industry in the next five years? Can it achieve new breakthroughs that will shock the world in five years? What is the biggest difficulty in developing the domestic semiconductor industry in China at present?
The global chip market continues to expand, and China, the largest market, is continuing to increase production capacity. It is predicted that China will add 25 12-inch fabs in the next five years. By 2026, the total monthly production capacity of China's 12-inch fabs will exceed 2.763 million wafers, an increase of 165.1% from the current level. In 2021, the global market will experience a painful chip shortage due to multiple factors such as the epidemic, the booming "household economy" and electric vehicles. Many governments have shouted the slogan of chip self-sufficiency and actively promoted the construction and expansion of fabs locally. China, which has been sanctioned by the United States, has accelerated its pace. Under the impact of geopolitical friction and the epidemic, China's semiconductor industry has entered an unprecedented period of rapid development in the past five years, and China's domestic chips have gradually entered the main stage. Not long ago, SEMI announced that China will lead the world in terms of 8-inch production capacity. Obviously, China is building the chip factory for tomorrow. So, how will China plan its domestic semiconductor industry in the next five years? Can it achieve new breakthroughs that will shock the world in five years? What is the biggest difficulty in developing the domestic semiconductor industry in China at present?
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Yeah, exactly brother, that is what I believe is the correct strategy to follow for the Chinese IC industry.
Get close to the leading edge, but do not work too hard to get to the leading edge.
The problem with the leading edge, it just takes too much money to sustain.
There is the curious point about IC today. The structure of the industry, or in Clausewitz terms, the battlefield.
1. The leading edge is the most capital intensive in exponential amounts. And much of that output is sold to China. Not sure what the point is for China to rush to the leading edge, when those companies at the leading edge have to sell it to China regardless.
2. It would be easier and faster to develop all of the mature nodes for China, the complete supply chain. It is like a horse race. There are the leaders, then there are the horses not running in front, but keeping pace waiting to make its move later in the race.
That is how this game is being played. Or this is the structure of the industry. Or this is the battlefield. Misinterpret what we see on the battlefield, and the results could be fatal. That trade war was a joke. Yet they did it.
It is very interesting. Because everyone believes they got the other side exactly where they want them. The leaders want China chasing them. China wants to be close, but not actively challenging for the lead neck to neck.
If recent history is any guide, China is pretty sure how this race will turn out. President Trump will be so mad!
Bigly!
@horse bro good day!!!! Yup ! China has a plan, The Made in China strategy, the US had a counter plan straight from a thesis of Miss Curseula Von der Lying which is Ban everything. Your analysis of Trump is straight on, when he win, he will do a Nixon and proclaim that he save the world from a devastating War with China and Made America Great Again with More Chip import for our beloved Iphone....lolYeah, exactly brother, that is what I believe is the correct strategy to follow for the Chinese IC industry.
Get close to the leading edge, but do not work too hard to get to the leading edge.
The problem with the leading edge, it just takes too much money to sustain.
There is the curious point about IC today. The structure of the industry, or in Clausewitz terms, the battlefield.
1. The leading edge is the most capital intensive in exponential amounts. And much of that output is sold to China. Not sure what the point is for China to rush to the leading edge, when those companies at the leading edge have to sell it to China regardless.
2. It would be easier and faster to develop all of the mature nodes for China, the complete supply chain. It is like a horse race. There are the leaders, then there are the horses not running in front, but keeping pace waiting to make its move later in the race.
That is how this game is being played. Or this is the structure of the industry. Or this is the battlefield. Misinterpret what we see on the battlefield, and the results could be fatal. That trade war was a joke. Yet they did it.
It is very interesting. Because everyone believes they got the other side exactly where they want them. The leaders want China chasing them. China wants to be close, but not actively challenging for the lead neck to neck.
If recent history is any guide, China is pretty sure how this race will turn out. President Trump will be so mad!
Bigly!
While waiting for its EUVL , China had develop other equipment needed to produce 5nm Chips and here is one of them, an obscure Chinese Company in the name of China Great Wall , has launched a fully automatic 12-inch wafer laser slotting equipment supporting ultra-thin wafer cutting process. Now for me this is a surprise, never heard the company until now and we have just scratch the surface so to speak.
Apr 6, 2022 — Minimum 5nm, China Great Wall announced the launch of fully automatic 12-inch wafer laser grooving equipment ... Fully automatic 12-inch wafer ...
Minimum 5nm, China Great Wall announced the launch of fully automatic 12-inch wafer laser grooving equipment
2022-06-02 15:57 HKTIT House April 6 news, today, China Great Wall official micro announced that the company's Zhengzhou Rail Transit Information Technology Research Institute, based on the experience and basis of the development of semiconductor laser invisible wafer cutting equipment, has launched a new technology that supports full cutting of ultra-thin wafers. Fully automatic 12-inch wafer laser grooving equipment for the process .
According to reports, in addition to the conventional laser grooving function, the device also supports 5nm DBG process , ultra-thin wafer full cutting function below 120 microns, fab IGBT process side related processes and TAIKO ultra-thin ring cutting and other high-precision end process.
IT House learned that the Great Wall of China official stated that the modular design of the device can support lasers with different pulse widths (nanosecond, picosecond, femtosecond). The self-developed optical system can realize continuous adjustment of the width and length of the spot. With the high-precision motion control platform and other technologies, it is combined with the laser stealth cutting equipment to solve the problems of laser stealth cutting equipment on surface material, thickness, crystal orientation and resistivity. Limit, help control product breakage rate and improve chip yield.
VeriSilicon: The company is one of the first companies in mainland China to join the UCIe Alliance
Jiwei Net News (Text / Chen Wei) On June 2, VeriSilicon pointed out in the latest investor relations activity that Chiplet is one of the important development trends in the semiconductor industry. development plays an important role in promoting. UCIe will have the opportunity to establish a unified interconnection standard between Chiplets for the development of Chiplets, promote the development of an open Chiplet ecosystem, and will make it easier for Chiplet concepts to fall into actual chip designs. At present, the company has become one of the first companies in mainland China to join the UCIe Alliance.
It is understood that VeriSilicon has a wealth of processor IP and leading chip design capabilities, and the company has established long-term cooperative relationships with the world's mainstream packaging and testing manufacturers and chip manufacturers, so it is very suitable for launching the Chiplet business. The company's recently launched high-end application processor platform is designed using Chiplet's architecture. This high-end application processor platform only took 12 months from definition to tapeout. In May 2021, the engineering sample has been returned to the film and was successfully lit on the same day. Linux/Chromium operating system, YouTube and other applications are in the engineering sample. has been running smoothly. This high-end application processor platform also integrates many of the company's IP, including the company's neural network processor NPU, image signal processor ISP, video processor VPU, audio digital signal processor and display controller.
Do you think there will be more companies surprising the world's bashers with new Chinese chip technology?@horse bro good day!!!! Yup ! China has a plan, The Made in China strategy, the US had a counter plan straight from a thesis of Miss Curseula Von der Lying which is Ban everything. Your analysis of Trump is straight on, when he win, he will do a Nixon and proclaim that he save the world from a devastating War with China and Made America Great Again with More Chip import for our beloved Iphone....lol
While waiting for its EUVL , China had develop other equipment needed to produce 5nm Chips and here is one of them, an obscure Chinese Company in the name of China Great Wall , has launched a fully automatic 12-inch wafer laser slotting equipment supporting ultra-thin wafer cutting process. Now for me this is a surprise, never heard the company until now and we have just scratch the surface so to speak.
Apr 6, 2022 — Minimum 5nm, China Great Wall announced the launch of fully automatic 12-inch wafer laser grooving equipment ... Fully automatic 12-inch wafer ...
Minimum 5nm, China Great Wall announced the launch of fully automatic 12-inch wafer laser grooving equipment
2022-06-02 15:57 HKT
IT House April 6 news, today, China Great Wall official micro announced that the company's Zhengzhou Rail Transit Information Technology Research Institute, based on the experience and basis of the development of semiconductor laser invisible wafer cutting equipment, has launched a new technology that supports full cutting of ultra-thin wafers. Fully automatic 12-inch wafer laser grooving equipment for the process .
According to reports, in addition to the conventional laser grooving function, the device also supports 5nm DBG process , ultra-thin wafer full cutting function below 120 microns, fab IGBT process side related processes and TAIKO ultra-thin ring cutting and other high-precision end process.
IT House learned that the Great Wall of China official stated that the modular design of the device can support lasers with different pulse widths (nanosecond, picosecond, femtosecond). The self-developed optical system can realize continuous adjustment of the width and length of the spot. With the high-precision motion control platform and other technologies, it is combined with the laser stealth cutting equipment to solve the problems of laser stealth cutting equipment on surface material, thickness, crystal orientation and resistivity. Limit, help control product breakage rate and improve chip yield.
Today, leading edge process is much more expensive than legacy process but the number of customers is small because very few companies can afford to manufacture at these nodes and the tradeoffs are not worth it.Yeah, exactly brother, that is what I believe is the correct strategy to follow for the Chinese IC industry.
Get close to the leading edge, but do not work too hard to get to the leading edge.
The problem with the leading edge, it just takes too much money to sustain.
There is the curious point about IC today. The structure of the industry, or in Clausewitz terms, the battlefield.
1. The leading edge is the most capital intensive in exponential amounts. And much of that output is sold to China. Not sure what the point is for China to rush to the leading edge, when those companies at the leading edge have to sell it to China regardless.
2. It would be easier and faster to develop all of the mature nodes for China, the complete supply chain. It is like a horse race. There are the leaders, then there are the horses not running in front, but keeping pace waiting to make its move later in the race.
That is how this game is being played. Or this is the structure of the industry. Or this is the battlefield. Misinterpret what we see on the battlefield, and the results could be fatal. That trade war was a joke. Yet they did it.
It is very interesting. Because everyone believes they got the other side exactly where they want them. The leaders want China chasing them. China wants to be close, but not actively challenging for the lead neck to neck.
If recent history is any guide, China is pretty sure how this race will turn out. President Trump will be so mad!
Bigly!
These tradeoffs include not only higher process, supply chain and equipment costs (for IDMs). For designers there are higher design costs, and reliance on external IP. Finally there's physical limitations: the smaller nodes for analog chips have higher noise from tightly packed digital circuits, and they can't handle higher voltage directly, they need power electronics to act as a level shifter from their internal CMOS voltage 0.9V to external I/O voltage.
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