Thanks for clarifying. Considering it was in 2020 he was impressively correct.Havok is insider and he posted the roadmap of DUVi that matches ASML 1980di in year 2025
Thanks for clarifying. Considering it was in 2020 he was impressively correct.Havok is insider and he posted the roadmap of DUVi that matches ASML 1980di in year 2025
Thanks for clarifying. Considering it was in 2020 he was impressively correct.
People forget the sheer scale of China and what allows the country to be so strong in these fields.Volkswagen CEO specifically requested to learn from China: Chinese people are very methodical and have extremely strong execution capabilities.
- Chinese players produced 60% of the thermal image sensors sold worldwide in 2024. The defense & aerospace segment is projected to reach nearly $4 billion by 2030, with a significant demand for integration in light UAVs.
This is somewhat darkly humorous, beacause it's more or less related to the pandemic.
An explosion of IR imaging sensors in China. Article classified the products by wavelength. In light of the F-35 incident, cooled MWIR and LWIR sensors would be particularly relevant here. Chinese companies already dominate uncooled SWIR and LWIR markets globally. Materials and tools for IR sensors are very different from the silicon based semi, and China is dominant in several of them (In, Ga, Te)
Do you have a source for this? I can't find this online and I'm skeptical that Ascend 950 is on a 3nm process considering that it seems SMIC only got to 6nm fairly recently and I'm kinda skeptical Huawei would be able to trick TSMC into fabbing a lot of chips for them again.Huawei Unveils AI Accelerator Ascend 950 with 3x H20 Performance: Achieving NVIDIA H200 Levels Possible with 3nm and HBM3 Application
The Ascend 950, combining a 3nm process with HBM3, has become powerful enough to be called the **"Chinese version of the H200"**.
Carbon Nanotube (CNT) Semiconductor: This is the most groundbreaking aspect. It has already been verified at the laboratory level and is currently being optimized for SMIC's production lines. If successful, it could become a "game changer" capable of overcoming the physical limitations of existing silicon chips and demonstrating energy efficiency exceeding that of the H200.