This explains that one LPP design shared a while back where they used two obliquely positioned beams for the tin droplet excitation. If anyone can get the full paper I’d be interested in diving into the details.
Chinese semiconductor thread II
- Thread starter vincent
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Phase II acceptance of a 12-inch advanced packaging project in Shanghai
Shanghai IBO Semiconductor Co., Ltd. has received good news that its Phase II advanced packaging and testing project, "Annual production of 180,000 pieces of advanced wafer-level integrated circuit packaging project (Phase II)", has successfully completed acceptance. The completion of this project will further increase the company's factory's design capacity to 180,000 pieces/year, injecting new vitality into the development of my country's integrated circuit industry.
It is reported that the construction site of the project is located at No. 959, Baoan Road, Baoshan District, Shanghai, Gucun Town, Baoshan District, Shanghai. It is an expansion based on the existing Phase I project. The Phase II project was approved on February 14, 2023, and officially started on March 1, 2024. After intensive construction, it entered the commissioning stage on July 20, 2024, and the final commissioning report was announced at the end of October 2024.
The total investment of the "Annual Production of 180,000 Pieces of Advanced Wafer-Level Integrated Circuit Packaging Project" is RMB 746 million, and the overall construction is divided into two phases. Among them, the first phase project has an investment of RMB 500 million, and the planned annual production capacity is 60,000 12-inch wafers; the actual investment of the second phase project is RMB 146 million, and the planned annual production capacity is 120,000 12-inch wafers. Although the actual investment of the second phase project is RMB 100 million less than the planned investment amount, through scientific management and efficient construction, the project still progressed smoothly and successfully achieved the expected production capacity target.
As an important enterprise in my country's integrated circuit packaging field, the successful acceptance of the second phase of the advanced packaging and testing project not only marks another breakthrough in the company's technological innovation and production capacity, but will also play a positive role in promoting the development of my country's integrated circuit industry. In the future, Shanghai ICP Semiconductor Co., Ltd. will continue to increase its R&D investment, continuously improve product quality and technical level, and make greater contributions to the prosperity and development of my country's integrated circuit industry.
Tianjin WeiCe Semiconductor opened for business
The opening ceremony of Tianjin Weice Semiconductor Technology Co., Ltd. was held in Xiqing Economic Development Zone. The project is the first R&D and testing base established in the north by Shanghai Weice Semiconductor Technology Co., Ltd., a leading independent third-party integrated circuit testing service provider in China. The investor, Shanghai Weice Semiconductor Technology Co., Ltd., was established in 2016 with a registered capital of 113.3 million yuan. It is a national-level specialized and innovative small giant enterprise and a national-level high-tech enterprise. It was officially listed on the Science and Technology Innovation Board in October 2022 and is a leading independent third-party integrated circuit testing service provider in China. Major customers include: Tsinghua Unigroup, ZTE Microelectronics, SMIC, Wuhan Xinxin, Changdian Technology, etc. In 2023, Weice Group's revenue exceeded 700 million yuan.
The new Xiqing project is expected to be officially put into operation in November 2024, creating the Northern Semiconductor Testing R&D Center of Weice Technology, providing wafer testing and finished product testing services. As a leading company in the semiconductor testing industry, the entry of Weice Technology not only adds strong momentum to the integrated circuit industry chain of Xiqing Economic Development Zone, but also is an important achievement of Xiqing Economic Development Zone in deeply implementing the "three new" and "three quantities" development concepts. With this settlement, Weice Technology will rely on its world-leading technical strength and R&D capabilities, focus on wafer testing and finished product testing services, and inject new vitality into the integrated circuit industry upgrade and economic development of Xiqing Economic Development Zone.
My SMIC Q3 earnings call notes
$2.1B revenue (all time high), up 14% QoQ and 20.5% Margin, Profit $170m
Expect 2% growth QoQ in revenue with 18-20% Margin
Domestic customers restocked and built up inventories to increase market share.
Foreign customers slowed down due to geopolitics (& tariffs?), they shifted some orders to Q2.
Price for 12-inch wafer increased -> blended ASP increased (more 12-inch, less 8-inch in mix)
BCD demand remains high due to AI including AIOT (like on TV & 3C) for power control
Added 21k wpm (high value added value) added in Q3 increased blended ASP.
Could not complete all the Q3 demand so had to extend delivery. Q4 is normally light quarter.
Expecting 8-inch equivalent capacity to reach 958k by end of the year.
837k in Q2, 884k in Q3 to ~950k in Q4
Adding 51k 12-inch wafer in Q3 and Q4 (works out to be ~115k 8-inch)
Accelerated deployment of power device to support NEV industry.
SMIC’s goal is to captured 1/3 of semi fab orders transferred to China from Chinese OEMs that
onshore a portion of their supply chain to domestic fabs.
Each fab must do at least 3 process node (28, 40, 65nm for example)
For each process node, can do it well across different platforms (HV, MCU, BCD, CMOS, DDIC, LCD driver)
In terms of overcapacity, ideal to be 85% utilization industry wide, but industry is at 70%
But SMIC itself is not having enough capacity as it’s utilization is at 90%
In order to win customer, needs to make sure it can fulfill all the need of customers.
$2.1B revenue (all time high), up 14% QoQ and 20.5% Margin, Profit $170m
Expect 2% growth QoQ in revenue with 18-20% Margin
Domestic customers restocked and built up inventories to increase market share.
Foreign customers slowed down due to geopolitics (& tariffs?), they shifted some orders to Q2.
Price for 12-inch wafer increased -> blended ASP increased (more 12-inch, less 8-inch in mix)
BCD demand remains high due to AI including AIOT (like on TV & 3C) for power control
Added 21k wpm (high value added value) added in Q3 increased blended ASP.
Could not complete all the Q3 demand so had to extend delivery. Q4 is normally light quarter.
Expecting 8-inch equivalent capacity to reach 958k by end of the year.
837k in Q2, 884k in Q3 to ~950k in Q4
Adding 51k 12-inch wafer in Q3 and Q4 (works out to be ~115k 8-inch)
Accelerated deployment of power device to support NEV industry.
SMIC’s goal is to captured 1/3 of semi fab orders transferred to China from Chinese OEMs that
onshore a portion of their supply chain to domestic fabs.
Each fab must do at least 3 process node (28, 40, 65nm for example)
For each process node, can do it well across different platforms (HV, MCU, BCD, CMOS, DDIC, LCD driver)
In terms of overcapacity, ideal to be 85% utilization industry wide, but industry is at 70%
But SMIC itself is not having enough capacity as it’s utilization is at 90%
In order to win customer, needs to make sure it can fulfill all the need of customers.
6 inch AlN single crystal substrate. Growing large area single crystal for these next gen wide-bandgap semi substrates is extremely difficult. The state of art for AlN, GaO and diamond seems to be 4 inch
This has always been the expectation, and also why its also in China's interest to concentrate all non-mainland fab business into TSMC, as is currently happening.
Taiwan like to call TSMC their silicon shield, what it actually is is China's silicon hostage. In the ideal scenario where China has zero business with TSMC while the entire western world is dependant on TSMC, their only choice reduces to allow peaceful unification with TSMC under Chinese control, or lose TSMC and watch China gain total semiconductor monopoly.
SMIC revenue is up 34% year on year and net profit is up 58%
The Shanghai-based chipmaker said its third-quarter revenue rose 34 per cent from a year earlier to US$2.17 billion.
Net profit for the quarter reached US$148.8 million, up 58.3 per cent from a year earlier.
China output of integrated circuits up 26% in the first three months
China’s output of integrated circuits – a broad measure of semiconductor products – expanded 26 per cent to 315.6 billion units in the first three quarters of 2024, according to the National Bureau of Statistics.
The Shanghai-based chipmaker said its third-quarter revenue rose 34 per cent from a year earlier to US$2.17 billion.
Net profit for the quarter reached US$148.8 million, up 58.3 per cent from a year earlier.
China output of integrated circuits up 26% in the first three months
China’s output of integrated circuits – a broad measure of semiconductor products – expanded 26 per cent to 315.6 billion units in the first three quarters of 2024, according to the National Bureau of Statistics.
Beijing Ingenic: 21nm DRAM products are expected to be launched by the end of the year, and 20nm will be available next year
Recently, Beijing Junzheng said in an institutional survey that the company's DRAM products, all types of new products are under development, including DDR2, DDR3, LPDDR4, etc. In terms of technology, both 21nm and 20nm are under development. It is expected that 21nm will be launched by the end of this year, and 20nm is expected to be launched around the middle of next year. In the future, the company will continue to develop products with updated processes.
Microprocessor chips are platform-based chip products for smart hardware products, which can be applied to a wide range of product types. In recent years, Beijing Junzheng has gradually expanded its products such as printers, sweepers, and white appliances, and will continue to look for new application areas in the future; in the field of smart video, with the launch of C200, the company will be able to launch more market promotions in the pan-video field.