Chinese semiconductor industry

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hullopilllw

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Giga Device officially joining the rank of Chinese domestic DRAM makers, making it the 4th after CXMT, UnilC and Tsinghua.

继合肥长鑫之后 兆易创新与Rambus达成内存专利协议:最快2021年量产

中国公司进军内存市场,美国内存专利授权公司Rambus(中文名蓝铂世)应该是最欢迎的,因为不到半个月时间,他们就收获了两家DRAM内存专利授权大客户——继合肥长鑫之后,兆易创新也跟Rambus签署协议,获得了后者的内存专利授权。

Rambus的大名很多DIY玩家都听说过,当年P4时代与Intel合作的RDRAM内存技术很先进,不过最后被AMD及其他厂商力推的DDR内存击败,Rambus退出了实体内存领域,专做内存授权了。

这十几年来,Intel、AMD、NVIDIA、高通、三星等公司先后都被Rambus拿下,签订了专利授权协议。如今中国公司也要进军内存市场了,专利授权也是绕不过去的,只要费用公平合理,金钱换市场是必然的,毕竟美国公司在这方面积累了太长时间了。

4月27日,合肥长鑫公司跟Rambus签署了内存授权协议,不过没有公布内存授权的具体内容。今天,Rambus又跟兆易创新签署了类似的协议,后者也获得了内存专利授权,同样没有公布具体金额。

兆易创新是国产存储芯片的龙头企业,不过之前主要是在NOR市场上,近年来也在积极进军内存市场,前两年还跟合肥长鑫签署了内存合作协议,共同研发19nm内存,兆易创新的创始人朱一鸣还是合肥长鑫的董事长。

不过合肥长鑫之前公布的股权结构来看,兆易创新没有任何股份,除了部分高管重合之外,两家公司是独立运营的,否则也不会有两份Rambus授权了。

根据兆易创新之前发布的公告,去年底该公司融资33.2亿元,主要用于DRAM内存研发及产业化,最快2021年开始量产。

在募资公告中,兆易创新公布了这个项目的预计实施时间及整体进度安排,具体如下:

·2020年,兆易创新将启动首款DRAM芯片产品定义,包括市场定位、产品规格及芯片设计工艺。

·2020年,兆易创新将定义首款芯片的生产职称,并将经过验证后的设计开展流片试样,反复修改直至通过系统验证。

·2021年,对首款芯片试样进行封装测试,并送交系统芯片商进行功能认证,并最终通过客户验证。

·2021年,首款芯片通过验证之后进行小批量生产,测试成功后进行大批量生产。

·2022-2025年,进行新系列芯片研发及量产。
 

Hadoren

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I spent some time parsing through the
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and attempting to figure out their main target.

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. America wants to ban export of semiconductor equipment to Chinese foundries.

American semiconductor equipment companies include:
  • Applied Materials
  • Dupont
  • Lam Research
  • KLA-Tencor
My intuition is that this equipment is very important and harder to replace than I previously believed.

On the other hand, it's not like ASML, where you're producing stuff that's on the cutting edge of scientific discovery. There also appear to be non-American alternatives (sadly, all based on American allies).

However, I'm not sure to the extent that all American semiconductor equipment can be replaced. And we all know that if a machine is missing one part, it doesn't work.

I'm not an expert on this and would like to ask those who are knowledgeable about this issue:

Can American semiconductor equipment be replaced?
 

Hendrik_2000

Lieutenant General
I spent some time parsing through the
Please, Log in or Register to view URLs content!
and attempting to figure out their main target.

Please, Log in or Register to view URLs content!
. America wants to ban export of semiconductor equipment to Chinese foundries.

American semiconductor equipment companies include:
  • Applied Materials
  • Dupont
  • Lam Research
  • KLA-Tencor
My intuition is that this equipment is very important and harder to replace than I previously believed.

On the other hand, it's not like ASML, where you're producing stuff that's on the cutting edge of scientific discovery. There also appear to be non-American alternatives (sadly, all based on American allies).

However, I'm not sure to the extent that all American semiconductor equipment can be replaced. And we all know that if a machine is missing one part, it doesn't work.

I'm not an expert on this and would like to ask those who are knowledgeable about this issue:

Can American semiconductor equipment be replaced?

There are plenty of alternative Naura just release their quarterly figur and it jump 30% . There are many semi conductor equipment supplier But in the past they have trouble landing a sale because most fab prefer more established maker which deprived them sale and know how that the FAB has. But now it change with the coming embargo the domestic Fab has no choice but to buy from domestic equipment supplier Now they are willing to work together and fund the R&D with domestic supplier

NAURA announced R&D invesmet of 2.1 billion yuan to enter the 7/5nm semiconductor manufacturing equipment market
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Domestic manufacturers entered the 7nm, 5nm semiconductor manufacturing equipment market, investing 2.1 billion R & D - super Meng Xianrui network of 6-7 minutes of domestic manufacturers to enter the 7nm, 5nm semiconductor manufacturing equipment market, R & D investment and 2.1 billion 2019-4-24 18:15 | author: Meng Xianrui | keywords: North CRE, semiconductor, etching machine, 5nm 7nm domestic semiconductor equipment manufacturer

Zhonghua Huachuang has developed well in recent years and has been able to provide 28nm process manufacturing equipment. The company today released its 2018 annual report, with revenue of 3.32 billion yuan, a 50% year-on-year increase, and a net profit growth of 86%. In addition, the company also announced a fundraising of 2.1 billion yuan, mainly for the next generation of semiconductor manufacturing equipment research and development, focusing on 7nm, 5nm process semiconductor manufacturing equipment.
In the field of semiconductors, most people are concerned about "stars" such as nm processes, memory chips, lithography machines, etc. However, as far as the domestic semiconductor industry as a whole is concerned, in addition to the lack of advanced technology, domestically rely heavily on semiconductor manufacturing equipment. Foreign manufacturers, although China is already the world's second largest semiconductor equipment market, but in this field,

US Applied Materials, KLA Kelei Semiconductor is the world's leading manufacturer, domestic semiconductor manufacturers are still inseparable from these manufacturers. The domestic semiconductor equipment manufacturer Zhonghua Huachuang has developed well in recent years and has been able to provide 28nm process manufacturing equipment. The company today released its 2018 annual report, with revenue of 3.32 billion yuan, a 50% year-on-year increase, and a net profit growth of 86%.
In addition, the company also announced a fundraising of 2.1 billion yuan, mainly for the next generation of semiconductor manufacturing equipment research and development, focusing on 7nm, 5nm process semiconductor manufacturing equipment. We used to sell the CPU in the sand, why sell it so expensive? The super-energy class article describes the manufacturing process of semiconductor chips in detail.

Among them, photolithography is the most important, which determines the process technology of the chip. The cost is also the highest , which can account for about 1/3 of the manufacturing cost.
However, in addition to lithography, semiconductor manufacturing has other complicated processes, including etching, cleaning, ion implantation, grinding, etc. The equipment produced by North Huachuang involves etching machine, PVD physical vapor deposition, CVD chemical vapor deposition, and thin film equipment. , cleaning equipment, etc. According to the official introduction,

North Huachuang is mainly engaged in the research and development, production, sales and technical services of basic electronic products. The main products are electronic process equipment and electronic components. It is a domestic mainstream high-end electronic technology equipment supplier, and is also an important high-precision, high-tech Reliable electronic components production base.

The main products of electronic process equipment include semiconductor equipment, vacuum equipment and lithium battery equipment. They are widely used in integrated circuits, semiconductor lighting, power devices, MEMS, advanced packaging, photovoltaic materials and batteries, flat panel displays, vacuum electronics, New materials, lithium-ion batteries and other fields.

The main products of electronic components include high-precision electronic components such as resistors, capacitors, crystal devices, microwave components, module power supplies, hybrid integrated circuits, etc., which are widely used in high-precision, precision and sharp special industries such as precision instrumentation and automatic control. Today, North Huachuang released its annual report for 2018. The annual revenue was 3.324 billion yuan, a year-on-year increase of 49.53%. The net profit of the main company was 234 million yuan, an increase of 86.05%. The net profit of non-home return was 76 million yuan, a year-on-year increase of 136.77%.
At present, electronic process equipment has become the main revenue of North Huachuang. The revenue in 2018 was 2.521 billion yuan, an increase of 75.7% year-on-year, accounting for more than 75%.
At the technical level, 28 nanometer equipment supply capability has been formed in the field of integrated circuits, 14 nanometer process equipment has entered the customer process verification stage, 12 吋 etching machine, PVD, ALD, monolithic annealing system and LPCVD equipment have entered the mainstream of integrated circuits. factory.

In addition, North China Ventures also raised 2.1 billion yuan through funds and other channels at the beginning of this year, mainly for the development of new generation semiconductor equipment, mainly to build integrated circuit equipment innovation center building and purchase 5/7nm key test equipment and build test and verification platform. Developed 5/7nm key integrated circuit equipment and realized industrial application. It is expected to realize 30 sets of annual etching equipment, 30 sets of PVD equipment, 15 sets of single-piece annealing equipment, 30 sets of ALD equipment, and 30 sets of vertical furnace equipment. 30 sets of cleaning equipment; the industrialization of high-precision electronic components is expected to increase by 241.96 million yuan, mainly to achieve an annual output of 58,000 modules.
 
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Hendrik_2000

Lieutenant General
AMEC Introduces the Primo Nanova® System - Company's First ICP Etch Product for Chipmakers' most Advanced Memory and Logic Device Designs
NEWS PROVIDED BY
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Mar 12, 2018, 11:00 ET

SHANGHAI, March 12, 2018 /PRNewswire/ -- This week at SEMICON China,
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. (AMEC) formally unveiled the Primo nanova® system (nanova) - the company's first inductively coupled plasma (ICP) etcher for high-volume front-end production of memory and logic ICs. The system combines proprietary ICP technology innovations and novel features to help customers achieve application imperatives like tight critical dimension (CD) uniformity and superior control. Key differentiations include a specialized symmetric chamber configuration that enables very high pumping speed, as well as a novel low-capacitive coupling coil design, and a temperature-controlled multiple-zone electrostatic chuck (ESC). With these and other unique features, the system delivers superior process performance for critical conductor and dielectric etch applications at device nodes of 5nm and below, at a cost of ownership (CoO) that is significantly lower than comparative tools.
[IMG]

AMEC’s Primo nanova® ICP etch system
AMEC has received orders for the nanova system from multiple customers. Products have been shipped and the first tool is already in production and demonstrating very stable yield. The company is now accelerating demo requests. The system strengthens AMEC's portfolio of etch tools which includes multi-generation capacitively coupled plasma (CCP) dielectric and TSV etch product families.

The nanova system was engineered to address today's IC manufacturing complexities where new materials, new transistor structures, double and even quadruple patterning, and other technology advancements are helping to ensure continued device shrinks. Critical success imperatives for etch in this processing environment are high uniformity and superior control across the wafer, with wide process window. The nanova system meets these technical requirements in a cost-effective single-station chamber tool.

"The nanova system deploys today's most advanced etch technology to empower customers at the leading edge with enabling innovation and exceptional flexibility," said Dr. Tom Ni, VP and GM of AMEC's Etch Product Business Group. "The system can process diverse conductor etch applications, like STI, poly-gate, spacer, mask etching and etch-back, with industry-leading productivity and superior on-wafer performance. As an ICP-based technology, it can etch deep vertical holes, as well as shallow tapered features. It's a cost-competitive solution as well, thanks to a smaller-than-average footprint and an innovative design that reduces consumables use. We're excited to see customers already benefiting from the tool."

The Primo nanova System: Key Enabling Attributes and Advantages

The six-chamber tool with two load lock strippers features proprietary innovations that collectively enable higher productivity and greater throughput. They include:

  • A proprietary low-capacitive coupling coil design that enables more independent ion density and energy which is essential for higher selectivity and soft etch;
  • A symmetric chamber design featuring a multi-zone ESC and active-edge tilting control for better uniformity. AMEC engineered the design to overcome side-to-side non-uniformity which has been a persistent challenge in high-volume manufacturing;
  • Wide process window and precise localized profile control with significantly higher pumping speed when compared to similar products;
  • Innovative plasma-enhanced PVD coating, coupled with precise chamber wall temperature and superior chamber environment control for greater process stability and defect reduction.
Dr. Ni further noted: "Feedback from customers confirms that the nanova system delivers the on-wafer performance and productivity we intended, and with compelling CoO benefits. It's a flexible tool that is equipped to process diverse applications with minimal configuration adjustments."

Primo nanova is a trademark of Advanced Micro-Fabrication Equipment Inc.

Advanced Micro-Fabrication Equipment Inc. (AMEC)
AMEC is China's leading provider of advanced process technology to global manufacturers of semiconductors and solid-state lighting (SSL) products. Headquartered in Shanghai, the company is an entrenched supplier of dielectric and TSV Etch tools, helping chipmakers build devices at process nodes as low as 7nm. To date, nearly 800 AMEC process units have been positioned at 40 leading-edge semiconductor fabs across Asia. The company is also well established in Europe with AMEC MEMS tools running in production at major IDMs. In addition, with its MOCVD system, the company helps SSL manufacturers build today's most advanced LED products. To learn more about AMEC, please visit
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.

SOURCE Advanced Micro-Fabrication Equipment Inc.
 

PikeCowboy

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Giga Device officially joining the rank of Chinese domestic DRAM makers, making it the 4th after CXMT, UnilC and Tsinghua.

继合肥长鑫之后 兆易创新与Rambus达成内存专利协议:最快2021年量产

中国公司进军内存市场,美国内存专利授权公司Rambus(中文名蓝铂世)应该是最欢迎的,因为不到半个月时间,他们就收获了两家DRAM内存专利授权大客户——继合肥长鑫之后,兆易创新也跟Rambus签署协议,获得了后者的内存专利授权。

Rambus的大名很多DIY玩家都听说过,当年P4时代与Intel合作的RDRAM内存技术很先进,不过最后被AMD及其他厂商力推的DDR内存击败,Rambus退出了实体内存领域,专做内存授权了。

这十几年来,Intel、AMD、NVIDIA、高通、三星等公司先后都被Rambus拿下,签订了专利授权协议。如今中国公司也要进军内存市场了,专利授权也是绕不过去的,只要费用公平合理,金钱换市场是必然的,毕竟美国公司在这方面积累了太长时间了。

4月27日,合肥长鑫公司跟Rambus签署了内存授权协议,不过没有公布内存授权的具体内容。今天,Rambus又跟兆易创新签署了类似的协议,后者也获得了内存专利授权,同样没有公布具体金额。

兆易创新是国产存储芯片的龙头企业,不过之前主要是在NOR市场上,近年来也在积极进军内存市场,前两年还跟合肥长鑫签署了内存合作协议,共同研发19nm内存,兆易创新的创始人朱一鸣还是合肥长鑫的董事长。

不过合肥长鑫之前公布的股权结构来看,兆易创新没有任何股份,除了部分高管重合之外,两家公司是独立运营的,否则也不会有两份Rambus授权了。

根据兆易创新之前发布的公告,去年底该公司融资33.2亿元,主要用于DRAM内存研发及产业化,最快2021年开始量产。

在募资公告中,兆易创新公布了这个项目的预计实施时间及整体进度安排,具体如下:

·2020年,兆易创新将启动首款DRAM芯片产品定义,包括市场定位、产品规格及芯片设计工艺。

·2020年,兆易创新将定义首款芯片的生产职称,并将经过验证后的设计开展流片试样,反复修改直至通过系统验证。

·2021年,对首款芯片试样进行封装测试,并送交系统芯片商进行功能认证,并最终通过客户验证。

·2021年,首款芯片通过验证之后进行小批量生产,测试成功后进行大批量生产。

·2022-2025年,进行新系列芯片研发及量产。

3rd right? Unilc = tsinghua?
 

localizer

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TW going extreme lengths to beg US for protection


“This is not how a responsible global corporate citizen behaves. We must amend our rules exploited by Huawei and HiSilicon and prevent U.S. technologies from enabling malign activities contrary to U.S. national-security and foreign-policy interests,” said Commerce Secretary Wilbur Ross in his
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Look at this arrogant comment.

This will all fail. Any attempts to block tech will only strengthen competitors and encourage independent supply chains.
 
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Skywatcher

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TW going extreme lengths to beg US for protection




Look at this arrogant comment.

This will all fail. Any attempts to block tech will only strengthen competitors and encourage independent supply chains.
By 2023, Intel claims it'll introduce its 5nm.

Assuming the current 4-5 year for SMIC (and 7 for Changchun Institute regarding lithographic etching) lag behind global state of the art, SMIC will probably also have 5nm in that timeframe.
 
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