ACM Semiconductor Equipment (Shanghai) Co., Ltd. (hereinafter referred to as "ACM Shanghai") (Sci-Tech Innovation Board Stock Code: 688082), as a leading supplier of wafer process solutions for semiconductor front-end and advanced wafer-level packaging applications, today announced that its cleaning equipment product Ultra C Tahoe has achieved an important performance breakthrough. This upgrade can meet the stringent technical requirements of more advanced wafer foundry, logic devices and memory devices.
Ultra CTahoe's patented hybrid architecture is the first to combine a tank cleaning module and a single wafer cleaning chamber into the same SPM equipment. This architecture has stronger cleaning performance, higher production capacity and better process flexibility. In the medium and low temperature sulfuric acid (SPM) cleaning process, UltraCTahoe can achieve the effect of an independent single wafer cleaning equipment and reduce chemical consumption by up to 75%. According to Shanghai Shengmei's estimates, sulfuric acid alone can save up to $500,000 per year, and the treatment of sulfuric acid waste can further reduce costs and be more environmentally friendly.
Dr. Wang Hui, Chairman of Shengmei Shanghai, said: “As artificial intelligence continues to move closer to consumers’ lives, we expect the public to pay more and more attention to the impact of semiconductor chip manufacturing on environmental pollution.
We believe that SCM Shanghai's UltraCTahoe can help customers increase the production of advanced AI chips while reducing environmental impact. SCM Shanghai has a creative R&D team, and UltraCTahoe once again witnessed the team's excellent performance. We believe that the Tahoe platform is fully capable of occupying an important position in the SPM medium and low temperature application field, which accounts for about 20% of the entire cleaning market.
New features and benefits of the upgraded UltraCTahoe:
1. Stronger particle removal performance: The Tahoe platform has strong cleaning capabilities, achieving an average particle count of less than 6 in the 26nm particle test, which can meet the stringent requirements of advanced node manufacturing. In the future, the equipment will add a more sophisticated particle filtration system that can remove 1x nanometer particles, which can be used for cutting-edge logic and memory applications.
2. Higher capacity: The upgraded 25-slot slot module (previously 13 slots) and 9 single-wafer chambers (previously 8 chambers) have an hourly capacity of more than 200 wafers, which can be compared with the 12-cavity comparable to SPM system.
3. Better cost control and environmental protection level: UltraCTahoe can reduce sulfuric acid consumption by up to 75%, thereby reducing large-scale manufacturing costs and meeting increasingly stringent environmental regulations to achieve sustainable development goals.
4. Wider process applications: 30+ production layers have been certified, including key production processes such as lightly doped drain (LDD) and source/drain (SD), and more layers and applications are under development.
5. More flexible single wafer cleaning applications: Optional configurations include new spray technology, ACM Shanghai’s patented SAPS/TEBO technology and HOTIPA drying technology, which improves the versatility of the equipment in a variety of process applications.
