A high-end optoelectronic device manufacturer has received over 100 million yuan in investment; its technology originates from Academician Luo Yi's team at Tsinghua University.
MEMS Consulting learned that on April 9, 2026, Huayi Yingfei, a developer of high-end optoelectronic devices, announced the completion of a Pre-A round of financing exceeding 100 million yuan. This round was led by Yuanhe Puhua, with strategic investors including Huagong Investment, Changfei Fund, Novartis Capital, and Yangtze River Venture Capital. Follow-on investors included the Beijing-Tianjin-Hebei Venture Capital Guidance Fund, Zhongguancun Capital, Yizhuang Science and Technology Innovation Phase II Fund, CMB International Capital, and Xinrongbang Capital.
Huayi Yingfei's core technology originates from Academician Luo Yi's team in the Department of Electronic Engineering at Tsinghua University. The company possesses independent innovative technologies across the entire process of chip design, material epitaxy, process technology, and packaging testing. It focuses on the research and development and production of products such as high-speed single-mode semiconductor laser chips, high-speed modulator integrated light sources, and high-speed, high-saturation photodetectors. Its products are widely used in 5G communications, broadband fiber optic networks, data transmission, artificial intelligence, and LiDAR.

According to publicly available data, the domestic production rate of optical chips for speeds of 2.5G and below exceeds 90%, and the domestic production rate of 10G optical chips is about 60%. However, the domestic production rate of high-end optical chips for speeds of 25G and above is only 4%, still dominated by overseas manufacturers. Huayi Yingfei's recent financing of over 100 million yuan is a crucial step in breaking through this "4% predicament."
The funds raised in this round will be used for the iteration of high-end optoelectronic chip products, capacity expansion, and cooperation with upstream and downstream partners in the industry chain, as well as to promote the verification and adoption of core products by downstream customers. Meanwhile, the Beijing Information Optoelectronic Chip Platform, jointly built by Huayi Yingfei and Beijing Lingchuang Optoelectronics, is expected to be fully commissioned and operational by June 2026.
Huayi Yingfei's core technology originates from Academician Luo Yi's team in the Department of Electronic Engineering at Tsinghua University. The company possesses independent innovative technologies across the entire process of chip design, material epitaxy, process technology, and packaging testing. It focuses on the research and development and production of products such as high-speed single-mode semiconductor laser chips, high-speed modulator integrated light sources, and high-speed, high-saturation photodetectors. Its products are widely used in 5G communications, broadband fiber optic networks, data transmission, artificial intelligence, and LiDAR.

According to publicly available data, the domestic production rate of optical chips for speeds of 2.5G and below exceeds 90%, and the domestic production rate of 10G optical chips is about 60%. However, the domestic production rate of high-end optical chips for speeds of 25G and above is only 4%, still dominated by overseas manufacturers. Huayi Yingfei's recent financing of over 100 million yuan is a crucial step in breaking through this "4% predicament."
The funds raised in this round will be used for the iteration of high-end optoelectronic chip products, capacity expansion, and cooperation with upstream and downstream partners in the industry chain, as well as to promote the verification and adoption of core products by downstream customers. Meanwhile, the Beijing Information Optoelectronic Chip Platform, jointly built by Huayi Yingfei and Beijing Lingchuang Optoelectronics, is expected to be fully commissioned and operational by June 2026.


