Just supplying Chinese gov., banks, universtities and the PLA is more than enough to keep SMIC going, increasing sophistication and output especially with these earning results should mean more overseas customers quite soon in the future.
Chinese semiconductor industry
- Thread starter Hendrik_2000
- Start date
- Status
Just supplying Chinese gov., banks, universtities and the PLA is more than enough to keep SMIC going, increasing sophistication and output especially with these earning results should mean more overseas customers quite soon in the future.
We will need more information on this hardware. They claim to be CUDA compatible. So this suggests their own hardware and software stack unlike other GPUs recently announced which were basically desktop chips using Imagination Technologies PowerVR GPU designs.
I still think it is kind of crappy of them not to use SMIC. And porting chips between different processes and factories is not easy. If they get sanctioned, then moving the design to SMIC would take 18 months easily. And SMIC can also be sanctioned. Just like what happened with 14nm SoC they were making for Huawei. US will threaten SMIC with ban on sales of factory tools, parts and maintenance, materials, etc.
KX40000, server CPU. Announce soon.
I'm thinking of a $2,000 Iphone by 2025 and Brandon will blame the Russian for it.
1 day ago — TSMC Arizona fab unlikely to earn without government subsidies. Monica Chen, Taipei; Jessie Shen, DIGITIMES Wednesday 30 March 202
1 day ago — TSMC Arizona fab unlikely to earn without government subsidies. Monica Chen, Taipei; Jessie Shen, DIGITIMES Wednesday 30 March 202
Moore Threads was founded in October 2020, so 18 months ago. It’s unlikely that it would take them the same amount of time to move design from one fab to another as to develop it.
I am attaching my latest article on SMIC. It is an extended version for subscribers (readers here see it free) and was published yesterday. An abridged (cut-down) version will come out on the Internet in the next few days.
So I welcome comments from readers on this article in case it needs to be modified for the public on the internet. Remember Seeking Alpha articles are reviewed and edited, so I need to be careful.
So I welcome comments from readers on this article in case it needs to be modified for the public on the internet. Remember Seeking Alpha articles are reviewed and edited, so I need to be careful.
@tinrobert thanks for your effort Sir, appreciated!
Huawei confirmed the chip stacking technology for the first time, and HiSilicon independently upgraded from the 2012 laboratory to a first-level department
On March 28, Huawei released the 2021 annual report, which listed the latest business structure diagram. HiSilicon was independent from the second-level department under the 2012 laboratory and upgraded to Huawei's first-level department. Guo Ping, Huawei's rotating chairman, said that using area for performance and stacking for performance, so that less advanced processes can continue to make Huawei competitive in future products...
Huawei confirms chip stacking technology for the first time
In the consumer business, Guo Ping said that Huawei is focusing on expanding into new areas such as wearables and whole-house intelligence. According to the data disclosed in Huawei's financial report, Huawei's watch and bracelet shipments ranked first in the world in the third quarter of 2021. By the end of 2021, the cumulative global shipment of Huawei's smart wearable devices has exceeded 100 million; in terms of whole-house intelligence, Huawei recently released Yu Chengdong, CEO of Huawei's consumer business, also announced that it will open 500 whole-house smart stores this year.
In the mobile phone business, Huawei will continue to promote theoretical breakthroughs, architecture reconstruction, and software reconstruction of three reconstructions. In terms of basic theory, explore the theoretical essence of computing and communication, and break through the bottleneck of industrial evolution; in architecture design, it does not rely on single-point optimization to promote the construction of the overall competitiveness of the system; in software, it takes root in the core capabilities of software and reconstructs the core foundation software stack.
How to solve the "stuck neck" problem of Huawei chips? Guo Ping, Huawei's rotating chairman, said that using area for performance and stacking for performance will enable less advanced processes to continue to make Huawei competitive in future products. This is the first time Huawei has publicly confirmed the chip stacking technology. That is to say, higher performance can be exchanged by increasing the area and stacking, so as to achieve the competitiveness of low-tech processes to catch up with high-performance chips.
In May last year, a Huawei patent titled "A Synchronization Method for Chips and Related Devices" was exposed online. Many people infer that Huawei seems to be seeking to use dual-core stacking technology to solve current chip problems.
In the mobile phone business, Huawei will continue to promote theoretical breakthroughs, architecture reconstruction, and software reconstruction of three reconstructions. In terms of basic theory, explore the theoretical essence of computing and communication, and break through the bottleneck of industrial evolution; in architecture design, it does not rely on single-point optimization to promote the construction of the overall competitiveness of the system; in software, it takes root in the core capabilities of software and reconstructs the core foundation software stack.
How to solve the "stuck neck" problem of Huawei chips? Guo Ping, Huawei's rotating chairman, said that using area for performance and stacking for performance will enable less advanced processes to continue to make Huawei competitive in future products. This is the first time Huawei has publicly confirmed the chip stacking technology. That is to say, higher performance can be exchanged by increasing the area and stacking, so as to achieve the competitiveness of low-tech processes to catch up with high-performance chips.
In May last year, a Huawei patent titled "A Synchronization Method for Chips and Related Devices" was exposed online. Many people infer that Huawei seems to be seeking to use dual-core stacking technology to solve current chip problems.
Thanks for posting the extended version of your article here
Btw a small correction. Should be $170 million/m here
Nice article. You got typos/thinkos on pages 4 and 7.
The major errors or omissions I notice in your article are:
TSMC has several 7nm processes. Some do not use EUV at all, and some use EUV for a couple of critical layers. SMIC's 7nm equivalent process is supposed to have similar performance to the TSMC 7nm processes without EUV. But TSMC 7nm with EUV in critical layers should still be better.
Huawei did, like you said, manufacture 14nm SoCs for smartphones at SMIC after they got banned from making 7nm SoCs at TSMC. But as far as I know the US threatened to sanction SMIC if they continued doing it. So SMIC stopped making chips for Huawei. I think.
- Status